Microelectromechanical systems (MEMS)-based sensors and actuators have become remarkably popular in the past few decades. Rapid advances have taken place in terms of both technologies and techniques of fabrication of MEMS structures. Wet chemical–based silicon bulk micromachining continues to be a widely used technique for the fabrication of microstructures used in MEMS devices. Researchers all over the world have contributed significantly to the advancement of wet chemical–based micromachining, from understanding the etching mechanism to exploring its application to the fabrication of simple to complex MEMS structures. In addition to its various benefits, one of the unique features of wet chemical–based bulk micromachining is the ability to fabricate slanted sidewalls, such as 45° walls as micromirrors, as well as freestanding structures, such as cantilevers and diaphragms. This makes wet bulk micromachining necessary for the fabrication of structures for myriad applications. This book provides a comprehensive understating of wet bulk micromachining for the fabrication of simple to advanced microstructures for various applications in MEMS. It includes introductory to advanced concepts and covers research on basic and advanced topics on wet chemical–based silicon bulk micromachining. The book thus serves as an introductory textbook for undergraduate- and graduate-level students of physics, chemistry, electrical and electronic engineering, materials science, and engineering, as well as a comprehensive reference for researchers working or aspiring to work in the area of MEMS and for engineers working in microfabrication technology.
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Covering all aspects of transport phenomena on the nano- and micro-scale, this encyclopedia features over 750 entries in three alphabetically-arranged volumes including the most up-to-date research, insights, and applied techniques across all areas. Coverage includes electrical double-layers, optofluidics, DNC lab-on-a-chip, nanosensors, and more.
Society is approaching and advancing nano- and microtechnology from various angles of science and engineering. The need for further fundamental, applied, and experimental research is matched by the demand for quality references that capture the multidisciplinary and multifaceted nature of the science. Presenting cutting-edge information that is applicable to many fields, Nano- and Micro-Electromechanical Systems: Fundamentals of Nano and Microengineering, Second Edition builds the theoretical foundation for understanding, modeling, controlling, simulating, and designing nano- and microsystems. The book focuses on the fundamentals of nano- and microengineering and nano- and microtechnology. It emphasizes the multidisciplinary principles of NEMS and MEMS and practical applications of the basic theory in engineering practice and technology development. Significantly revised to reflect both fundamental and technological aspects, this second edition introduces the concepts, methods, techniques, and technologies needed to solve a wide variety of problems related to high-performance nano- and microsystems. The book is written in a textbook style and now includes homework problems, examples, and reference lists in every chapter, as well as a separate solutions manual. It is designed to satisfy the growing demands of undergraduate and graduate students, researchers, and professionals in the fields of nano- and microengineering, and to enable them to contribute to the nanotechnology revolution.
Nanoelectronics is one of the most important technologies of nanotechnology. It plays vital role in the field of engineering and electronics. Nanoelectronics make use of scientific techniques at atomic scale for developing the nano machines. The main target is to reduce the size, risk factor and surface areas of the materials and molecules. Machines under nanoelectronic process under goes the long range of manufacturing steps each with accurate molecular treatment. Semiconductor electronics have seen a sustained exponential reduce in size and cost and a similar augment in performance and level of integration over the last thirty years. The Silicon Roadmap is laid out for the next ten years. After that, either economical or physical barriers will pose a huge challenge. The former is connected to the difficulty of making a profit in view of the exorbitant costs of building the necessary manufacturing capabilities, if present day technologies are extrapolated. The latter is a direct consequence of the shrinking device size, leading to physical phenomena impeding the operation of current devices. The transistor is the building block to a modern processor. The current silicon designed transistors are going to hit their physical limit- not merely the actualization of Moore's law but also the problems with heat dissipation, wire connections and the materials we use to create them. Hence nanotechnology helps us to look at new ways information processing at a better speed and measure. A promising alternative to the imminent challenges from the CMOS based computing is to focus on other alternatives of nano scale precision. Chemically Assembled Electronic Nanotechnology (CAEN) is a promising technology, which uses self-alignment to construct electronic circuits from nano scale devices that take advantage of quantum mechanical effects. This book is intended as an introduction to the field of nanotechnology for nanoelectronics vendors, researchers and students who want to start thinking about the potential opportunities afforded by these emerging scientific developments.
A fully comprehensive examination of state-of-the-art technologies for measurement at the small scale • Highlights the advanced research work from industry and academia in micro-nano devices test technology • Written at both introductory and advanced levels, provides the fundamentals and theories • Focuses on the measurement techniques for characterizing MEMS/NEMS devices
Advances in Information Storage Systems (AISS), volumes 9 & 10, are special volumes which contain selected papers regarding not only information storage but also information equipment in general and related technologies. The papers were presented at the International Conference on Micromechatronics for Information and Precision Equipment (MIPE '97). MIPE '97 was held in Tokyo, Japan, from 20 to 23 July 1997, as one of the memorial events of the Centennial Grand Congress of the Japan Society of Mechanical Engineers.Information and precision equipment is fast-changing high technology, and is necessary for the development of an international multimedia society and essential for the innovation of conventional machines as well as the creation of new sophisticated machines for future medical, biological and cosmic industries in the 21st century. Information and precision equipment can improve their performances by analyzing, designing, fabricating, controlling and then utilizing a smaller and smaller world in space and time. Micromechatronics is not only a major interdisciplinary engineering but also the principle of innovation in such machines.In the light of this, the scope of MIPE '97 ranged from the micromechanics and micromechatronics of information storage, input/output devices, and precision equipment to microtechnologies related to information equipment. The papers in AISS special volumes are mainly related to information storage, particularly magnetic recording storage. But some of them are related to printer, paper-feeding-mechanism and micromachine technologies, which will directly or indirectly contribute future information devices. The papers contained in this series are of international archival quality and are refereed according to rigorous journal standards.Volume 9 contains papers on the mechanics and tribology of magnetic recording storage systems (mainly hard disk drives), while papers on the micromechatronics of the head-positioning system in magnetic disk storage are compiled in Volume 10 together with papers on optical disk storage and others.