Advanced Millimeter-wave Technologies
Advanced Millimeter-wave Technologies

Author: Duixian Liu

Publisher: John Wiley & Sons

Published: 2009-03-03

Total Pages: 850

ISBN-13: 9780470742952

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This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging

Aperture Antennas for Millimeter and Sub-Millimeter Wave Applications
Aperture Antennas for Millimeter and Sub-Millimeter Wave Applications

Author: Artem Boriskin

Publisher: Springer

Published: 2017-09-05

Total Pages: 494

ISBN-13: 3319627732

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This book presents the technology of millimetre waves and Terahertz (THz) antennas. It highlights the importance of moderate and high-gain aperture antennas as key devices for establishing point-to-point and point-to-multipoint radio links for far-field and near-field applications, such as high data-rate communications, intelligent transport, security imaging, exploration and surveillance systems. The book provides a comprehensive overview of the key antenna technologies developed for the mm wave and THz domains, including established ones – such as integrated lens antennas, advanced 2D and 3D horn antennas, transmit and reflect arrays, and Fabry-Perot antennas – as well as emerging metasurface antennas for near-field and far-field applications. It describes the pros and cons of each antenna technology in comparison with other available solutions, a discussion supplemented by practical examples illustrating the step-by-step implementation procedures for each antenna type. The measurement techniques available at these frequency ranges are also presented to close the loop of the antenna development cycle. In closing, the book outlines future trends in various antenna technologies, paving the way for further developments. Presenting content originating from the five-year ESF research networking program ‘Newfocus’ and co-authored by the most active and highly cited research groups in the domain of mm- and sub-mm-wave antenna technologies, the book offers a valuable guide for researchers and engineers in both industry and academia.

Systems-Level Packaging for Millimeter-Wave Transceivers
Systems-Level Packaging for Millimeter-Wave Transceivers

Author: Mladen Božanić

Publisher: Springer

Published: 2019-03-26

Total Pages: 288

ISBN-13: 3030146901

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This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.

Antenna-in-Package Technology and Applications
Antenna-in-Package Technology and Applications

Author: Duixian Liu

Publisher: John Wiley & Sons

Published: 2020-03-31

Total Pages: 416

ISBN-13: 1119556635

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A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Terahertz Devices, Circuits and Systems
Terahertz Devices, Circuits and Systems

Author: Sudipta Das

Publisher: Springer Nature

Published: 2022-09-26

Total Pages: 304

ISBN-13: 981194105X

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This book is aimed to bring the emerging application aspects of THz technology and various modules used for its successful realization. It gathers scientific technological novelties and advancements already developed or under development in the academic and research communities. This book focuses on recent advances, different research issues in terahertz technology and would also seek out theoretical, methodological, well-established and validated empirical work dealing with these different topics. In particular, this textbook covers design considerations and current trends of THz antennas and antenna arrays to deal with the transmission and reception of THz EM waves. It also presents a discussion on metamaterial structures, meta-surfaces, and absorbers to be used for some kind of sensing and detection applications. Furthermore, it reports on THz wireless communication aspects, 6G network issues and challenges, advantages and disadvantages, generation and detection of THz waves, Signal and Communication Processing for THz communication, reconfigurable low-noise amplifier (LNA) design, III-Nitride HEMTs for THz Applications, photonic crystal fiber for sensing applications, THz Design Variable Estimation by Deep Optimization, and THz Imaging issues. Once the readers finish studying this book then they will learn about the importance of THz technology, advancement in the field, applications, THz modules like antennas, MIMO and DRAs, communication aspects, LNAs, generation of THz waves, etc and future scope. It also leads to enhancement in their knowledge in THz technology, gives a platform to future technology and novel applications realization.

Millimeter-Wave Antennas: Configurations and Applications
Millimeter-Wave Antennas: Configurations and Applications

Author: Jaco du Preez

Publisher: Springer

Published: 2016-06-20

Total Pages: 165

ISBN-13: 3319350684

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This book comprehensively reviews the state of the art in millimeter-wave antennas, traces important recent developments and provides information on a wide range of antenna configurations and applications. While fundamental theoretical aspects are discussed whenever necessary, the book primarily focuses on design principles and concepts, manufacture, measurement techniques, and practical results. Each of the various antenna types scalable to millimeter-wave dimensions is considered individually, with coverage of leaky-wave and surface-wave antennas, printed antennas, integrated antennas, and reflector and lens systems. The final two chapters address the subject from a systems perspective, providing an overview of supporting circuitry and examining in detail diverse millimeter-wave applications, including high-speed wireless communications, radio astronomy, and radar. The vast amount of information now available on millimeter-wave systems can be daunting for researchers and designers entering the field. This book offers readers essential guidance, helping them to gain a thorough understanding based on the most recent research findings and serving as a sound basis for informed decision-making.

Nanodevices for Microwave and Millimeter Wave Applications
Nanodevices for Microwave and Millimeter Wave Applications

Author: Isabelle Huynen

Publisher: MDPI

Published: 2020-06-16

Total Pages: 92

ISBN-13: 3039362224

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The microwave and millimeter wave frequency range is nowadays widely exploited in a large variety of fields including (wireless) communications, security, radar, spectroscopy, but also astronomy and biomedical, to name a few. This Special Issue focuses on the interaction between the nanoscale dimensions and centimeter to millimeter wavelengths. This interaction has been proven to be efficient for the design and fabrication of devices showing enhanced performance. Novel contributions are welcome in the field of devices based on nanoscaled geometries and materials. Applications cover, but not are limited to, electronics, sensors, signal processing, imaging and metrology, all exploiting nanoscale/nanotechnology at microwave and millimeter waves. Contributions can take the form of short communications, regular or review papers.

Convergence of Terahertz Sciences in Biomedical Systems
Convergence of Terahertz Sciences in Biomedical Systems

Author: Gun-Sik Park

Publisher: Springer Science & Business Media

Published: 2012-10-19

Total Pages: 428

ISBN-13: 9400739648

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Recent technological breakthrough in the field of Terahertz radiation has triggered new applications in biology and biomedicine. Particularly, biological applications are based on the specific spectroscopic fingerprints of biological matter in this spectral region. Historically with the discovery of new electromagnetic wave spectrum, we have always discovered new medical diagnostic imaging systems. The use of terahertz wave was not realized due to the absence of useful terahertz sources. Now after successful generation of THz waves, it is reported that a great potential for THz wave exists for its resonance with bio-molecules. There are many challenging issues such as development of THz passive and active instrumentations, understanding of THz-Bio interaction for THz spectroscopy, THz-Bio nonlinear phenomena and safety guideline, and THz imaging systems. Eventually the deeper understanding of THz-Bio interaction and novel THz systems enable us to develop powerful THz biomedical imaging systems which can contribute to biomedical industry. This is a truly interdisciplinary field and convergence technology where the communication between different disciplines is the most challenging issue for the success of the great works. One of the first steps to promote the communications in this convergence technology would be teaching the basics of these different fields to the researchers in a plain language with the help of Convergence of Terahertz Science in Biomedical Systems which is considered to be 3-4th year college students or beginning level of graduate students. Therefore, this type of book can be used by many people who want to enter or understand this field. Even more it can be used for teaching in universities or research institutions.

Antenna-in-Package Technology and Applications
Antenna-in-Package Technology and Applications

Author: Duixian Liu

Publisher: John Wiley & Sons

Published: 2020-03-03

Total Pages: 492

ISBN-13: 1119556651

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A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.