Nano-CMOS Gate Dielectric Engineering

Nano-CMOS Gate Dielectric Engineering

Author: Hei Wong

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 251

ISBN-13: 1351833286

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According to Moore’s Law, not only does the number of transistors in an integrated circuit double every two years, but transistor size also decreases at a predictable rate. At the rate we are going, the downsizing of CMOS transistors will reach the deca-nanometer scale by 2020. Accordingly, the gate dielectric thickness will be shrunk to less than half-nanometer oxide equivalent thickness (EOT) to maintain proper operation of the transistors, leaving high-k materials as the only viable solution for such small-scale EOT. This comprehensive, up-to-date text covering the physics, materials, devices, and fabrication processes for high-k gate dielectric materials, Nano-CMOS Gate Dielectric Engineering systematically describes how the fundamental electronic structures and other material properties of the transition metals and rare earth metals affect the electrical properties of the dielectric films, the dielectric/silicon and the dielectric/metal gate interfaces, and the resulting device properties. Specific topics include the problems and solutions encountered with high-k material thermal stability, defect density, and poor initial interface with silicon substrate. The text also addresses the essence of thin film deposition, etching, and process integration of high-k materials in an actual CMOS process. Fascinating in both content and approach, Nano-CMOS Gate Dielectric Engineering explains all of the necessary physics in a highly readable manner and supplements this with numerous intuitive illustrations and tables. Covering almost every aspect of high-k gate dielectric engineering for nano-CMOS technology, this is a perfect reference book for graduate students needing a better understanding of developing technology as well as researchers and engineers needing to get ahead in microelectronic engineering and materials science.


Electronic Devices Architectures for the NANO-CMOS Era

Electronic Devices Architectures for the NANO-CMOS Era

Author: Simon Deleonibus

Publisher: CRC Press

Published: 2019-05-08

Total Pages: 302

ISBN-13: 0429533624

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In this book, internationally recognized researchers give a state-of-the-art overview of the electronic device architectures required for the nano-CMOS era and beyond. Challenges relevant to the scaling of CMOS nanoelectronics are addressed through different core CMOS and memory device options in the first part of the book. The second part reviews new device concepts for nanoelectronics beyond CMOS. The book covers the fundamental limits of core CMOS, improving scaling by the introduction of new materials or processes, new architectures using SOI, multigates and multichannels, and quantum computing.


Chemical Solution Synthesis for Materials Design and Thin Film Device Applications

Chemical Solution Synthesis for Materials Design and Thin Film Device Applications

Author: Soumen Das

Publisher: Elsevier

Published: 2021-01-09

Total Pages: 748

ISBN-13: 012823170X

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Chemical Solution Synthesis for Materials Design and Thin Film Device Applications presents current research on wet chemical techniques for thin-film based devices. Sections cover the quality of thin films, types of common films used in devices, various thermodynamic properties, thin film patterning, device configuration and applications. As a whole, these topics create a roadmap for developing new materials and incorporating the results in device fabrication. This book is suitable for graduate, undergraduate, doctoral students, and researchers looking for quick guidance on material synthesis and device fabrication through wet chemical routes. - Provides the different wet chemical routes for materials synthesis, along with the most relevant thin film structured materials for device applications - Discusses patterning and solution processing of inorganic thin films, along with solvent-based processing techniques - Includes an overview of key processes and methods in thin film synthesis, processing and device fabrication, such as nucleation, lithography and solution processing


Integrated Nanodevice and Nanosystem Fabrication

Integrated Nanodevice and Nanosystem Fabrication

Author: Simon Deleonibus

Publisher: CRC Press

Published: 2017-11-22

Total Pages: 306

ISBN-13: 135172178X

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Since its invention, the integrated circuit has necessitated new process modules and numerous architectural changes to improve application performances, power consumption, and cost reduction. Silicon CMOS is now well established to offer the integration of several tens of billions of devices on a chip or in a system. At present, there are important challenges in the introduction of heterogeneous co-integration of materials and devices with the silicon CMOS 2D- and 3D-based platforms. New fabrication techniques allowing strong energy and variability efficiency come in as possible players to improve the various figures of merit of fabrication technology. Integrated Nanodevice and Nanosystem Fabrication: Breakthroughs and Alternatives is the second volume in the Pan Stanford Series on Intelligent Nanosystems. The book contains 8 chapters and is divided into two parts, the first of which reports breakthrough materials and techniques such as single ion implantation in silicon and diamond, graphene and 2D materials, nanofabrication using scanning probe microscopes, while the second tackles the scaling and architectural aspects of silicon devices through HiK scaling for nanoCMOS, nanoscale epitaxial growth of group IV semiconductors, design for variability co-optimization in SOI FinFETs, and nanowires for CMOS and diversifications.


