MonolithIC 3D Advantage
Author:
Publisher: Iulia Tomut
Published:
Total Pages: 159
ISBN-13:
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Monolithic 3D - In General
Author:
Publisher: Iulia Tomut
Published:
Total Pages: 170
ISBN-13:
DOWNLOAD EBOOKCHIPS 2020 VOL. 2
Author: Bernd Höfflinger
Publisher: Springer
Published: 2015-09-19
Total Pages: 342
ISBN-13: 3319220934
DOWNLOAD EBOOKThe release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising Moore-like exponential growth sustainable through to the 2030s.
NANO-CHIPS 2030
Author: Boris Murmann
Publisher: Springer Nature
Published: 2020-06-08
Total Pages: 597
ISBN-13: 3030183386
DOWNLOAD EBOOKIn this book, a global team of experts from academia, research institutes and industry presents their vision on how new nano-chip architectures will enable the performance and energy efficiency needed for AI-driven advancements in autonomous mobility, healthcare, and man-machine cooperation. Recent reviews of the status quo, as presented in CHIPS 2020 (Springer), have prompted the need for an urgent reassessment of opportunities in nanoelectronic information technology. As such, this book explores the foundations of a new era in nanoelectronics that will drive progress in intelligent chip systems for energy-efficient information technology, on-chip deep learning for data analytics, and quantum computing. Given its scope, this book provides a timely compendium that hopes to inspire and shape the future of nanoelectronics in the decades to come.
Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
Author: Madhusudan Iyengar
Publisher: World Scientific
Published: 2024-01-10
Total Pages: 479
ISBN-13: 9811279381
DOWNLOAD EBOOKThis book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Handbook of 3D Integration, Volume 4
Author: Paul D. Franzon
Publisher: John Wiley & Sons
Published: 2019-05-06
Total Pages: 488
ISBN-13: 3527338551
DOWNLOAD EBOOKThis fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Physical Design for 3D Integrated Circuits
Author: Aida Todri-Sanial
Publisher: CRC Press
Published: 2017-12-19
Total Pages: 409
ISBN-13: 1351830198
DOWNLOAD EBOOKPhysical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
CMOSETR 2015 Vol. 6: Materials Track
Author: CMOS Emerging Technologies Research
Publisher: CMOS Emerging Technologies Research
Published: 2015-05-22
Total Pages: 312
ISBN-13: 1927500680
DOWNLOAD EBOOKPresentation slides for the Materials track at CMOSETR 2015, May 20-22, 2015.
Intelligent Integrated Systems
Author: Simon Deleonibus
Publisher: CRC Press
Published: 2014-04-09
Total Pages: 518
ISBN-13: 9814411426
DOWNLOAD EBOOKThis book gives a state-of-the-art overview by internationally recognized researchers of the architectures of breakthrough devices required for future intelligent integrated systems. The first section highlights Advanced Silicon-Based CMOS Technologies. New device and functional architectures are reviewed in chapters on Tunneling Field-Effect Transistors and 3-D monolithic Integration, which the alternative materials could possibly use in the future. The way we can augment silicon technologies is illustrated by the co-integration of new types of devices, such as molecular and resistive spintronics-based memories and smart sensors, using nanoscale features co-integrated with silicon CMOS or above it.
