This monograph describes the physical principles of adhesion between particles and surfaces. These principles are applied to pharmaceutical processes involved in the manufacture of solid dosage forms such as powders, granules, tablets and dry powder inhalations. To help in the understanding of these systems, physical properties of solid surfaces, and an introduction to the theory of friction is given. Techniques for measuring particle adhesion and fracture mechanical properties of powders are introduced, as far as these are relevant to the processes discussed. The philosophy of the book deviates from that of standard pharmaceutical textbooks, in that it focuses primarily on physical principles involved in the manufacture of dosage forms rather than describing these processes purely by observation.
Intermolecular and Surface Forces describes the role of various intermolecular and interparticle forces in determining the properties of simple systems such as gases, liquids and solids, with a special focus on more complex colloidal, polymeric and biological systems. The book provides a thorough foundation in theories and concepts of intermolecular forces, allowing researchers and students to recognize which forces are important in any particular system, as well as how to control these forces. This third edition is expanded into three sections and contains five new chapters over the previous edition. - Starts from the basics and builds up to more complex systems - Covers all aspects of intermolecular and interparticle forces both at the fundamental and applied levels - Multidisciplinary approach: bringing together and unifying phenomena from different fields - This new edition has an expanded Part III and new chapters on non-equilibrium (dynamic) interactions, and tribology (friction forces)
This work comprises the proceedings of the Fourth Symposium on Particles on Surfaces. Papers cover: adhesion-induced deformations of particles on surfaces; the use of atomic force microscopy in probing particle-particle adhesion; particle contamination in microelectronics, on spacecraft, and on optical surfaces; the role of air ionization in reducing surface contamination by particles in the cleanroom; abrasive blasting media for contamination-free deburring processes; and more.;The book is intended for physical, chemical, surface and colloid chemists, materials scientists; polymers, plastics, electrical and electronics, computer, chemical and mechanical engineers; and upper-level undergraduate and graduate students in these disciplines.
Whenever a curved surface interacts with another surface, the principles of adhesion are at work. From the cells in your body to the dust on your glasses, intermolecular forces cause materials to attract one another. Elastic deformations resulting from these adhesive interactions store strain that can be liberated during particle detachment. Time dependent changes in adhesion can result from plastic deformation that both increases the real effective contact area and reduces the stored energy available to assist in particle removal. Processes such as these, based on the fundamentals tenets of particle adhesion, are now finding applications across many disciplines leading to a rich and rapid development of knowledge. This book documents the use of particle adhesion concepts in a variety of disciplines. Fields as varied as the cleaning of semiconductors, to the controlling of cancer metastasis, to the abatement of environmental pollution all benefit from applications of particle adhesion concepts.
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
This volume documents the proceedings of the Second Symposium on Particles on Surfaces: Detection, Adhesion and Removal held as part of the 19th Annual Meeting of the Fine Particle Society in Santa Clara, California, July 20-25, 1988. The premier symposium on this topic was l organized in 1986 and has been properly chronicled . Based on the success of these two events and the high interest evinced by the technical community, we plan to regularly hold symposia on this topic on a biennial basis and the next one is slated for August 20-24, 1990 in San Diego, California. l As pointed out in the Preface to the first volume , the topic of particles on surfaces is of paramount importance in legion of technological areas. Particularly in the semiconductor device fabrication area, all signals indicate that the understanding of the behavior of particles on surfaces and their removal will attain heightened importance in the times to come. As the device dimensions are shrinking at an accelerated pace, so the benign particles of today will become the killer defects in the not too distant future. The tempo of research and development activity in the field of particles on surfaces is very high, and better and novel ways are continuously being devised to remove smaller and smaller particles.
