Asymmetric Passive Components in Microwave Integrated Circuits

Asymmetric Passive Components in Microwave Integrated Circuits

Author: Hee-Ran Ahn

Publisher: John Wiley & Sons

Published: 2006-09-01

Total Pages: 308

ISBN-13: 0470036958

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This book examines the new and important technology of asymmetric passive components for miniaturized microwave passive circuits. The asymmetric design methods and ideas set forth by the author are groundbreaking and have not been treated in previous works. Readers discover how these design methods reduce the circuit size of microwave integrated circuits and are also critical to reducing the cost of equipment such as cellular phones, radars, antennas, automobiles, and robots. An introductory chapter on the history of asymmetric passive components, which began with asymmetric ring hybrids first described by the author, sets the background for the book. It lays a solid foundation with a chapter examining microwave circuit parameters such as scattering, ABCD, impedance, admittance, and image. A valuable feature of this chapter is a conversion table between the various circuit matrices characterizing two-port networks terminated in arbitrary impedances. The correct conversion has also never been treated in previous works. Next, the author sets forth a thorough treatment of asymmetric passive component design, which covers the basic and indispensable elements for integration with other active or passive devices, including: * Asymmetric ring hybrids * Asymmetric branch-line hybrids * Asymmetric three-port power dividers and N-way power dividers * Asymmetric ring hybrid phase shifters and attenuators * Asymmetric ring filters and asymmetric impedance transformers With its focus on the principles of circuit element design, this is a must-have graduate-level textbook for students in microwave engineering, as well as a reference for design engineers who want to learn the new and powerful design method for asymmetric passive components.


Passive RF Component Technology

Passive RF Component Technology

Author: Guo'an Wang

Publisher: Artech House

Published: 2012

Total Pages: 306

ISBN-13: 1608071995

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Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications.


Nano-Bio- Electronic, Photonic and MEMS Packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging

Author: C.P. Wong

Publisher: Springer Science & Business Media

Published: 2009-12-23

Total Pages: 761

ISBN-13: 1441900403

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Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.


More than Moore

More than Moore

Author: Guo Qi Zhang

Publisher: Springer Science & Business Media

Published: 2010-01-23

Total Pages: 338

ISBN-13: 0387755934

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In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.


Nano-Bio- Electronic, Photonic and MEMS Packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging

Author: C. P.(Ching-Ping) Wong

Publisher: Springer Nature

Published: 2021-03-17

Total Pages: 582

ISBN-13: 303049991X

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This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.


Technology of Integrated Circuits

Technology of Integrated Circuits

Author: D. Widmann

Publisher: Springer Science & Business Media

Published: 2000-07-06

Total Pages: 370

ISBN-13: 9783540661993

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Strongly involved with SIEMENS Corp. in the tremendous recent developments of process technologies for IC fabrication the authors comprehensively record their authoritative knowledge and practical experience. New materials , modern planar technology, process designs for CMOS, Bipolar, BICMOS and smart-power technologies, self-adjusting doping techniques are just a few of the highlights. With its strong application-orientation this is a need-to-have book for professionals in semiconductor industries. Senior students in electrical engineering and physics can use it as a textbook because of the systematic treatment of the subjects. With regard to their later careers as industrial engineers they will particularly appreciate the deep insight into the actual methods and problems of IC manufacturing.


SiP System-in-Package Design and Simulation

SiP System-in-Package Design and Simulation

Author: Suny Li (Li Yang)

Publisher: John Wiley & Sons

Published: 2017-07-14

Total Pages: 651

ISBN-13: 1119046009

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An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.


Materials for Advanced Packaging

Materials for Advanced Packaging

Author: Daniel Lu

Publisher: Springer

Published: 2016-11-18

Total Pages: 974

ISBN-13: 3319450980

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.