This book focuses on two of the most relevant problems related to power management on multicore and manycore systems. Specifically, one part of the book focuses on maximizing/optimizing computational performance under power or thermal constraints, while another part focuses on minimizing energy consumption under performance (or real-time) constraints.
This book constitutes the refereed proceedings of the 16th European Workshop on Computer Performance Engineering, EPEW 2019, held in Milan, Italy, in November 2019. The 10 papers presented in this volume together with one invited talk were carefully reviewed and selected from 13 submissions. The papers presented at the workshop reflect the diversity of modern performance engineering, with topics ranging from modeling and analysis of network/control protocols and high performance/BigData information systems, analysis of scheduling, blockchain technology, analytical modeling and simulation of computer/network systems.
This IBM® RedpaperTM publication describes the adapter-based virtualization capabilities that are being deployed in high-end IBM POWER7+TM processor-based servers. Peripheral Component Interconnect Express (PCIe) single root I/O virtualization (SR-IOV) is a virtualization technology on IBM Power Systems servers. SR-IOV allows multiple logical partitions (LPARs) to share a PCIe adapter with little or no run time involvement of a hypervisor or other virtualization intermediary. SR-IOV does not replace the existing virtualization capabilities that are offered as part of the IBM PowerVM® offerings. Rather, SR-IOV compliments them with additional capabilities. This paper describes many aspects of the SR-IOV technology, including: A comparison of SR-IOV with standard virtualization technology Overall benefits of SR-IOV Architectural overview of SR-IOV Planning requirements SR-IOV deployment models that use standard I/O virtualization Configuring the adapter for dedicated or shared modes Tips for maintaining and troubleshooting your system Scenarios for configuring your system This paper is directed to clients, IBM Business Partners, and system administrators who are involved with planning, deploying, configuring, and maintaining key virtualization technologies.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
In a previous volume (ICT-Energy-Concepts Towards Zero-Power ICT; referenced below as Vol. 1), we addressed some of the fundamentals related to bridging the gap between the amount of energy required to operate portable/mobile ICT systems and the amount of energy available from ambient sources. The only viable solution appears to be to attack the gap from both sides, i.e. to reduce the amount of energy dissipated during computation and to improve the efficiency in energy-harvesting technologies. In this book, we build on those concepts and continue the discussion on energy efficiency and sustainability by addressing the minimisation of energy consumption at different levels across the ICT system stack, from hardware to software, as well as discussing energy consumption issues in high-performance computing (HPC), data centres and communication in sensor networks. This book was realised thanks to the contribution of the project ‘Coordinating Research Efforts of the ICT-Energy Community’ funded from the European Union under the Future and Emerging Technologies (FET) area of the Seventh Framework Programme for Research and Technological Development (grant agreement n. 611004).
This book presents the state-of-the-art and breakthrough innovations in design automation for cyber-physical systems.The authors discuss various aspects of cyber-physical systems design, including modeling, co-design, optimization, tools, formal methods, validation, verification, and case studies. Coverage includes a survey of the various existing cyber-physical systems functional design methodologies and related tools will provide the reader unique insights into the conceptual design of cyber-physical systems.
Energy Efficient Servers: Blueprints for Data Center Optimization introduces engineers and IT professionals to the power management technologies and techniques used in energy efficient servers. The book includes a deep examination of different features used in processors, memory, interconnects, I/O devices, and other platform components. It outlines the power and performance impact of these features and the role firmware and software play in initialization and control. Using examples from cloud, HPC, and enterprise environments, the book demonstrates how various power management technologies are utilized across a range of server utilization. It teaches the reader how to monitor, analyze, and optimize their environment to best suit their needs. It shares optimization techniques used by data center administrators and system optimization experts at the world’s most advanced data centers.