This volume documents the proceedings of the 7th International Symposium on Particles on Surfaces: Detection, Adhesion and Removal held in Newark, NJ, June 19-21, 2000. The study of particles on surfaces is extremely important in a host of diverse technological areas, ranging from microelectronics to optics to biomedical. This volume contains a total of 28 papers, which were all properly peer reviewed, revised and edited before inclusion. Therefore, this book is not merely a collection of unreviewed manuscripts, but rather represents information which has passed peer scrutiny. Furthermore, the authors were asked to update their manuscripts, so the information contained in this book should be current and fresh. This volume is divided into two parts: 1) Particle Analysis and General Cleaning-Related Topics; and 2) Particle Adhesion and Removal. The topics covered include: surface analysis techniques for particle identification; cleaning, rinsing and drying issues in post-CMP cleaning; fundamental forces involved in particle adhesion; factors affecting adhesion of small (nanosize) particles; factors important in particle detachment; particle adhesion measurement by AFM; various (wet and dry) techniques for particle removal, e.g., laser, ultrasonic, megasonic, use of surfactants; toner particles and pharmaceutical particles. This volume offers a wealth of information on the tremendously technologically important field of particles on surfaces and should provide a consolidated source of current R&D activity in this arena. Therefore, it will be of value and use to anyone interested in the topic of particles on surfaces.
This volume documents the Proceedings of the 5th and 6th Symposia on Particles on Surfaces: Detection, Adhesion and Removal, held under the aegis of the Fine Particle Society in Chicago (May 6--9, 1996) and Dallas (April 1--3, 1998), respectively. The technical programs clearly reflected an interest and need to ameliorate the existing methods and to devise new and more efficient ways to detect, analyze and characterize particles on surfaces. The removal of particles from a host of surfaces was especially highlighted; the need to remove smaller and smaller particles was particularly underscored. All manuscripts included in this volume were properly peer reviewed and all were revised before inclusion in this volume. Thus, this book is not a mere collection of unreviewed papers, but represents information that has passed peer scrutiny. Furthermore, the authors of the 5th Symposium were asked to update the information. So, the information presented in this book should be as fresh and up-to-date as possible. This volume is divided into two parts: Part 1. General Papers and Part 2. Particle Adhesion and Removal. The topics covered include: high-sensitivity rapid detection of particles; detection of particles using evanescent wave scattering; particles on the backside of wafers; particle shedding from fluid-handling components; dynamics of particle adhesion; particle dispersion/aggregation; precision cleaning; and particle removal by surfactants, supercritical fluids, hydrodynamic forces, high-speed droplet impinging, megasonic, CO2 blasting, CO2 snow, argon aerosol, lasers, microcluster beams, brush and chemical-mechanical methods. This volume offers bountiful information and represent a current commentary on the R&D activity taking place in the area of particles on surfaces, particularly particle removal from a variety of surfaces.
The book provides a comprehensive and easily accessible reference source covering all important aspects of particle adhesion and removal. The core objective is to cover both fundamental and applied aspects of particle adhesion and removal with emphasis on recent developments. Among the topics to be covered include: 1. Fundamentals of surface forces in particle adhesion and removal. 2. Mechanisms of particle adhesion and removal. 3. Experimental methods (e.g. AFM, SFA,SFM,IFM, etc.) to understand particle-particle and particle-substrate interactions. 4. Mechanics of adhesion of micro- and nanoscale particles. 5. Various factors affecting particle adhesion to a variety of substrates. 6. Surface modification techniques to modulate particle adhesion. 7. Various cleaning methods (both wet & dry) for particle removal. 8. Relevance of particle adhesion in a host of technologies ranging from simple to ultra-sophisticated.
This volume chronicles the proceedings of the 9th International Symposium on Particles on Surfaces: Detection, Adhesion and Removal held in Philadelphia, PA, June 2004. The study of particles on surfaces is crucially important in a legion of diverse technological areas, ranging from microelectronics to biomedical to space. This volume contains a total of 21 papers covering many ramifications of particles on surfaces, ranging from detection to removal. All manuscripts were rigorously peer-reviewed and revised, and properly edited before inclusion in this book. The topics covered include: imaging and analysis of macro and nanosize particles and surface features; determination of particles on surfaces; laser inactivation on surfaces; laser-assisted nanofabrication on surfaces; post-CMP cleaning process; pre-gate cleaning; solar panel obscuration in the Martian atmosphere; adhesion and friction of microsized particles; microroughness of textile fibers and capture of particles; factors affecting particle adhesion and removal; various techniques for cleaning or removal of particles from different substrates including laser, combination of laser-induced shockwave and explosive vaporization of liquid, attenuated total internal reflection of laser light, CO2 snow, use of dense phase fluids, use of surfactants and impinging air jet; and removal of sub-100-nm particles.
