Understanding the Reliability Technology Based on Entropy Production, and Other Researches
Understanding the Reliability Technology Based on Entropy Production, and Other Researches

Author: King-Ning Tu

Publisher:

Published: 2021-05-15

Total Pages: 132

ISBN-13:

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King-Ning Tu was born on 30 December 1937 in Canton, China is a professor in the Department of Materials Science and Engineering and the Department of Electrical Engineering at UCLA. King has over 500 journal publications with citations over 24,000 and an h-factor of 88 (web-Google). He received the TMS John Bardeen Award in 2013. He has co-authored the textbook Electronic Thin Film Scienceand authored the books Solder Joint Technology: Materials, Properties, and Reliability, and Electronic Thin-Film Reliability. His research is centered on metal-silicon reactions, solder joint reactions, point-contact reactions in nanowires, polarity effect of electromigration on interfacial reactions, and kinetic theories of interfacial reactions. King Tu was an honor as American Physical Society -Fellow, 1981, The Metallurgical Society-Fellow, 1988, Materials Research Society -President, 1981, Fellow 2014, Churchill College -Overseas Fellow, 1990. He received The Metallurgical Society -Application to Practice Award, 1981, Acta/Scripta Metallurgical Lecturer, 1990 -1992, Humboldt Research Award for Senior US scientists, 1996, Member of Academia Sinica, ROC, 2002, TMS-EMPM Division Distinguished Scientist/Engineer Award in 2006, TMS John Bardeen Award in2011, and IEEE Division of Components, Packaging, and Manufacturing Technology Award in 2017.King Tu has been awarded numerous fellowships and letter of appreciation for his tremendous works and research in different fields. ●American Physical Society -Fellow, 1981●The Metallurgical Society -Fellow, 1988●Churchill College -Overseas Fellow, 1990●Materials Research Society -President, 1981●The Metallurgical Society -Application to Practice Award, 1988●Alpha Sigma Mu Lecturer of American Society for Metals, 1986●Acta/Scripta Metallurgica Lecturer, 1990 -1992●Humboldt Research Award for Senior US scientists, 1996●Honorary Member of The Korean Institute of Metals and Materials, 1996●Certificate of Appreciation from SEMATECH for flip-chip study, 1998●Member of Academia Sinica, ROC, 2002King-Ning Tu has published almost 56 articles, research papers on Diffusion and Reactions in Solder Alloys, and around 100 research papers on Silicide Formation. He also has 39 research paper on Electrical Properties and Schottky Barrier of Silicides, 38 papers on Diffusion and Reactions in Metallic Thin Films, and 31 papers on Diffusion and Reactions in Si, SiO2, and Low k Materials. Including these, King has published two books over the title, K. N. Tu, "Electronic Thin-Film Reliability", Cambridge University Press, (2011) and K. N. Tu, J. W. Mayer, and L. C. Feldman, "Electronic Thin Film Science -for Electrical Engineers and Materials Scientists", Macmillan, NY (1992).

Fluid Mechanics
Fluid Mechanics

Author: Bijay Sultanian

Publisher: CRC Press

Published: 2015-07-28

Total Pages: 570

ISBN-13: 1466598999

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Fluid Mechanics: An Intermediate Approach addresses the problems facing engineers today by taking on practical, rather than theoretical problems. Instead of following an approach that focuses on mathematics first, this book allows you to develop an intuitive physical understanding of various fluid flows, including internal compressible flows with s

Handbook of Research on Methodologies and Applications of Supercomputing
Handbook of Research on Methodologies and Applications of Supercomputing

Author: Milutinovi?, Veljko

Publisher: IGI Global

Published: 2021-02-19

Total Pages: 393

ISBN-13: 1799871584

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As computers continue to remain essential tools for the pursuit of physics, medicine, economics, social sciences, and more, supercomputers are proving that they can further extend and greatly enhance as-of-yet undiscovered knowledge and solve the world’s most complex problems. As these instruments continue to lead to groundbreaking discoveries and breakthroughs, it is imperative that research remains up to date with the latest findings and uses. The Handbook of Research on Methodologies and Applications of Supercomputing is a comprehensive and critical reference book that provides research on the latest advances of control flow and dataflow supercomputing and highlights selected emerging big data applications needing high acceleration and/or low power. Consequently, this book advocates the need for hybrid computing, where the control flow part represents the host architecture and dataflow part represents the acceleration architecture. These issues cover the initial eight chapters. The remaining eight chapters cover selected modern applications that are best implemented on a hybrid computer, in which the transactional parts (serial code) are implemented on the control flow part and the loops (parallel code) on the dataflow part. These final eight chapters cover two major application domains: scientific computing and computing for digital economy. This book offers applications in marketing, medicine, energy systems, and library science, among others, and is an essential source for scientists, programmers, engineers, practitioners, researchers, academicians, and students interested in the latest findings and advancements in supercomputing.