RF and Microwave Microelectronics Packaging
Author: Ken Kuang
Publisher: Springer Science & Business Media
Published: 2009-12-01
Total Pages: 295
ISBN-13: 1441909842
DOWNLOAD EBOOKRF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.