Proceeding of Fifth International Conference on Microelectronics, Computing and Communication Systems
Proceeding of Fifth International Conference on Microelectronics, Computing and Communication Systems

Author: Vijay Nath

Publisher: Springer Nature

Published: 2021-09-09

Total Pages: 855

ISBN-13: 9811602751

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This book presents high-quality papers from the Fifth International Conference on Microelectronics, Computing & Communication Systems (MCCS 2020). It discusses the latest technological trends and advances in MEMS and nanoelectronics, wireless communication, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems and sensor network applications. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements and testing. The applications and solutions discussed here provide excellent reference material for future product development.

Handbook of Adhesives and Sealants
Handbook of Adhesives and Sealants

Author: Philippe Cognard

Publisher: Elsevier

Published: 2005-07-14

Total Pages: 511

ISBN-13: 0080534090

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Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. - Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives - Every scientific and technical issue concerning every chemical type in every industry - Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways

Electronic Materials Handbook
Electronic Materials Handbook

Author:

Publisher: ASM International

Published: 1989-11-01

Total Pages: 1234

ISBN-13: 9780871702852

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Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.