Substrate Noise Coupling in Mixed-Signal ASICs
Substrate Noise Coupling in Mixed-Signal ASICs

Author: Stéphane Donnay

Publisher: Springer Science & Business Media

Published: 2006-05-31

Total Pages: 311

ISBN-13: 0306481707

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This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.

Substrate Noise Coupling in Analog/RF Circuits
Substrate Noise Coupling in Analog/RF Circuits

Author: Stephane Bronckers

Publisher: Artech House

Published: 2010

Total Pages: 272

ISBN-13: 1596932724

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This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation structures and circuit techniques to make analog/RF circuits more immune to substrate noise. Topics include substrate noise propagation, passive isolation structures, noise couple in active devices, measuring the coupling mechanisms in analog/RF circuits, prediction of the impact of substrate noise on analog/RF circuits, and noise coupling in analog/RF systems.

Substrate and Adstrate
Substrate and Adstrate

Author: Micah Corum

Publisher: Walter de Gruyter GmbH & Co KG

Published: 2015-04-24

Total Pages: 292

ISBN-13: 1614514623

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This volume provides a large-scale, in-depth analysis of locative structures in Nigerian Pidgin and Ghanaian Pidgin English and compares those structures to locatives in their lexifier, substrate, and adstrate languages. The work draws on new research methods for investigating substrate and adstrate influence in semantics and creole genesis.

Substrate Noise Coupling in RFICs
Substrate Noise Coupling in RFICs

Author: Ahmed Helmy

Publisher: Springer Science & Business Media

Published: 2008-03-23

Total Pages: 129

ISBN-13: 1402081669

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The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.

Parasitic Substrate Coupling in High Voltage Integrated Circuits
Parasitic Substrate Coupling in High Voltage Integrated Circuits

Author: Pietro Buccella

Publisher: Springer

Published: 2018-03-14

Total Pages: 195

ISBN-13: 3319743821

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This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools. The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits. The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis. Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits; Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate; Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices; Offers design guidelines to reduce couplings by adding specific protections.

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

Author: Nabil Shovon Ashraf

Publisher: Springer Nature

Published: 2022-06-01

Total Pages: 72

ISBN-13: 3031020278

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In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

Substrate Integrated Antennas and Arrays
Substrate Integrated Antennas and Arrays

Author: Yu Jian Cheng

Publisher: CRC Press

Published: 2018-09-03

Total Pages: 264

ISBN-13: 1498714579

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Substrate Integrated Antennas and Arrays provides a single source for cutting-edge information on substrate integrated circuits (SICs), substrate integrated waveguide (SIW) feeding networks, SIW slot array antennas, SIC traveling-wave antennas, SIW feeding antennas, SIW monopulse antennas, and SIW multibeam antennas. Inspired by the author’s extensive research, this comprehensive book: Describes a revolutionary SIC-based antenna technique with the potential to replace existing antenna technologies Examines theoretical and experimental results connected to electrical and mechanical performance Explains how to overcome difficulties in meeting bandwidth, gain, and efficiency specifications Substrate Integrated Antennas and Arrays offers valuable insight into the state of the art of SIC and SIW antenna technologies, presenting research useful to the development of wireless communication base station antennas, portable microwave point-to-point systems, collision avoidance radars, conformal antennas, and satellite antennas.

Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites
Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites

Author: Christian Gontrand

Publisher: Bentham Science Publishers

Published: 2014-04-21

Total Pages: 225

ISBN-13: 1608058263

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The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Author: Yue Ma

Publisher: CRC Press

Published: 2019-03-08

Total Pages: 226

ISBN-13: 0429680074

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As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.