System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Turn your R code into packages that others can easily download and use. This practical book shows you how to bundle reusable R functions, sample data, and documentation together by applying author Hadley Wickham’s package development philosophy. In the process, you’ll work with devtools, roxygen, and testthat, a set of R packages that automate common development tasks. Devtools encapsulates best practices that Hadley has learned from years of working with this programming language. Ideal for developers, data scientists, and programmers with various backgrounds, this book starts you with the basics and shows you how to improve your package writing over time. You’ll learn to focus on what you want your package to do, rather than think about package structure. Learn about the most useful components of an R package, including vignettes and unit tests Automate anything you can, taking advantage of the years of development experience embodied in devtools Get tips on good style, such as organizing functions into files Streamline your development process with devtools Learn the best way to submit your package to the Comprehensive R Archive Network (CRAN) Learn from a well-respected member of the R community who created 30 R packages, including ggplot2, dplyr, and tidyr
During the past decade, tremendous growth has occurred in the use of nutrition symbols and rating systems designed to summarize key nutritional aspects and characteristics of food products. These symbols and the systems that underlie them have become known as front-of-package (FOP) nutrition rating systems and symbols, even though the symbols themselves can be found anywhere on the front of a food package or on a retail shelf tag. Though not regulated and inconsistent in format, content, and criteria, FOP systems and symbols have the potential to provide useful guidance to consumers as well as maximize effectiveness. As a result, Congress directed the Centers for Disease Control and Prevention (CDC) to undertake a study with the Institute of Medicine (IOM) to examine and provide recommendations regarding FOP nutrition rating systems and symbols. The study was completed in two phases. Phase I focused primarily on the nutrition criteria underlying FOP systems. Phase II builds on the results of Phase I while focusing on aspects related to consumer understanding and behavior related to the development of a standardized FOP system. Front-of-Package Nutrition Rating Systems and Symbols focuses on Phase II of the study. The report addresses the potential benefits of a single, standardized front-label food guidance system regulated by the Food and Drug Administration, assesses which icons are most effective with consumer audiences, and considers the systems/icons that best promote health and how to maximize their use.
Packaging Sustainability Take the lead with sustainable package design solutions The classic role of packaging is to “Protect, Inform, and Sell.” Today, packaging must do all that—but with minimal eco-impact. Packaging Sustainability: Tools, Systems, and Strategies for Innovative Package Design is a comprehensive guide to thinking outside the box to create practical, cost-effective, and eco-responsible packaging. With a broad range of contributions from pioneers of sustainability, Packaging Sustainability not only describes the concepts of sustainability but reveals the logic behind them, providing you with the tools to sift through and adapt to the ever changing barrage of materials, services, regulations, and mandates. The book: Enables the designer to make smart, informed decisions at all points throughout the packaging design process Offers a comprehensive overview of sustainable packaging design issues from leading practitioners, designers, engineers, marketers, psychologists, and ecologists Describes materials and processes in current use and helps the reader understand how they interconnect With solid information and actionable ideas, Packaging Sustainability gives you all the tools for maximizing a product’s shelf impact—while minimizing its ecological footprint.
An Essential Reference for Intermediate and Advanced R Programmers Advanced R presents useful tools and techniques for attacking many types of R programming problems, helping you avoid mistakes and dead ends. With more than ten years of experience programming in R, the author illustrates the elegance, beauty, and flexibility at the heart of R. The book develops the necessary skills to produce quality code that can be used in a variety of circumstances. You will learn: The fundamentals of R, including standard data types and functions Functional programming as a useful framework for solving wide classes of problems The positives and negatives of metaprogramming How to write fast, memory-efficient code This book not only helps current R users become R programmers but also shows existing programmers what’s special about R. Intermediate R programmers can dive deeper into R and learn new strategies for solving diverse problems while programmers from other languages can learn the details of R and understand why R works the way it does.
bull; Written by the creator of Webmin -- the most popular GUI admin tool for Linux bull; Webmin is currently downloaded 4000 times a day & -- nearly one million times of all versions in the last year! Shows how to use Webmin to configure Apache, Sendmail, and other complex Linux servers bull; Start developing your own Webmin modules and themes with the complete reference for the API
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
