Read and Download eBook Full
Author: Yun Ouyang
Publisher: Trans Tech Publications Ltd
Published: 2012-12-13
Total Pages: 614
ISBN-13: 303813953X
DOWNLOAD EBOOKSelected, peer reviewed papers from the 2nd China Academic Conference on Printing and Packaging (CACPP 2012), October 19-20, 2012, Beijing, China
Author: Yun Ouyang
Publisher: Trans Tech Publications Ltd
Published: 2015-01-29
Total Pages: 610
ISBN-13: 3038267902
DOWNLOAD EBOOKSelected, peer reviewed papers from the 2014 3rd China Academic Conference on Printing and Packaging, October 24-25, 2014, Beijing, China
Author: Pengfei Zhao
Publisher: Springer Nature
Published: 2021-05-25
Total Pages: 834
ISBN-13: 9811605033
DOWNLOAD EBOOKThis book includes a selection of reviewed papers presented at the 11th China Academic Conference on Printing and Packaging, held on November 26–29, 2020, Guangzhou, China. The conference is jointly organized by China Academy of Printing Technology and South China University of Technology. With 10 keynote talks and 200 presented papers on graphic communication and packaging technologies, the conference attracted more than 300 scientists. The proceedings cover the recent findings in color science and technology, image processing technology, digital media technology, mechanical and electronic engineering and numerical control, materials and detection, digital process management technology in printing and packaging, and other technologies. As such, the book is of interest to university researchers, R&D engineers and graduate students in the field of graphic arts, packaging, color science, image science, material science, computer science, digital media, network technology and smart manufacturing technology.
Author: Pengfei Zhao
Publisher: Springer Nature
Published: 2020-04-09
Total Pages: 891
ISBN-13: 9811518645
DOWNLOAD EBOOKThis book includes a selection of peer-reviewed papers presented at the 10th China Academic Conference on Printing and Packaging, which was held in Xi'an, China, on November 14–17, 2019. The conference was jointly organized by the China Academy of Printing Technology, Beijing Institute of Graphic Communication, and Shaanxi University of Science and Technology. With 9 keynote talks and 118 papers on graphic communication and packaging technologies, the conference attracted more than 300 scientists. The proceedings cover the latest findings in a broad range of areas, including color science and technology, image processing technology, digital media technology, mechanical and electronic engineering, Information Engineering and Artificial Intelligence Technology, materials and detection, digital process management technology in printing and packaging, and other technologies. As such, the book appeals to university researchers, R&D engineers and graduate students in the graphic arts, packaging, color science, image science, material science, computer science, digital media, and network technology.
Author: Pengfei Zhao
Publisher: Springer
Published: 2017-03-21
Total Pages: 1118
ISBN-13: 981103530X
DOWNLOAD EBOOKThis book includes a selection of reviewed papers presented at the 2016 China Academic Conference on Printing, Packaging Engineering & Media Technology, held on November 25-27, 2016 in Xi’an, China. The conference was jointly organized by China Academy of Printing Technology, Xi’an University of Technology and Stuttgart Media University of Germany. The proceedings cover the recent outcomes on color science and technology, image processing technology, digital media technology, digital process management technology in packaging and packaging etc. They will be of interest to university researchers, R&D engineers and graduate students in graphic communications, packaging, color science, image science, material science, computer science, digital media and network technology fields.
Author: Yun Ouyang
Publisher: Springer
Published: 2015-12-04
Total Pages: 1009
ISBN-13: 9811000727
DOWNLOAD EBOOKThis book includes a selection of reviewed papers presented at the 2015, 4th China Academic Conference on Printing and Packaging, which was held on October 22-24, 2015 in Hangzhou, China. The conference was jointly organized by the China Academy of Printing Technology, Beijing Institute of Graphic Communication, and Hangzhou Dianzi University. With 3 keynote talks and 200 presented papers on graphic communications, packaging technologies and materials, the conference attracted more than 400 scientists. These proceedings cover the recent research outcomes on color science and technology, image-processing technology, digital-media technology, printing-engineering technology, packaging-engineering technology etc. They will be of interest to university researchers, R&D engineers and graduate students in graphic communications, packaging, color science, image science, materials science, computer science, digital media and network technology fields.
Author: Beth Keser
Publisher: John Wiley & Sons
Published: 2021-12-29
Total Pages: 324
ISBN-13: 1119793777
DOWNLOAD EBOOKDiscover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author: Anne Emblem
Publisher: Elsevier
Published: 2012-10-29
Total Pages: 601
ISBN-13: 0857095706
DOWNLOAD EBOOKPackaging is a complex and wide-ranging subject. Comprehensive in scope and authoritative in its coverage, Packaging technology provides the ideal introduction and reference for both students and experienced packaging professionals.Part one provides a context for the book, discussing fundamental issues relating to packaging such as its role in society and its diverse functions, the packaging supply chain and legislative, environmental and marketing issues. Part two reviews the principal packaging materials such as glass, metal, plastics, paper and paper board. It also discusses closures, adhesives and labels. The final part of the book discusses packaging processes, from design and printing to packaging machinery and line operations, as well as hazard and risk management in packaging.With its distinguished editors and expert contributors, Packaging technology is a standard text for the packaging industry. The book is designed both to meet the needs of those studying for the Diploma in Packaging Technology and to act as a comprehensive reference for packaging professionals. - Provides the ideal introduction and reference for both students and experienced packaging professionals - Examines fundamental issues relating to packaging, such as its role in society, its diverse functions, the packaging supply chain and legislative, environmental and marketing issues - Reviews the principal packaging materials such as glass, metal, plastics, paper and paper board
Author: Megh R. Goyal
Publisher: CRC Press
Published: 2024-02-13
Total Pages: 343
ISBN-13: 1000883329
DOWNLOAD EBOOKThis new volume explores the recent innovations in active, intelligent, and smart packaging systems that embrace packaging potential to not only provide protection to food but to also improve its nutritive value, reduce contamination by releasing antimicrobials, and provide real-time status of food quality. The book presents novel edible food packaging, nanotechnology-based improvements in food packaging, and biodegradation and bio-based approaches for management of food waste and plastic waste from packaging.
Author: Beth Keser
Publisher: John Wiley & Sons
Published: 2019-02-20
Total Pages: 634
ISBN-13: 1119313988
DOWNLOAD EBOOKExamines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
