Thermal Design of Electronic Equipment
Thermal Design of Electronic Equipment

Author: Ralph Remsburg

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 440

ISBN-13: 1351835912

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In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

Advanced Thermal Design of Electronic Equipment
Advanced Thermal Design of Electronic Equipment

Author: Ralph Remsburg

Publisher: Springer Science & Business Media

Published: 1998-02-28

Total Pages: 632

ISBN-13: 9780412122712

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With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.

Thermal Design of Electronic Equipment
Thermal Design of Electronic Equipment

Author: Ralph Remsburg

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 395

ISBN-13: 142004236X

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In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

Practical Thermal Design for Electronic Equipment
Practical Thermal Design for Electronic Equipment

Author: Sung Jin Kim

Publisher: CRC Press

Published: 1998-01-01

Total Pages: 300

ISBN-13: 9780849316890

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Very Large Scale Integration (VLSI) technology has raised significant considerations of thermal control. This practical reference for thermal and design engineers addresses topics related to thermal cooling of electronic equipment. The text includes numerous examples and calculations from engineering applications and provides design guides for packaging and thermal engineers. It also examines the advancement of technologies in the electronic industry and addresses such questions as: what is the life expectancy of an air moving device?; how does one thermally characterize an electronic component?; how does one choose and optimize heat sink?; and what are the limitations of numerical simulation tools?

Theory and Practice of Thermal Transient Testing of Electronic Components
Theory and Practice of Thermal Transient Testing of Electronic Components

Author: Marta Rencz

Publisher: Springer Nature

Published: 2023-01-23

Total Pages: 389

ISBN-13: 3030861740

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This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

Thermal Management of Microelectronic Equipment
Thermal Management of Microelectronic Equipment

Author: Lian-Tuu Yeh

Publisher: American Society of Mechanical Engineers

Published: 2002

Total Pages: 454

ISBN-13:

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With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.