Selected Semiconductor Research

Selected Semiconductor Research

Author: Ming-Fu Li

Publisher: World Scientific

Published: 2011

Total Pages: 529

ISBN-13: 1848164068

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This book on solid state physics has been written with an emphasis on recent developments in quantum many-body physics approaches. It starts by covering the classical theory of solids and electrons and describes how this classical model has failed. The authors then present the quantum mechanical model of electrons in a lattice and they also discuss the theory of conductivity. Extensive reviews on the topic are provided in a compact manner so that any non-specialist can follow from the beginning.The authors cover the system of magnetism in a similar way and various problems in magnetic materials are discussed. The book also discusses the Ising chain, the Heisenberg model, the Kondo effect and superconductivity, amongst other relevant topics.In the final chapter, the authors present some works related to contemporary research topics, such as quantum entanglement in many-body systems and quantum simulations. They also include a short review of some of the possible applications of solid state quantum information in biological systems.


Electronics and Electrical Engineering

Electronics and Electrical Engineering

Author: Alan Zhao

Publisher: CRC Press

Published: 2015-07-28

Total Pages: 368

ISBN-13: 1315685329

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The 2014 Asia-Pacific Electronics and Electrical Engineering Conference (EEEC 2014) was held on December 27-28, 2014 in Shanghai, China. EEEC has provided a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Electroni


High k Gate Dielectrics

High k Gate Dielectrics

Author: Michel Houssa

Publisher: CRC Press

Published: 2003-12-01

Total Pages: 614

ISBN-13: 1420034146

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The drive toward smaller and smaller electronic componentry has huge implications for the materials currently being used. As quantum mechanical effects begin to dominate, conventional materials will be unable to function at scales much smaller than those in current use. For this reason, new materials with higher electrical permittivity will be requ


Machine Learning Techniques for VLSI Chip Design

Machine Learning Techniques for VLSI Chip Design

Author: Abhishek Kumar

Publisher: John Wiley & Sons

Published: 2023-08-01

Total Pages: 244

ISBN-13: 1119910390

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MACHINE LEARNING TECHNIQUES FOR VLSI CHIP DESIGN This cutting-edge new volume covers the hardware architecture implementation, the software implementation approach, the efficient hardware of machine learning applications with FPGA or CMOS circuits, and many other aspects and applications of machine learning techniques for VLSI chip design. Artificial intelligence (AI) and machine learning (ML) have, or will have, an impact on almost every aspect of our lives and every device that we own. AI has benefitted every industry in terms of computational speeds, accurate decision prediction, efficient machine learning (ML), and deep learning (DL) algorithms. The VLSI industry uses the electronic design automation tool (EDA), and the integration with ML helps in reducing design time and cost of production. Finding defects, bugs, and hardware Trojans in the design with ML or DL can save losses during production. Constraints to ML-DL arise when having to deal with a large set of training datasets. This book covers the learning algorithm for floor planning, routing, mask fabrication, and implementation of the computational architecture for ML-DL. The future aspect of the ML-DL algorithm is to be available in the format of an integrated circuit (IC). A user can upgrade to the new algorithm by replacing an IC. This new book mainly deals with the adaption of computation blocks like hardware accelerators and novel nano-material for them based upon their application and to create a smart solution. This exciting new volume is an invaluable reference for beginners as well as engineers, scientists, researchers, and other professionals working in the area of VLSI architecture development.


Nano-CMOS Circuit and Physical Design

Nano-CMOS Circuit and Physical Design

Author: Ban Wong

Publisher: Wiley-IEEE Press

Published: 2005

Total Pages: 426

ISBN-13:

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Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.