This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.
Presenting the concept and design and implementation of configurable intelligent optimization algorithms in manufacturing systems, this book provides a new configuration method to optimize manufacturing processes. It provides a comprehensive elaboration of basic intelligent optimization algorithms, and demonstrates how their improvement, hybridization and parallelization can be applied to manufacturing. Furthermore, various applications of these intelligent optimization algorithms are exemplified in detail, chapter by chapter. The intelligent optimization algorithm is not just a single algorithm; instead it is a general advanced optimization mechanism which is highly scalable with robustness and randomness. Therefore, this book demonstrates the flexibility of these algorithms, as well as their robustness and reusability in order to solve mass complicated problems in manufacturing. Since the genetic algorithm was presented decades ago, a large number of intelligent optimization algorithms and their improvements have been developed. However, little work has been done to extend their applications and verify their competence in solving complicated problems in manufacturing. This book will provide an invaluable resource to students, researchers, consultants and industry professionals interested in engineering optimization. It will also be particularly useful to three groups of readers: algorithm beginners, optimization engineers and senior algorithm designers. It offers a detailed description of intelligent optimization algorithms to algorithm beginners; recommends new configurable design methods for optimization engineers, and provides future trends and challenges of the new configuration mechanism to senior algorithm designers.
On Optimal Interconnections for VLSI describes, from a geometric perspective, algorithms for high-performance, high-density interconnections during the global and detailed routing phases of circuit layout. First, the book addresses area minimization, with a focus on near-optimal approximation algorithms for minimum-cost Steiner routing. In addition to practical implementations of recent methods, the implications of recent results on spanning tree degree bounds and the method of Zelikovsky are discussed. Second, the book addresses delay minimization, starting with a discussion of accurate, yet algorithmically tractable, delay models. Recent minimum-delay constructions are highlighted, including provably good cost-radius tradeoffs, critical-sink routing algorithms, Elmore delay-optimal routing, graph Steiner arborescences, non-tree routing, and wiresizing. Third, the book addresses skew minimization for clock routing and prescribed-delay routing formulations. The discussion starts with early matching-based constructions and goes on to treat zero-skew routing with provably minimum wirelength, as well as planar clock routing. Finally, the book concludes with a discussion of multiple (competing) objectives, i.e., how to optimize area, delay, skew, and other objectives simultaneously. These techniques are useful when the routing instance has heterogeneous resources or is highly congested, as in FPGA routing, multi-chip packaging, and very dense layouts. Throughout the book, the emphasis is on practical algorithms and a complete self-contained development. On Optimal Interconnections for VLSI will be of use to both circuit designers (CAD tool users) as well as researchers and developers in the area of performance-driven physical design.
The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in technology. Handbook of Algorithms for Physical Design Automation provides a detailed overview of VLSI physical design automation, emphasizing state-of-the-art techniques, trends and improvements that have emerged during the previous decade. After a brief introduction to the modern physical design problem, basic algorithmic techniques, and partitioning, the book discusses significant advances in floorplanning representations and describes recent formulations of the floorplanning problem. The text also addresses issues of placement, net layout and optimization, routing multiple signal nets, manufacturability, physical synthesis, special nets, and designing for specialized technologies. It includes a personal perspective from Ralph Otten as he looks back on the major technical milestones in the history of physical design automation. Although several books on this topic are currently available, most are either too broad or out of date. Alternatively, proceedings and journal articles are valuable resources for researchers in this area, but the material is widely dispersed in the literature. This handbook pulls together a broad variety of perspectives on the most challenging problems in the field, and focuses on emerging problems and research results.
Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
This book covers a variety of topics in Electronics and Communication Engineering, especially in the area of microelectronics and VLSI design, communication systems and networks, and signal and image processing. The content is based on papers presented at the 5th International Conference on VLSI, Communication and Signal Processing (VCAS 2022). The book also discusses the emerging applications of novel tools and techniques in image, video, and multimedia signal processing. This book is useful to students, researchers, and professionals working in the electronics and communication domain.
This volume provides a complete understanding of the fundamental causes of routing congestion in present-day and next-generation VLSI circuits, offers techniques for estimating and relieving congestion, and provides a critical analysis of the accuracy and effectiveness of these techniques. The book includes metrics and optimization techniques for routing congestion at various stages of the VLSI design flow. The subjects covered include an explanation of why the problem of congestion is important and how it will trend, plus definitions of metrics that are appropriate for measuring congestion, and descriptions of techniques for estimating and optimizing routing congestion issues in cell-/library-based VLSI circuits.
This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
