Proceedings of the ... International Symposium on Microelectronics
Author:
Publisher:
Published: 1995
Total Pages: 592
ISBN-13:
DOWNLOAD EBOOKRead and Download eBook Full
Author:
Publisher:
Published: 1995
Total Pages: 592
ISBN-13:
DOWNLOAD EBOOKAuthor: International Symposium on Microelectronics
Publisher:
Published: 1995
Total Pages: 584
ISBN-13: 9780930815448
DOWNLOAD EBOOKAuthor: International Society for Hybrid Microelectronics
Publisher:
Published: 1989
Total Pages: 708
ISBN-13:
DOWNLOAD EBOOKAuthor: International Society for Hybrid Microelectronics
Publisher:
Published: 1992
Total Pages: 776
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 1995
Total Pages: 588
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 2000
Total Pages: 916
ISBN-13:
DOWNLOAD EBOOKThis text constitutes proceedings from the International Symposium on Microelectronics that took place in Boston, Massachusetts in September, 2000.
Author:
Publisher:
Published: 2003
Total Pages: 1046
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 1989
Total Pages: 754
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher: ASM International
Published: 1989-11-01
Total Pages: 1234
ISBN-13: 9780871702852
DOWNLOAD EBOOKVolume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Mel Schwartz
Publisher: CRC Press
Published: 2008-11-20
Total Pages: 556
ISBN-13: 1420043730
DOWNLOAD EBOOKExplores State-of-the-Art Work from the World's Foremost Scientists, Engineers, Educators, and Practitioners in the FieldWhy use smart materials?Since most smart materials do not add mass, engineers can endow structures with built-in responses to a myriad of contingencies. In their various forms, these materials can adapt to their environments by c