Author: M. Afshar Alam

Publisher: European Alliance for Innovation

Published: 2023-05-16

Total Pages: 413

ISBN-13: 1631903969

The International Conference on ICT for Digital, Smart, and Sustainable Development provides an annual platform for researchers, academicians, and professionals from across the world. ICIDSSD 22, held at Jamia Hamdard, New Delhi, India, is the second international conference of this series of conferences to be held annually. The conference majorly focuses on the recent developments in the areas relating to Information and Communication Technologies and contributing to Sustainable Development. ICIDSSD ’22 has attracted research papers pertaining to an array of exciting research areas. The selected papers cover a wide range of topics including but not limited to Sustainable Development, Green Computing, Smart City, Artificial Intelligence, Big Data, Machine Learning, Cloud Computing LT, ANN, Security, and Data Science. Papers have primarily been judged on originality, presentation, relevance, and quality of work. Papers that clearly demonstrate results have been preferred. After the formal process of peer review, the editorial board has finally selected the most relevant papers to be included in this volume. We are sure that these research works will enrich our knowledge and motivate us towards exploring the latest avenues in research. We would like to thank our Hon'ble Vice Chancellor, Prof. (Dr) M.Afshar Alarn, for his constant and commendable support extended to us toward the path of excellence. Alongside him, we would like to thank the Registrar, Mr. Syed Saud Akhtar, and other officials of the University for supporting this conference. We thank our esteemed authors for having shown confidence in us and entrusting us with the publication of their research papers. The success of the conference would not have been possible without the submission of their quality research works. We thank the members of the International Scientific Advisory Committee, Technical Program Committee and members of all the other committees for their advice, guidance, and efforts. Also, we are grateful to our technical partners and sponsors, viz. HNF, EAI, ISTE, AICTE, TIC, CSI, JETE, and DST for sponsorship and assistance. We also thank the Department of Higher Education, MHRD for the timely issuance of ISBN for the proceedings of the conference. Finally, we are thankful to all who have contributed to the success of this conference.