Masters Theses in the Pure and Applied Sciences

Masters Theses in the Pure and Applied Sciences

Author: Wade H. Shafer

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 350

ISBN-13: 1461528321

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Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1 957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 36 (thesis year 1991) a total of 11,024 thesis titles from 23 Canadian and 161 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this important annual reference work. While Volume 36 reports theses submitted in 1991, on occasion, certain univer sities do report theses submitted in previous years but not reported at the time.


Plasma Etch Characteristics of Nitrogen Trifluoride Gas Mixtures

Plasma Etch Characteristics of Nitrogen Trifluoride Gas Mixtures

Author: John A. Barkanic

Publisher:

Published: 2004

Total Pages:

ISBN-13:

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Plasma etching was investigated using NF3 mixtures to generate a low-pressure reactive plasma. Nitrogen trifluoride was mixed with combinations of argon, CF2Cl2 or chlorine. Plasma pressure, power density and chemical composition were varied. Silicon and silicon dioxide reaction rates and silicon to silicon dioxide reaction selectivity were established. The etch anisotropy obtained from a patterning process was also investigated.