GaAs MMIC Reliability - High Temperature Behavior
Author: Aris Christou
Publisher: RIAC
Published: 2006
Total Pages: 260
ISBN-13: 1933904100
DOWNLOAD EBOOKRead and Download eBook Full
Author: Aris Christou
Publisher: RIAC
Published: 2006
Total Pages: 260
ISBN-13: 1933904100
DOWNLOAD EBOOKAuthor: A. Christou
Publisher:
Published: 1992-12-15
Total Pages: 488
ISBN-13:
DOWNLOAD EBOOKA team of internationally renowned experts contribute articles which emphasize the reliability and quality issues inherent in all phases of systems design. Coverage includes fundamental failure modes of each of the device building blocks, packaged MMIC modules, current practical aspects of reliability testing and much more.
Author: Norman G. Einspruch
Publisher: Academic Press
Published: 2014-12-01
Total Pages: 472
ISBN-13: 1483217779
DOWNLOAD EBOOKVLSI Electronics Microstructure Science, Volume 11: GaAs Microelectronics presents the important aspects of GaAs (Gallium Arsenide) IC technology development ranging from materials preparation and IC fabrication to wafer evaluation and chip packaging. The volume is comprised of eleven chapters. Chapter 1 traces the historical development of GaAs technology for high-speed and high-frequency applications. This chapter summarizes the important properties of GaAs that serve to make this material and its related compounds technologically important. Chapter 2 covers GaAs substrate growth, ion implantation and annealing, and materials characterization, technologies that are essential for IC development. Chapters 3-6 describe the various IC technologies that are currently under development. These include microwave and digital MESFET ICs, the most mature technologies, and bipolar and field-effect heterostructure transistor ICs. The high-speed capability of GaAs ICs introduces new problems, on-wafer testing and packaging. These topics are discussed in Chapters 7 and 8. Applications for GaAs ICs are covered in Chapters 9 and 10. The first of these chapters is concerned with high speed computer applications; the second addresses military applications. The book concludes with a chapter on radiation effects in GaAs ICs. Scientists, engineers, researchers, device designers, and systems architects will find the book useful.
Author:
Publisher: ASM International
Published: 1989-11-01
Total Pages: 1234
ISBN-13: 9780871702852
DOWNLOAD EBOOKVolume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Milton Ohring
Publisher: Academic Press
Published: 2014-10-14
Total Pages: 759
ISBN-13: 0080575528
DOWNLOAD EBOOKReliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author:
Publisher: ASM International
Published: 2002-01-01
Total Pages: 160
ISBN-13: 0871707691
DOWNLOAD EBOOKProvides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Author:
Publisher: ASM International
Published: 2004-01-01
Total Pages: 813
ISBN-13: 0871708043
DOWNLOAD EBOOKFor newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Author:
Publisher: Elsevier
Published: 1995-09-27
Total Pages: 385
ISBN-13: 0080532292
DOWNLOAD EBOOKGallium Arsenide IC Applications Handbook is the first text to offer a comprehensive treatment of Gallium Arsenide (GaAs) integrated chip (IC) applications, specifically in microwave systems. The books coverage of GaAs in microwave monolithic ICs demonstrates why GaAs is being hailed as a material of the future for the various advantages it holds over silicon. This volume provides scientists, physicists, electrical engineers, and technology professionals and managers working on microwave technology with practical information on GaAs applications in radar, electronic warfare, communications, consumer electronics, automotive electronics and traffic control. Includes an executive summary in each volume and chapter Facilitates comprehension with its tutorial writing style Covers key technical issues Emphasizes practical aspects of the technology Contains minimal mathematics Provides a complete reference list
Author: Aris Christou
Publisher:
Published: 1995-09
Total Pages: 478
ISBN-13: 9780471961611
DOWNLOAD EBOOKMonolithic microwave integrated circuits are totally integrated structures which contain planar transmission lines, distributed elements and active devices on the same substrate. The discussions in the chapters are related to MMICs which operate in the frequency range of 1 to 20 GHz, and for MMICs which may operate even up to 94 GHz due to the incorporation of advanced structures such as High Electron Mobility Transistors. Such MMICs are applied in telecommunication systems, in TV receivers for satellite broadcasting, and in radar and navigation systems. Reliability stands for the complicated circuit performance related to specifications, stability and ultimately catastrophic failure. The book therefore focuses on the physical, chemical and electrical mechanisms which cause circuit drift, inaccuracies and degradation of circuit function.
Author: R. Szweda
Publisher: Elsevier
Published: 2000-12-05
Total Pages: 429
ISBN-13: 0080532284
DOWNLOAD EBOOKThe third edition of this highly respected market study provides a detailed insight into the global developments of the GaAs industry to 2004, and the implications for both suppliers and users of GaAs technology. The report has been completely revised and updated with a new chapter added on competitive technologies. The report also supplies market analysis by component type and application sectors.For a PDF version of the report please call Tina Enright on +44 (0) 1865 843008 for price details.