Semiconductor Wafer Bonding VIII : Science, Technology, and Applications
Author:
Publisher: The Electrochemical Society
Published: 2005
Total Pages: 476
ISBN-13: 9781566774604
DOWNLOAD EBOOKRead and Download eBook Full
Author:
Publisher: The Electrochemical Society
Published: 2005
Total Pages: 476
ISBN-13: 9781566774604
DOWNLOAD EBOOKAuthor: Helmut Baumgart
Publisher: The Electrochemical Society
Published: 2006
Total Pages: 398
ISBN-13: 156677506X
DOWNLOAD EBOOKThis issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Author:
Publisher: The Electrochemical Society
Published: 2008-10
Total Pages: 588
ISBN-13: 1566776546
DOWNLOAD EBOOKThis issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Author: C. Colinge
Publisher: The Electrochemical Society
Published: 2010-10
Total Pages: 656
ISBN-13: 1566778239
DOWNLOAD EBOOKSemiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Author: C. S. Tan
Publisher: The Electrochemical Society
Published: 2018-09-21
Total Pages: 258
ISBN-13: 1607688514
DOWNLOAD EBOOKAuthor: Peter Ramm
Publisher: John Wiley & Sons
Published: 2012-02-13
Total Pages: 435
ISBN-13: 3527326464
DOWNLOAD EBOOKThe focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Author: Charles E. Hunt
Publisher: The Electrochemical Society
Published: 2001
Total Pages: 498
ISBN-13: 9781566772587
DOWNLOAD EBOOKAuthor:
Publisher: The Electrochemical Society
Published: 2003
Total Pages: 408
ISBN-13: 9781566774024
DOWNLOAD EBOOKAuthor: Markku Tilli
Publisher: Elsevier
Published: 2009-12-08
Total Pages: 670
ISBN-13: 0815519885
DOWNLOAD EBOOKA comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Author: Marin Alexe
Publisher: Springer Science & Business Media
Published: 2004-05-14
Total Pages: 524
ISBN-13: 9783540210498
DOWNLOAD EBOOKDuring the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.