Geotechnical Applications
Geotechnical Applications

Author: Anirudhan I.V.

Publisher: Springer

Published: 2018-06-12

Total Pages: 325

ISBN-13: 9811303681

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This book comprises select proceedings of the annual conference of the Indian Geotechnical Society. The conference brings together research and case histories on various aspects of geotechnical engineering and geoenvironmental engineering. The book presents papers on geotechnical applications and case histories, covering topics such as (i) shallow and deep foundations; (ii) stability of earth and earth retaining structures; (iii) rock engineering, tunneling, and underground constructions; (iv) forensic investigations and case histories; (v) reliability in geotechnical engineering; and (vi) special topics such as offshore geotechnics, remote sensing and GIS, geotechnical education, codes, and standards. The contents of this book will be of interest to researchers and practicing engineers alike.

Scrap Tire Derived Geomaterials - Opportunities and Challenges
Scrap Tire Derived Geomaterials - Opportunities and Challenges

Author: Hemanta Hazarika

Publisher: CRC Press

Published: 2007-11-08

Total Pages: 414

ISBN-13: 0203929322

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SCRAP TIRE DERIVED GEOMATERIALS is a compilation of peer-reviewed papers presented at the International Workshop on Scrap Tire Derived Geomaterials (IW-TDGM 2007) in Yokosuka, Japan in March 2007.The workshop was the first ever international forum on scrap tire derived geomaterials (TDGM), bringing together people from various disciplines working i

Ground Improvement and Reinforced Soil Structures
Ground Improvement and Reinforced Soil Structures

Author: C. N. V. Satyanarayana Reddy

Publisher: Springer Nature

Published: 2021-07-27

Total Pages: 788

ISBN-13: 9811618313

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This volume comprises the select proceedings of the Indian Geotechnical Conference (IGC) 2020. The contents focus on recent developments in geotechnical engineering for sustainable tomorrow. The volume covers the topics related advances in ground improvement of weak foundation soils for various civil engineering projects and design/construction of reinforced soil structures with different fill materials using synthetic and natural reinforcements in different forms.

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

Author: Mohd Arif Anuar Mohd Salleh

Publisher: Springer Nature

Published: 2023-07-02

Total Pages: 873

ISBN-13: 9811992673

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This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

Ground Improvement Techniques
Ground Improvement Techniques

Author: Kasinathan Muthukkumaran

Publisher: Springer Nature

Published: 2022-12-07

Total Pages: 389

ISBN-13: 981196727X

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This book comprises the select peer-reviewed proceedings of the Indian Geotechnical Conference (IGC) 2021. The contents focus on Geotechnics for Infrastructure Development and Innovative Applications. The book covers topics related to ground improvement techniques, like stone columns, PVD, granular pile anchors, soil stabilization methods, like fly ash & chemicals, effect of biopolymer inclusion, innovative material for soil and ground improvement, among others. This volume will be of interest to those in academia and industry.