MEMS/MOEMS Packaging
Author:
Publisher:
Published: 2005
Total Pages: 220
ISBN-13: 9781615831258
DOWNLOAD EBOOKRead and Download eBook Full
Author:
Publisher:
Published: 2005
Total Pages: 220
ISBN-13: 9781615831258
DOWNLOAD EBOOKAuthor: Ken Gilleo
Publisher: McGraw Hill Professional
Published: 2005-08-01
Total Pages: 239
ISBN-13: 0071589090
DOWNLOAD EBOOKWhile MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Author: Mithilesh K. Dikshit
Publisher: CRC Press
Published: 2023-03-27
Total Pages: 194
ISBN-13: 1000852121
DOWNLOAD EBOOKIncreased industrial capacity, manufacturing output, and manufacturing technology all contribute significantly to a country's GDP. Manufacturing is the foundation of industrial production, so improving its methods and infrastructure is crucial for progress. Recent years have seen the introduction of a wide range of energy- and resource-efficient, environmentally friendly, and occupationally safe manufacturing techniques, and this book focuses on these latest techniques, as well as continuous advancement, in order to meet current challenges. The book is divided into three sections: (1) subtractive manufacturing, (2) additive manufacturing, and (3) the use of artificial intelligence in manufacturing. It discusses micromaching, metal-based additive manufacturing, polymer-based additive manufacturing, hybrid additive manufacturing, and finally artificial intelligence in manufacturing. Futuristic Manufacturing: Perpetual Advancement and Research Challenges connects modern manufacturing methods and emerging trends in the industry. It adds a thorough examination of modern manufacturing techniques and modifications that may be implemented in the future, and is an excellent resource of information for undergraduate and graduate students in manufacturing.
Author: Joseph H. Koo
Publisher: McGraw Hill Professional
Published: 2010-05-10
Total Pages: 289
ISBN-13: 0071492046
DOWNLOAD EBOOKUnderstand the principles, applications, and limitations of a cutting-edge material Based on the author's 26 years of experience in the field of Nanotechnology, this reference offers researchers and materials scientists a complete reference to the physical concepts, techniques, applications and principles underlying one of the most researched materials. Keeps you abreast of the latest trends, developments, and commercial applications
Author: M. Edward Motamedi
Publisher: SPIE Press
Published: 2005
Total Pages: 640
ISBN-13: 9780819450210
DOWNLOAD EBOOKThis book introduces the exciting and fast-moving field of MOEMS to graduate students, scientists, and engineers by providing a foundation of both micro-optics and MEMS that will enable them to conduct future research in the field. Born from the relatively new fields of MEMS and micro-optics, MOEMS are proving to be an attractive and low-cost solution to a range of device problems requiring high optical functionality and high optical performance. MOEMS solutions include optical devices for telecommunication, sensing, and mobile systems such as v-grooves, gratings, shutters, scanners, filters, micromirrors, switches, alignment aids, lens arrays, and hermetic wafer-scale optical packaging. An international team of leading researchers contributed to this book, and it presents examples and problems employing cutting-edge MOEM devices. It will inspire researchers to further advance the design, fabrication, and analysis of MOEM systems.
Author: Ken Gilleo
Publisher: Mcgraw-hill
Published: 2005-07-11
Total Pages: 0
ISBN-13: 9780071455565
DOWNLOAD EBOOKWhile MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Author: Ken Gilleo
Publisher: McGraw Hill Professional
Published: 2002
Total Pages: 832
ISBN-13:
DOWNLOAD EBOOK*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
Author: John H. Lau
Publisher: Springer
Published: 2019-04-03
Total Pages: 381
ISBN-13: 9811372241
DOWNLOAD EBOOKHeterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Author:
Publisher:
Published: 1999
Total Pages: 974
ISBN-13:
DOWNLOAD EBOOKAuthor: Stephen D. Senturia
Publisher: Springer Science & Business Media
Published: 2005-12-20
Total Pages: 699
ISBN-13: 0306476010
DOWNLOAD EBOOKIt is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer – one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.