This IBM® RedpaperTM publication is a comprehensive guide covering the IBM Power System S822 (8284-22A) server that supports the IBM AIX® and Linux operating systems (OSes) running on bare metal, and the IBM i OS running under the VIOS. The objective of this paper is to introduce the major innovative Power S822 offerings and their relevant functions: The new IBM POWER8TM processor, which is available at frequencies of 3.42 GHz, and 3.89 GHz Significantly strengthened cores and larger caches Two integrated memory controllers with improved latency and bandwidth Integrated I/O subsystem and hot-pluggable PCIe Gen3 I/O slots Improved reliability, serviceability, and availability (RAS) functions IBM EnergyScaleTM technology that provides features such as power trending, power-saving, capping of power, and thermal measurement This publication is for professionals who want to acquire a better understanding of IBM Power SystemsTM products. This paper expands the current set of IBM Power Systems documentation by providing a desktop reference that offers a detailed technical description of the Power S822 system. This paper does not replace the latest marketing materials and configuration tools. It is intended as an additional source of information that, together with existing sources, can be used to enhance your knowledge of IBM server solutions.
This IBM® Redbooks® publication focuses on gathering the correct technical information, and laying out simple guidance for optimizing code performance on IBM POWER8® processor-based systems that run the IBM AIX®, IBM i, or Linux operating systems. There is straightforward performance optimization that can be performed with a minimum of effort and without extensive previous experience or in-depth knowledge. The POWER8 processor contains many new and important performance features, such as support for eight hardware threads in each core and support for transactional memory. The POWER8 processor is a strict superset of the IBM POWER7+TM processor, and so all of the performance features of the POWER7+ processor, such as multiple page sizes, also appear in the POWER8 processor. Much of the technical information and guidance for optimizing performance on POWER8 processors that is presented in this guide also applies to POWER7+ and earlier processors, except where the guide explicitly indicates that a feature is new in the POWER8 processor. This guide strives to focus on optimizations that tend to be positive across a broad set of IBM POWER® processor chips and systems. Specific guidance is given for the POWER8 processor; however, the general guidance is applicable to the IBM POWER7+, IBM POWER7®, IBM POWER6®, IBM POWER5, and even to earlier processors. This guide is directed at personnel who are responsible for performing migration and implementation activities on POWER8 processor-based systems. This includes system administrators, system architects, network administrators, information architects, and database administrators (DBAs).
This IBM® Redpaper® publication provides a broad understanding of a new architecture of the IBM Power® E1080 (also known as the Power E1080) server that supports IBM AIX®, IBM i, and selected distributions of Linux operating systems. The objective of this paper is to introduce the Power E1080, the most powerful and scalable server of the IBM Power portfolio, and its offerings and relevant functions: Designed to support up to four system nodes and up to 240 IBM Power10TM processor cores The Power E1080 can be initially ordered with a single system node or two system nodes configuration, which provides up to 60 Power10 processor cores with a single node configuration or up to 120 Power10 processor cores with a two system nodes configuration. More support for a three or four system nodes configuration is to be added on December 10, 2021, which provides support for up to 240 Power10 processor cores with a full combined four system nodes server. Designed to supports up to 64 TB memory The Power E1080 can be initially ordered with the total memory RAM capacity up to 8 TB. More support is to be added on December 10, 2021 to support up to 64 TB in a full combined four system nodes server. Designed to support up to 32 Peripheral Component Interconnect® (PCIe) Gen 5 slots in a full combined four system nodes server and up to 192 PCIe Gen 3 slots with expansion I/O drawers The Power E1080 supports initially a maximum of two system nodes; therefore, up to 16 PCIe Gen 5 slots, and up to 96 PCIe Gen 3 slots with expansion I/O drawer. More support is to be added on December 10, 2021, to support up to 192 PCIe Gen 3 slots with expansion I/O drawers. Up to over 4,000 directly attached serial-attached SCSI (SAS) disks or solid-state drives (SSDs) Up to 1,000 virtual machines (VMs) with logical partitions (LPARs) per system System control unit, providing redundant system master Flexible Service Processor (FSP) Supports IBM Power System Private Cloud Solution with Dynamic Capacity This publication is for professionals who want to acquire a better understanding of Power servers. The intended audience includes the following roles: Customers Sales and marketing professionals Technical support professionals IBM Business Partners Independent software vendors (ISVs) This paper does not replace the current marketing materials and configuration tools. It is intended as an extra source of information that, together with existing sources, can be used to enhance your knowledge of IBM server solutions.
