Dry Etching Technology for Semiconductors
Dry Etching Technology for Semiconductors

Author: Kazuo Nojiri

Publisher: Springer

Published: 2014-10-25

Total Pages: 126

ISBN-13: 3319102958

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This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.

Glow Discharge Processes
Glow Discharge Processes

Author: Brian Chapman

Publisher: Wiley-Interscience

Published: 1980

Total Pages: 434

ISBN-13:

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Develops detailed understanding of the deposition and etching of materials by sputtering discharge, and of etching of materials by chemically active discharge. Treats glow discharge at several levels from basic phenomena to industrial applications--practical techniques diligently related to fundamentals. Subjects range from voltage, distributions encountered in plasma etching systems to plasma-electron interactions that contribute to sustaining the discharge.

GaN and Related Materials
GaN and Related Materials

Author: Stephen J. Pearton

Publisher: CRC Press

Published: 2021-10-08

Total Pages: 556

ISBN-13: 1000448428

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Presents views on current developments in heat and mass transfer research related to the modern development of heat exchangers. Devotes special attention to the different modes of heat and mass transfer mechanisms in relation to the new development of heat exchangers design. Dedicates particular attention to the future needs and demands for further development in heat and mass transfer. GaN and related materials are attracting tremendous interest for their applications to high-density optical data storage, blue/green diode lasers and LEDs, high-temperature electronics for high-power microwave applications, electronics for aerospace and automobiles, and stable passivation films for semiconductors. In addition, there is great scientific interest in the nitrides, because they appear to form the first semiconductor system in which extended defects do not severely affect the optical properties of devices. This series provides a forum for the latest research in this rapidly-changing field, offering readers a basic understanding of new developments in recent research. Series volumes feature a balance between original theoretical and experimental research in basic physics, device physics, novel materials and quantum structures, processing, and systems.

Atomic Layer Deposition for Semiconductors
Atomic Layer Deposition for Semiconductors

Author: Cheol Seong Hwang

Publisher: Springer Science & Business Media

Published: 2013-10-18

Total Pages: 266

ISBN-13: 146148054X

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Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.

Advanced Plasma Technology
Advanced Plasma Technology

Author: Riccardo d'Agostino

Publisher: John Wiley & Sons

Published: 2008-09-08

Total Pages: 479

ISBN-13: 3527622195

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A panel of internationally renowned scientists discuss the latest results in plasma technology. This volume has been compiled with both a didactic approach and an overview of the newest achievements for industrial applications. It is divided into two main sections. One is focused on fundamental technology, including plasma production and control, high-pressure discharges, modeling and simulation, diagnostics, dust control, and etching. The section on application technology covers polymer treatments, silicon solar cell, coating and spray, biomaterials, sterilization and waste treatment, plasma propulsion, plasma display panels, and anti-corrosion coatings. The result is an indispensable work for physicists, chemists and engineers involved in the field of plasma technology.