Natural Convective Heat Transfer from Narrow Plates deals with a heat transfer situation that is of significant practical importance but which is not adequately dealt with in any existing textbooks or in any widely available review papers. The aim of the book is to introduce the reader to recent studies of natural convection from narrow plates including the effects of plate edge conditions, plate inclination, thermal conditions at the plate surface and interaction of the flows over adjacent plates. Both numerical and experimental studies are discussed and correlation equations based on the results of these studies are reviewed.
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 38 (thesis year 1993) a total of 13,787 thesis titles from 22 Canadian and 164 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 38 reports theses submitted in 1993, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.
Convective Heat Transfer presents an effective approach to teaching convective heat transfer. The authors systematically develop the topics and present them from basic principles. They emphasize physical insight, problem-solving, and the derivation of basic equations. To help students master the subject matter, they discuss the implementations of the basic equations and the workings of examples in detail. The material also includes carefully prepared problems at the end of each chapter. In this Second Edition, topics have been carefully chosen and the entire book has been reorganized for the best presentation of the subject matter. New property tables are included, and the authors dedicate an entire chapter to empirical correlations for a wide range of applications of single-phase convection. The book is excellent for helping students quickly develop a solid understanding of convective heat transfer.
For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
A core task of engineers is to analyse energy related problems. The analytical treatment is usually based on principles of thermodynamics, fluid mechanics and heat transfer, but is increasingly being handled computationally. This unique resource presents a practical textbook, written for both undergraduates and professionals, with a series of over 60 computer workbooks on an accompanying CD. The book emphasizes how complex problems can be deconstructed into a series of simple steps. All thermophysical property computations are illustrated using diagrams within text and on the companion CD.
COMPUTATIONAL FLUID DYNAMICS AND ENERGY MODELLING IN BUILDINGS A Comprehensive Overview of the Fundamentals of Heat and Mass Transport Simulation and Energy Performance in Buildings In the first part of Computational Fluid Dynamics and Energy Modelling in Buildings: Fundamentals and Applications, the author explains the fundamentals of fluid mechanics, thermodynamics, and heat transfer, with a specific focus on their application in buildings. This background knowledge sets the scene to further model heat and mass transport in buildings, with explanations of commonly applied simplifications and assumptions. In the second part, the author elaborates how the fundamentals explained in part 1 can be used to model energy flow in buildings, which is the basis of all commercial and educational building energy simulation tools. An innovative illustrative nodal network concept is introduced to help readers comprehend the basics of conservation laws in buildings. The application of numerical techniques to form dynamic simulation tools are then introduced. In general, understanding these techniques will help readers to identify and justify their choices when working with building energy simulation tools, rather than using default settings. Detailed airflow information in buildings cannot be obtained in building energy simulation techniques. Therefore, part three is focused on introducing computational fluid dynamics (CFD) as a detailed modelling technique for airflow in buildings. This part starts with an introduction to the fundamentals of the finite volume method used to solve the governing fluid equations and the related challenges and considerations are discussed. The last chapter of this part covers the solutions to some practical problems of airflow within and around buildings. The key aspect of Computational Fluid Dynamics and Energy Modelling in Buildings: Fundamentals and Applications is that it is tailored for audiences without extensive past experience of numerical methods. Undergraduate or graduate students in architecture, urban planning, geography, architectural engineering, and other engineering fields, along with building performance and simulation professionals, can use this book to gain additional clarity on the topics of building energy simulation and computational fluid dynamics.
INTRODUCTION TO CONVECTIVE HEAT TRANSFER A highly practical intro to solving real-world convective heat transfer problems with MATLAB® and MAPLE In Introduction to Convective Heat Transfer, accomplished professor and mechanical engineer Nevzat Onur delivers an insightful exploration of the physical mechanisms of convective heat transfer and an accessible treatment of how to build mathematical models of these physical processes. Providing a new perspective on convective heat transfer, the book is comprised of twelve chapters, all of which contain numerous practical examples. The book emphasizes foundational concepts and is integrated with explanations of computational programs like MATLAB® and MAPLE to offer students a practical outlet for the concepts discussed within. The focus throughout is on practical, physical analysis rather than mathematical detail, which helps students learn to use the provided computational tools quickly and accurately. In addition to a solutions manual for instructors and the aforementioned MAPLE and MATLAB® files, Introduction to Convective Heat Transfer includes: A thorough introduction to the foundations of convective heat transfer, including coordinate systems, and continuum and thermodynamic equilibrium concepts Practical explorations of the fundamental equations of laminar convective heat transfer, including integral formulation and differential formulation Comprehensive discussions of the equations of incompressible external laminar boundary layers, including laminar flow forced convection and the thermal boundary layer concept In-depth examinations of dimensional analysis, including the dimensions of physical quantities, dimensional homogeneity, and dimensionless numbers Ideal for first-year graduates in mechanical, aerospace, and chemical engineering, Introduction to Convective Heat Transfer is also an indispensable resource for practicing engineers in academia and industry in the mechanical, aerospace, and chemical engineering fields.
