Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, 2003
Author: Materials Research Society. Meeting
Publisher:
Published: 2003
Total Pages: 544
ISBN-13:
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Author: Materials Research Society. Meeting
Publisher:
Published: 2003
Total Pages: 544
ISBN-13:
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Publisher:
Published: 2004
Total Pages: 440
ISBN-13:
DOWNLOAD EBOOKAuthor: R. J. Carter
Publisher:
Published: 2004-09
Total Pages: 432
ISBN-13:
DOWNLOAD EBOOKThe scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Author: G. S. Oehrlein
Publisher: Cambridge University Press
Published: 2014-06-05
Total Pages: 614
ISBN-13: 9781107413153
DOWNLOAD EBOOKThis book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Author:
Publisher:
Published: 2001
Total Pages: 624
ISBN-13:
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Publisher:
Published: 2001
Total Pages: 107
ISBN-13: 9781558996502
DOWNLOAD EBOOKAuthor: Paul R. Besser
Publisher:
Published: 2005-08-26
Total Pages: 450
ISBN-13:
DOWNLOAD EBOOKThe MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2005.
Author: Ting Y. Tsui
Publisher:
Published: 2006
Total Pages: 498
ISBN-13:
DOWNLOAD EBOOKAuthor: Martin Gall
Publisher:
Published: 2009-11-18
Total Pages: 216
ISBN-13:
DOWNLOAD EBOOKThe MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher: The Electrochemical Society
Published: 2004
Total Pages: 508
ISBN-13: 9781566774178
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