Power Integrity for Nanoscale Integrated Systems
Power Integrity for Nanoscale Integrated Systems

Author: Masanori Hashimoto

Publisher: McGraw Hill Professional

Published: 2014-03-07

Total Pages: 417

ISBN-13: 0071787771

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Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery

Designing Network On-Chip Architectures in the Nanoscale Era
Designing Network On-Chip Architectures in the Nanoscale Era

Author: Jose Flich

Publisher: CRC Press

Published: 2010-12-18

Total Pages: 515

ISBN-13: 1439837112

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Going beyond isolated research ideas and design experiences, Designing Network On-Chip Architectures in the Nanoscale Era covers the foundations and design methods of network on-chip (NoC) technology. The contributors draw on their own lessons learned to provide strong practical guidance on various design issues.Exploring the design process of the

Dependable Multicore Architectures at Nanoscale
Dependable Multicore Architectures at Nanoscale

Author: Marco Ottavi

Publisher: Springer

Published: 2017-08-28

Total Pages: 294

ISBN-13: 3319544225

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This book provides comprehensive coverage of the dependability challenges in today's advanced computing systems. It is an in-depth discussion of all the technological and design-level techniques that may be used to overcome these issues and analyzes various dependability-assessment methods. The impact of individual application scenarios on the definition of challenges and solutions is considered so that the designer can clearly assess the problems and adjust the solution based on the specifications in question. The book is composed of three sections, beginning with an introduction to current dependability challenges arising in complex computing systems implemented with nanoscale technologies, and of the effect of the application scenario. The second section details all the fault-tolerance techniques that are applicable in the manufacture of reliable advanced computing devices. Different levels, from technology-level fault avoidance to the use of error correcting codes and system-level checkpointing are introduced and explained as applicable to the different application scenario requirements. Finally the third section proposes a roadmap of future trends in and perspectives on the dependability and manufacturability of advanced computing systems from the special point of view of industrial stakeholders. Dependable Multicore Architectures at Nanoscale showcases the original ideas and concepts introduced into the field of nanoscale manufacturing and systems reliability over nearly four years of work within COST Action IC1103 MEDIAN, a think-tank with participants from 27 countries. Academic researchers and graduate students working in multi-core computer systems and their manufacture will find this book of interest as will industrial design and manufacturing engineers working in VLSI companies.

Energy Efficient and Reliable Embedded Nanoscale SRAM Design
Energy Efficient and Reliable Embedded Nanoscale SRAM Design

Author: Bhupendra Singh Reniwal

Publisher: CRC Press

Published: 2023-11-30

Total Pages: 213

ISBN-13: 1000985156

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This reference text covers a wide spectrum for designing robust embedded memory and peripheral circuitry. It will serve as a useful text for senior undergraduate and graduate students and professionals in areas including electronics and communications engineering, electrical engineering, mechanical engineering, and aerospace engineering. Discusses low-power design methodologies for static random-access memory (SRAM) Covers radiation-hardened SRAM design for aerospace applications Focuses on various reliability issues that are faced by submicron technologies Exhibits more stable memory topologies Nanoscale technologies unveiled significant challenges to the design of energy- efficient and reliable SRAMs. This reference text investigates the impact of process variation, leakage, aging, soft errors and related reliability issues in embedded memory and periphery circuitry. The text adopts a unique way to explain the SRAM bitcell, array design, and analysis of its design parameters to meet the sub-nano-regime challenges for complementary metal-oxide semiconductor devices. It comprehensively covers low- power-design methodologies for SRAM, exhibits more stable memory topologies, and radiation-hardened SRAM design for aerospace applications. Every chapter includes a glossary, highlights, a question bank, and problems. The text will serve as a useful text for senior undergraduate students, graduate students, and professionals in areas including electronics and communications engineering, electrical engineering, mechanical engineering, and aerospace engineering. Discussing comprehensive studies of variability-induced failure mechanism in sense amplifiers and power, delay, and read yield trade-offs, this reference text will serve as a useful text for senior undergraduate, graduate students, and professionals in areas including electronics and communications engineering, electrical engineering, mechanical engineering, and aerospace engineering. It covers the development of robust SRAMs, well suited for low-power multi-core processors for wireless sensors node, battery-operated portable devices, personal health care assistants, and smart Internet of Things applications.

