In this book, internationally recognized researchers give a state-of-the-art overview of the electronic device architectures required for the nano-CMOS era and beyond. Challenges relevant to the scaling of CMOS nanoelectronics are addressed through different core CMOS and memory device options in the first part of the book. The second part reviews new device concepts for nanoelectronics beyond CMOS. The book covers the fundamental limits of core CMOS, improving scaling by the introduction of new materials or processes, new architectures using SOI, multigates and multichannels, and quantum computing.
Reports NIST research and development in the physical and engineering sciences in which the Institute is active. These include physics, chemistry, engineering, mathematics, and computer sciences. Emphasis on measurement methodology and the basic technology underlying standardization.
Computing and information and communications technology (ICT) has dramatically changed how we work and live, has had profound effects on nearly every sector of society, has transformed whole industries, and is a key component of U.S. global leadership. A fundamental driver of advances in computing and ICT has been the fact that the single-processor performance has, until recently, been steadily and dramatically increasing year over years, based on a combination of architectural techniques, semiconductor advances, and software improvements. Users, developers, and innovators were able to depend on those increases, translating that performance into numerous technological innovations and creating successive generations of ever more rich and diverse products, software services, and applications that had profound effects across all sectors of society. However, we can no longer depend on those extraordinary advances in single-processor performance continuing. This slowdown in the growth of single-processor computing performance has its roots in fundamental physics and engineering constraints-multiple technological barriers have converged to pose deep research challenges, and the consequences of this shift are deep and profound for computing and for the sectors of the economy that depend on and assume, implicitly or explicitly, ever-increasing performance. From a technology standpoint, these challenges have led to heterogeneous multicore chips and a shift to alternate innovation axes that include, but are not limited to, improving chip performance, mobile devices, and cloud services. As these technical shifts reshape the computing industry, with global consequences, the United States must be prepared to exploit new opportunities and to deal with technical challenges. The New Global Ecosystem in Advanced Computing: Implications for U.S. Competitiveness and National Security outlines the technical challenges, describe the global research landscape, and explore implications for competition and national security.
The thermal processing of materials ranges from few fem to seconds by Swift Heavy Ion Implantation to about one second using advanced Rapid Thermal Annealing. This book offers after an historical excursus selected contributions on fundamental and applied aspects of thermal processing of classical elemental semiconductors and other advanced materials including nanostructures with novel optoelectronic, magnetic, and superconducting properties. Special emphasis is given on the diffusion and segregation of impurity atoms during thermal treatment. A broad range of examples describes the solid phase and/or liquid phase processing of elemental and compound semiconductors, dielectric composites and organic materials.
Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices (both active and passive) represents a significant advantage for the reader. Indeed, several kinds of semiconductor devices are routinely encountered in a single IC design or in a single modeling support group. Compact Modeling includes mostly the material that after several years of IC design applications has been found both theoretically sound and practically significant. Assigning the individual chapters to the groups responsible for the definitive work on the subject assures the highest possible degree of expertise on each of the covered models.
