'Advances in Microelectronics: Reviews', Vol_1

'Advances in Microelectronics: Reviews', Vol_1

Author: Sergey Yurish

Publisher: Lulu.com

Published: 2017-12-24

Total Pages: 536

ISBN-13: 8469786334

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The 1st volume of 'Advances in Microelectronics: Reviews' Book Series contains 19 chapters written by 72 authors from academia and industry from 16 countries. With unique combination of information in each volume, the 'Advances in Microelectronics: Reviews' Book Series will be of value for scientists and engineers in industry and at universities. In order to offer a fast and easy reading of the state of the art of each topic, every chapter in this book is independent and self-contained. All chapters have the same structure: first an introduction to specific topic under study; second particular field description including sensing applications. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.


Advances in Microelectronics: Reviews, Vol. 2

Advances in Microelectronics: Reviews, Vol. 2

Author: Sergey Yurish

Publisher: Lulu.com

Published: 2019-02-07

Total Pages: 516

ISBN-13: 8409081601

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The 2nd volume of 'Advances in Microelectronics: Reviews' Book Series is written by 57 contributors from academy and industry from 11 countries (Bulgaria, Hungary, Iran, Japan, Malaysia, Romania, Russia, Slovak Republic, Spain, Ukraine and USA). The book contains 13 chapters from different areas of microelectronics: MEMS, materials characterization, and various microelectronic devices. With unique combination of information in each volume, the Book Series will be of value for scientists and engineers in industry and at universities. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.


Advances in Reliability and System Engineering

Advances in Reliability and System Engineering

Author: Mangey Ram

Publisher: Springer

Published: 2016-11-30

Total Pages: 268

ISBN-13: 3319488759

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This book presents original studies describing the latest research and developments in the area of reliability and systems engineering. It helps the reader identifying gaps in the current knowledge and presents fruitful areas for further research in the field. Among others, this book covers reliability measures, reliability assessment of multi-state systems, optimization of multi-state systems, continuous multi-state systems, new computational techniques applied to multi-state systems and probabilistic and non-probabilistic safety assessment.


Advances in Contact Angle, Wettability and Adhesion, Volume 3

Advances in Contact Angle, Wettability and Adhesion, Volume 3

Author: K. L. Mittal

Publisher: John Wiley & Sons

Published: 2018-02-26

Total Pages: 373

ISBN-13: 1119459958

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With 16 chapters from world-renowned researchers, this book offers an extraordinary commentary on the burgeoning current research activity in contact angle and wettability The present volume constitutes Volume 3 in the ongoing series Advances in Contact Angle, Wettability and Adhesion which was conceived with the intent to provide periodic updates on the research activity and salient developments in the fascinating arena of contact angle, wettability and adhesion. The book is divided into four parts: Part 1: Contact Angle Measurement and Analysis; Part 2: Wettability Behavior; Part 3: Superhydrophobic Surfaces; Part 4: Wettability, Surface Free Energy and Adhesion. The topics covered include: procedure to measure and analyse contact angle/drop shape behaviors; contact angle measurement considering spreading, evaporation and reactive substrate; measurement of contact angle of a liquid on a substrate of the same liquid; evolution of axisymmetric droplet shape parameters; interfacial modulus of a solid surface; functionalization of textiles using UV-based techniques for surface modification--patterned wetting behavior; wettability behavior of oleophilic and oleophobic nanorough surfaces; wettability behavior of nanofluids; dielectrowetting for digital microfluidics; hydrophobicity and superhydrophobicity in fouling prevention; superhydrophobic/superhydrophilic hybrid surface; determination of the surface free energy of solid surfaces: statistical considerations; determination of apparent surface free energy using hysteresis approach; wettability correlations for bioadhesion to different materials; laser material processing for enhancing stem cell adhesion and growth.


Advances in Sensors: Reviews, Vol.4 'Sensors and Applications in Measuring and Automation Control Systems'

Advances in Sensors: Reviews, Vol.4 'Sensors and Applications in Measuring and Automation Control Systems'

Author: Sergey Yurish

Publisher: Lulu.com

Published: 2017-01-18

Total Pages: 506

ISBN-13: 8461775961

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The fourth volume titled 'Sensors and Applications in Measuring and Automation Control Systems' contains twenty four chapters with sensor related state-of-the-art reviews and descriptions of latest advances in sensor related area written by 81 authors from academia and industry from 5 continents and 20 countries: Australia, Austria, Brazil, Finland, France, Japan, India, Iraq, Italia, México, Morocco, Portugal, Senegal, Serbia, South Africa, South Korea, Spain, UK, Ukraine and USA. Coverage includes current developments in physical sensors and transducers, chemical sensors, biosensors, sensing materials, signal conditioning, energy harvesters and sensor networks.


Advanced Electronic Packaging

Advanced Electronic Packaging

Author: Richard K. Ulrich

Publisher: John Wiley & Sons

Published: 2006-02-24

Total Pages: 852

ISBN-13: 0471466093

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As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.