Circuits at the Nanoscale
Circuits at the Nanoscale

Author: Krzysztof Iniewski

Publisher: CRC Press

Published: 2018-10-08

Total Pages: 602

ISBN-13: 1420070630

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Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.

VLSI
VLSI

Author: Tomasz Wojcicki

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 490

ISBN-13: 1351831437

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Recently the world celebrated the 60th anniversary of the invention of the first transistor. The first integrated circuit (IC) was built a decade later, with the first microprocessor designed in the early 1970s. Today, ICs are a part of nearly every aspect of our daily lives. They help us live longer and more comfortably, and do more, faster. All this is possible because of the relentless search for new materials, circuit designs, and ideas happening on a daily basis at industrial and academic institutions around the globe. Showcasing the latest advances in very-large-scale integrated (VLSI) circuits, VLSI: Circuits for Emerging Applications provides a balanced view of industrial and academic developments beyond silicon and complementary metal–oxide–semiconductor (CMOS) technology. From quantum-dot cellular automata (QCA) to chips for cochlear implants, this must-have resource: Investigates the trend of combining multiple cores in a single chip to boost performance of the overall system Describes a novel approach to enable physically unclonable functions (PUFs) using intrinsic features of a VLSI chip Examines the VLSI implementations of major symmetric and asymmetric key cryptographic algorithms, hash functions, and digital signatures Discusses nonvolatile memories such as resistive random-access memory (Re-RAM), magneto-resistive RAM (MRAM), and floating-body RAM (FB-RAM) Explores organic transistors, soft errors, photonics, nanoelectromechanical (NEM) relays, reversible computation, bioinformatics, asynchronous logic, and more VLSI: Circuits for Emerging Applications presents cutting-edge research, design architectures, materials, and uses for VLSI circuits, offering valuable insight into the current state of the art of micro- and nanoelectronics.

ULSI Process Integration 6
ULSI Process Integration 6

Author: C. Claeys

Publisher: The Electrochemical Society

Published: 2009-09

Total Pages: 547

ISBN-13: 1566777445

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ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).

High-level Estimation and Exploration of Reliability for Multi-Processor System-on-Chip
High-level Estimation and Exploration of Reliability for Multi-Processor System-on-Chip

Author: Zheng Wang

Publisher: Springer

Published: 2017-06-23

Total Pages: 210

ISBN-13: 9811010730

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This book introduces a novel framework for accurately modeling the errors in nanoscale CMOS technology and developing a smooth tool flow at high-level design abstractions to estimate and mitigate the effects of errors. The book presents novel techniques for high-level fault simulation and reliability estimation as well as architecture-level and system-level fault tolerant designs. It also presents a survey of state-of-the-art problems and solutions, offering insights into reliability issues in digital design and their cross-layer countermeasures.

Spintronics
Spintronics

Author: Kaiyou Wang

Publisher: John Wiley & Sons

Published: 2022-07-25

Total Pages: 340

ISBN-13: 1119698979

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Discover the latest advances in spintronic materials, devices, and applications In Spintronics: Materials, Devices and Applications, a team of distinguished researchers delivers a holistic introduction to spintronic effects within cutting-edge materials and applications. Containing the perfect balance of academic research and practical application, the book discusses the potential—and the key limitations and challenges—of spintronic devices. The latest title in the Wiley Series in Materials for Electronic and Optoelectronic Applications, Spintronics: Materials, Devices and Applications explores giant magneto-resistance (GMR) and tunneling magnetic resistance (TMR) materials, spin-transfer torque and spin-orbit torque materials, spin oscillators, and spin materials for use in artificial neural networks. Applications in multi-ferroelectric and antiferromagnetic materials are presented as well. This book also includes: A thorough introduction to recent research developments in the fields of spintronic materials, devices, and applications Comprehensive explorations of skymions, magnetic semiconductors, and antiferromagnetic materials Practical discussions of spin-transfer torque materials and devices for magnetic random-access memory In-depth examinations of giant magneto-resistance materials and devices for magnetic sensors Perfect for advanced students and researchers in materials science, physics, electronics, and computer science, Spintronics: Materials, Devices and Applications will also earn a place in the libraries of professionals working in the manufacture of optics, photonics, and nanometrology equipment.

Network-on-Chip Architectures
Network-on-Chip Architectures

Author: Chrysostomos Nicopoulos

Publisher: Springer Science & Business Media

Published: 2009-09-18

Total Pages: 237

ISBN-13: 904813031X

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[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.