Proceedings of International Conference in Mechanical and Energy Technology

Proceedings of International Conference in Mechanical and Energy Technology

Author: Sanjay Yadav

Publisher: Springer Nature

Published: 2020-06-01

Total Pages: 799

ISBN-13: 9811526478

DOWNLOAD EBOOK

This book presents selected peer-reviewed papers from the International Conference on Mechanical and Energy Technologies, which was held on 7–8 November 2019 at Galgotias College of Engineering and Technology, Greater Noida, India. The book reports on the latest developments in the field of mechanical and energy technology in contributions prepared by experts from academia and industry. The broad range of topics covered includes aerodynamics and fluid mechanics, artificial intelligence, nonmaterial and nonmanufacturing technologies, rapid manufacturing technologies and prototyping, remanufacturing, renewable energies technologies, metrology and computer-aided inspection, etc. Accordingly, the book offers a valuable resource for researchers in various fields, especially mechanical and industrial engineering, and energy technologies.


Nanopackaging

Nanopackaging

Author: James E. Morris

Publisher: Springer

Published: 2018-09-22

Total Pages: 1007

ISBN-13: 3319903624

DOWNLOAD EBOOK

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.


Proceedings of International Conference on Recent Trends in Machine Learning, IoT, Smart Cities and Applications

Proceedings of International Conference on Recent Trends in Machine Learning, IoT, Smart Cities and Applications

Author: Vinit Kumar Gunjan

Publisher: Springer Nature

Published: 2020-10-17

Total Pages: 998

ISBN-13: 9811572348

DOWNLOAD EBOOK

This book gathers selected research papers presented at the International Conference on Recent Trends in Machine Learning, IOT, Smart Cities & Applications (ICMISC 2020), held on 29–30 March 2020 at CMR Institute of Technology, Hyderabad, Telangana, India. Discussing current trends in machine learning, Internet of things, and smart cities applications, with a focus on multi-disciplinary research in the area of artificial intelligence and cyber-physical systems, this book is a valuable resource for scientists, research scholars and PG students wanting formulate their research ideas and find the future directions in these areas. Further, it serves as a reference work anyone wishing to understand the latest technologies used by practicing engineers around the globe.


Proceedings of the 2015 Chinese Intelligent Systems Conference

Proceedings of the 2015 Chinese Intelligent Systems Conference

Author: Yingmin Jia

Publisher: Springer

Published: 2015-12-11

Total Pages: 454

ISBN-13: 3662483653

DOWNLOAD EBOOK

This book presents selected research papers from the 2015 Chinese Intelligent Systems Conference (CISC’15), held in Yangzhou, China. The topics covered include multi-agent systems, evolutionary computation, artificial intelligence, complex systems, computation intelligence and soft computing, intelligent control, advanced control technology, robotics and applications, intelligent information processing, iterative learning control, and machine learning. Engineers and researchers from academia, industry and the government can gain valuable insights into solutions combining ideas from multiple disciplines in the field of intelligent systems.


Extreme Environment Electronics

Extreme Environment Electronics

Author: John D. Cressler

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 1044

ISBN-13: 1351832808

DOWNLOAD EBOOK

Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.


Design of 3D Integrated Circuits and Systems

Design of 3D Integrated Circuits and Systems

Author: Rohit Sharma

Publisher: CRC Press

Published: 2018-09-03

Total Pages: 302

ISBN-13: 1466589426

DOWNLOAD EBOOK

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.


ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis

ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis

Author: ASM International

Publisher: ASM International

Published: 2018-12-01

Total Pages: 593

ISBN-13: 1627080996

DOWNLOAD EBOOK

The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.


Design, Performance, and Analysis of Innovative Information Retrieval

Design, Performance, and Analysis of Innovative Information Retrieval

Author: Lu, Zhongyu (Joan)

Publisher: IGI Global

Published: 2012-08-31

Total Pages: 508

ISBN-13: 1466619767

DOWNLOAD EBOOK

Daily procedures such as scientific experiments and business processes have the potential to create a huge amount of data every day, hour, or even second, and this may lead to a major problem for the future of efficient data search and retrieval as well as secure data storage for the world’s scientists, engineers, doctors, librarians, and business managers. Design, Performance, and Analysis of Innovative Information Retrieval examines a number of emerging technologies that significantly contribute to modern Information Retrieval (IR), as well as fundamental IR theories and concepts that have been adopted into new tools or systems. This reference is essential to researchers, educators, professionals, and students interested in the future of IR.


Printed Batteries

Printed Batteries

Author: Senentxu Lanceros-Méndez

Publisher: John Wiley & Sons

Published: 2018-02-21

Total Pages: 256

ISBN-13: 1119287898

DOWNLOAD EBOOK

Offers the first comprehensive account of this interesting and growing research field Printed Batteries: Materials, Technologies and Applications reviews the current state of the art for printed batteries, discussing the different types and materials, and describing the printing techniques. It addresses the main applications that are being developed for printed batteries as well as the major advantages and remaining challenges that exist in this rapidly evolving area of research. It is the first book on printed batteries that seeks to promote a deeper understanding of this increasingly relevant research and application area. It is written in a way so as to interest and motivate readers to tackle the many challenges that lie ahead so that the entire research community can provide the world with a bright, innovative future in the area of printed batteries. Topics covered in Printed Batteries include, Printed Batteries: Definition, Types and Advantages; Printing Techniques for Batteries, Including 3D Printing; Inks Formulation and Properties for Printing Techniques; Rheological Properties for Electrode Slurry; Solid Polymer Electrolytes for Printed Batteries; Printed Battery Design; and Printed Battery Applications. Covers everything readers need to know about the materials and techniques required for printed batteries Informs on the applications for printed batteries and what the benefits are Discusses the challenges that lie ahead as innovators continue with their research Printed Batteries: Materials, Technologies and Applications is a unique and informative book that will appeal to academic researchers, industrial scientists, and engineers working in the areas of sensors, actuators, energy storage, and printed electronics.


Modeling and Application of Flexible Electronics Packaging

Modeling and Application of Flexible Electronics Packaging

Author: YongAn Huang

Publisher: Springer

Published: 2019-04-23

Total Pages: 297

ISBN-13: 981133627X

DOWNLOAD EBOOK

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.