Thin Films Stresses and Mechanical Properties VI
Thin Films Stresses and Mechanical Properties VI

Author: William W. Gerberich

Publisher:

Published: 1997

Total Pages: 576

ISBN-13:

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Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.

Metallic Films for Electronic, Optical and Magnetic Applications
Metallic Films for Electronic, Optical and Magnetic Applications

Author: Katayun Barmak

Publisher: Woodhead Publishing

Published: 2014-02-13

Total Pages: 671

ISBN-13: 085709629X

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Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties

Mechanical Properties of Structural Films
Mechanical Properties of Structural Films

Author: Christopher L. Muhlstein

Publisher: ASTM International

Published: 2001

Total Pages: 333

ISBN-13: 0803128894

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Recent advances in the mechanical properties of structural films are described in these papers from a November 2000 symposium held in Orlando, Florida. Papers are organized in sections on fracture and fatigue of structural films, elastic behavior and residual stress in thin films, tensile testing of

Thin Films--stresses and Mechanical Properties X
Thin Films--stresses and Mechanical Properties X

Author: Sean G. Corcoran

Publisher:

Published: 2004

Total Pages: 616

ISBN-13:

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This work contains experimental, theoretical, and modeling research papers from a December 2003 symposium on the mechanical behavior of thin films, touching on topics in stress evolution, modeling stresses and film instability, deformation and adhesion, film fracture and fatigue, processing and structure, indentation testing, mechanical properties, properties and performance, and multilayers and nanolaminates. Some specific topics include fracture patterns in thin films and multilayers, thin film herringbone buckling patterns, the effect of oxygen on adhesion of thin copper films to silicon nitride, and the effects of stress amplitude on the fatigue of polysilicon. Annotation : 2004 Book News, Inc., Portland, OR (booknews.com)

Mechanical Behaviour of Materials - VI
Mechanical Behaviour of Materials - VI

Author: M. Jono

Publisher: Elsevier

Published: 2013-10-22

Total Pages: 3510

ISBN-13: 1483294137

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Significant progress in the science and technology of the mechanical behaviour of materials has been made in recent years. The greatest strides forward have occurred in the field of advanced materials with high performance, such as ceramics, composite materials, and intermetallic compounds. The Sixth International Conference on Mechanical Behaviour of Materials (ICM-6), taking place in Kyoto, Japan, 29 July - 2 August 1991 addressed these issues. In commemorating the fortieth anniversary of the Japan Society of Materials Science, organised by the Foundation for Advancement of International Science and supported by the Science Council of Japan, the information provided in these proceedings reflects the international nature of the meeting. It provides a valuable account of recent developments and problems in the field of mechanical behaviour of materials.

Diffusion Processes in Advanced Technological Materials
Diffusion Processes in Advanced Technological Materials

Author: Devendra Gupta

Publisher: Springer Science & Business Media

Published: 2013-01-15

Total Pages: 552

ISBN-13: 9780080947082

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This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.

Materials Science of Thin Films
Materials Science of Thin Films

Author: Milton Ohring

Publisher: Elsevier

Published: 2001-10-20

Total Pages: 817

ISBN-13: 0080491782

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This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Relaxation of the Chemical Bond
Relaxation of the Chemical Bond

Author: Chang Q Sun

Publisher: Springer

Published: 2014-07-08

Total Pages: 816

ISBN-13: 9814585211

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The aim of this book is to explore the detectable properties of a material to the parameters of bond and non-bond involved and to clarify the interdependence of various properties. This book is composed of four parts; Part I deals with the formation and relaxation dynamics of bond and non-bond during chemisorptions with uncovering of the correlation among the chemical bond, energy band and surface potential barrier (3B) during reactions; Part II is focused on the relaxation of bonds between atoms with fewer neighbors than the ideal in bulk with unraveling of the bond order-length-strength (BOLS) correlation mechanism, which clarifies the nature difference between nanostructures and bulk of the same substance; Part III deals with the relaxation dynamics of bond under heating and compressing with revealing of rules on the temperature-resolved elastic and plastic properties of low-dimensional materials; Part IV is focused on the asymmetric relaxation dynamics of the hydrogen bond (O:H-O) and the anomalous behavior of water and ice under cooling, compressing and clustering. The target audience for this book includes scientists, engineers and practitioners in the area of surface science and nanoscience.