Total-Reflection X-Ray Fluorescence Analysis and Related Methods
Total-Reflection X-Ray Fluorescence Analysis and Related Methods

Author: Reinhold Klockenkämper

Publisher: John Wiley & Sons

Published: 2015-01-27

Total Pages: 554

ISBN-13: 1118460278

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Explores the uses of TXRF in micro- and trace analysis, and in surface- and near-surface-layer analysis • Pinpoints new applications of TRXF in different fields of biology, biomonitoring, material and life sciences, medicine, toxicology, forensics, art history, and archaeometry • Updated and detailed sections on sample preparation taking into account nano- and picoliter techniques • Offers helpful tips on performing analyses, including sample preparations, and spectra recording and interpretation • Includes some 700 references for further study

Silicon, Germanium, and Their Alloys
Silicon, Germanium, and Their Alloys

Author: Gudrun Kissinger

Publisher: CRC Press

Published: 2014-12-09

Total Pages: 436

ISBN-13: 1466586648

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Despite the vast knowledge accumulated on silicon, germanium, and their alloys, these materials still demand research, eminently in view of the improvement of knowledge on silicon–germanium alloys and the potentialities of silicon as a substrate for high-efficiency solar cells and for compound semiconductors and the ongoing development of nanodevices based on nanowires and nanodots. Silicon, Germanium, and Their Alloys: Growth, Defects, Impurities, and Nanocrystals covers the entire spectrum of R&D activities in silicon, germanium, and their alloys, presenting the latest achievements in the field of crystal growth, point defects, extended defects, and impurities of silicon and germanium nanocrystals. World-recognized experts are the authors of the book’s chapters, which span bulk, thin film, and nanostructured materials growth and characterization problems, theoretical modeling, crystal defects, diffusion, and issues of key applicative value, including chemical etching as a defect delineation technique, the spectroscopic analysis of impurities, and the use of devices as tools for the measurement of materials quality.

Springer Handbook of Engineering Statistics
Springer Handbook of Engineering Statistics

Author: Hoang Pham

Publisher: Springer Science & Business Media

Published: 2006

Total Pages: 1135

ISBN-13: 1852338067

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In today’s global and highly competitive environment, continuous improvement in the processes and products of any field of engineering is essential for survival. This book gathers together the full range of statistical techniques required by engineers from all fields. It will assist them to gain sensible statistical feedback on how their processes or products are functioning and to give them realistic predictions of how these could be improved. The handbook will be essential reading for all engineers and engineering-connected managers who are serious about keeping their methods and products at the cutting edge of quality and competitiveness.

Microelectronics Manufacturing Diagnostics Handbook
Microelectronics Manufacturing Diagnostics Handbook

Author: Abraham Landzberg

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 663

ISBN-13: 1461520290

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The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.

Reliability, Yield, and Stress Burn-In
Reliability, Yield, and Stress Burn-In

Author: Way Kuo

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 407

ISBN-13: 1461556716

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The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.