Ken Gilleo's Polymer Thick Film provides you with all the essential concepts, process descriptions, performance data, and general information you will need to reach your own conclusions. The focus will be on polymer thick film's major subsets, which include conductive inks, printed resistors, dielectric films or pastes, and polymer assembly material.
Polymer films now play an essential and growing role in sensors. Recent advances in polymer science and film preparation have made polymer films useful, practical and economical in a wide range of sensor designs and applications. Further, the continuing miniaturization of microelectronics favors the use of polymer thin films in sensors. This new book is the first comprehensive presentation of this technology. It covers both scientific fundamentals and practical engineering aspects. Included is an extensive survey of all types of sensors and applications. The very detailed table of contents in the next pages provides full information on content. More than 200 schematics illustrate a wide variety of sensor structures and their function.
Ch. 1. Block copolymer thin films / J.-Y. Wang, S. Park and T. P. Russell -- ch. 2. Equilibration of block copolymer films on chemically patterned surfaces / G. S. W. Craig, H. Kang and P. F. Nealey -- ch. 3. Structure formation and evolution in confined cylinder-forming block copolymers / G. J. A. Sevink and J. G. E. M. Fraaije -- ch. 4. Block copolymer lithography for magnetic device fabrication / J. Y. Cheng and C. A. Ross -- ch. 5. Hierarchical structuring of polymer nanoparticles by self-organization / M. Shimomura ... [et al.] -- ch. 6. Wrinkling polymers for surface structure control and functionality / E. P. Chan and A. J. Crosby -- ch. 7. Crystallization in polymer thin films: morphology and growth / R. M. Van Horn and S. Z. D. Cheng -- ch. 8. Friction at soft polymer surface / M. K. Chaudhury, K. Vorvolakos and D. Malotky -- ch. 9. Relationship between molecular architecture, large-strain mechanical response and adhesive performance of model, block copolymer-based pressure sensitive adhesives / C. Creton and K. R. Shull -- ch. 10. Stability and dewetting of thin liquid films / K. Jacobs, R. Seemann and S. Herminghaus -- ch. 11. Anomalous dynamics of polymer Films / O. K. C. Tsui.
Polymer films now play an essential and growing role in sensors. Recent advances in polymer science and film preparation have made polymer films useful, practical and economical in a wide range of sensor designs and applications. Further, the continuing miniaturization of microelectronics favors the use of polymer thin films in sensors. This new book is the first comprehensive presentation of this technology. It covers both scientific fundamentals and practical engineering aspects. Included is an extensive survey of all types of sensors and applications. The very detailed table of contents in the next pages provides full information on content. More than 200 schematics illustrate a wide variety of sensor structures and their function.
Direct-Write Technologies covers applications, materials, and the techniques in using direct-write technologies. This book provides an overview of the different direct write techniques currently available, as well as a comparison between the strengths and special attributes for each of the techniques. The techniques described open the door for building prototypes and testing materials. The book also provides an overview of the state-of-the-art technology involved in this field. Basic academic researchers and industrial development engineers who pattern thin film materials will want to have this text on their shelves as a resource for specific applications. Others in this or related fields will want the book to read the introductory material summarizing isuses common to all approaches, in order to compare and contrast different techniques. Everyday applications include electronic components and sensors, especially chemical and biosensors. There is a wide range of research and development problems requiring state-of-the-art direct write tools. This book will appeal to basic researchers and development engineers in university engineering departments and at industrial and national research laboratories. This text should appeal equally well in the United States, Asia, and Europe. Both basic academic researchers and industrial development engineers who pattern thin film materials will want to have this text on their shelves as a resource for specific applications. An overview of the different direct write techniques currently available A comparison between the strengths and special attributes for each of the techniques An overview of the state-of-the-art technology involved in this field
Presents more than 120 expert failure analysis case histories from industries including automotive, aerospace, utilities, oil and gas, petrochemical, biomedical, ground transportation, off-highway vehicles, and more. Volume 2 builds on the tremendous acceptance of Volume 1 by the failure analysis community. The two volumes can also be purchased as a set for a special discounted price. Learn how others have investigated and solved failures in various industries involving a wide range of failure modes, materials, and analysis techniques.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.
August 13-14 2018 Dublin, Ireland Key Topics : Advanced Energy Materials, Hydrogen Energy, Solar Energy Materials, Polymer Materials, Advanced Nanomaterials, Energy Harvesting Materials, Nanotechnology and Energy Materials, Batteries and Energy Materials, Electric, Hybrid, and Fuel-Cell Vehicles, Mining, Metallurgy & Materials Science, Advanced Graphene Materials, Solid Electrolytes, Biomaterials and Surface Science Engineering, Electrical, Optical and Magnetic Materials, Fuel Cell Technology,
This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered the development of many new and improved coating polymers and formulations. Both the theoretical aspects of coatings (molecular structure of polymer types and their correlation with electrical and physical properties) and applied aspects (functions, deposition processes, applications, testing) are covered in the book. Over 100 proprietary coating formulations were reviewed, their properties collated, and tables of comparative properties prepared. This book is useful as both a primer and as a handbook for collecting properties data.
