Evaluation Findings of Bondade CU-31 Bonding Solution

Evaluation Findings of Bondade CU-31 Bonding Solution

Author: Highway Innovative Technology Evaluation Center (U.S.)

Publisher: ASCE Publications

Published: 1998-01-01

Total Pages: 64

ISBN-13: 9780784474471

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Prepared by the Highway Innovative Technology Evaluation Center (HITEC), a CERF Service Center. The report describes a HITEC evaluation of Bondade CU-31 Bonding Solution, manufactured by Transpo Industries. The reportØdescribes a three-year program of field testing and evaluation designed to determine the effectiveness of Bondade CU-31 in extending the service life of pothole repairs.