Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.
All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
