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Author: Dave S. Steinberg
Publisher: Wiley-Interscience
Published: 2001-07-11
Total Pages: 312
ISBN-13:
DOWNLOAD EBOOKThis book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.
Author: Steinberg
Publisher:
Published: 2002-02-01
Total Pages:
ISBN-13: 9780471221302
DOWNLOAD EBOOKAuthor: Dave S. Steinberg
Publisher: Wiley-Interscience
Published: 2000-07-11
Total Pages: 0
ISBN-13: 9780471376859
DOWNLOAD EBOOKThis book deals with the analysis of various types of vibration environments that can lead to the failure of electronic systems or components.
Author: S.O. Reza Moheimani
Publisher: Springer Science & Business Media
Published: 2006-06-29
Total Pages: 282
ISBN-13: 1846283329
DOWNLOAD EBOOKThis book presents recent developments in vibration control systems that employ embedded piezoelectric sensors and actuators, reviewing ways in which active vibration control systems can be designed for piezoelectric laminated structures, paying distinct attention to how such control systems can be implemented in real time. Includes numerous examples and experimental results obtained from laboratory-scale apparatus, with details of how similar setups can be built.
Author: Ephraim Suhir
Publisher: John Wiley & Sons
Published: 2011-04-04
Total Pages: 610
ISBN-13: 047088679X
DOWNLOAD EBOOKThe proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
Author: Gordon N. Ellison
Publisher:
Published: 1989
Total Pages: 424
ISBN-13:
DOWNLOAD EBOOKAuthor: Wayne Anderson
Publisher: CRC Press
Published: 1988-01-29
Total Pages: 406
ISBN-13: 9780824778255
DOWNLOAD EBOOKThis book discusses the pump's role in electrohydraulic systems and its use as a power source to a control loop, and provides a good understanding of the basics, complemented by working knowledge of the "real world." It is intended for engineers and students who have studied feedback control theory.
Author: Tibor Grasser
Publisher: Springer Science & Business Media
Published: 2013-10-22
Total Pages: 805
ISBN-13: 1461479096
DOWNLOAD EBOOKThis book provides a single-source reference to one of the more challenging reliability issues plaguing modern semiconductor technologies, negative bias temperature instability. Readers will benefit from state-of-the art coverage of research in topics such as time dependent defect spectroscopy, anomalous defect behavior, stochastic modeling with additional metastable states, multiphonon theory, compact modeling with RC ladders and implications on device reliability and lifetime.
Author: Andrew E. Perkins
Publisher: Springer Science & Business Media
Published: 2008-12-16
Total Pages: 202
ISBN-13: 0387793941
DOWNLOAD EBOOKSolder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Author: Colin Hansen
Publisher: CRC Press
Published: 2012-11-02
Total Pages: 1564
ISBN-13: 1482234009
DOWNLOAD EBOOKIntegrating active control of both sound and vibration, this comprehensive two-volume set combines coverage of fundamental principles with the most recent theoretical and practical developments. The authors explain how to design and implement successful active control systems in practice and detail the pitfalls one must avoid to ensure a reliable and stable system. Extensively revised, updated, and expanded throughout, the second edition reflects the advances that have been made in algorithms, DSP hardware, and applications since the publication of the first edition.
