MEMS Pressure Sensors: Fabrication and Process Optimization - describs the step by step fabrication process sequence along with flow chart for fabrication of micro pressure sensors taking into account various aspects of fabrication and designing of the pressure sensors as well as fabrication process optimization. A complete experimental detail before and after each step of fabrication of the sensor has also been discussed. This leads to the uniqueness of the book. MEMS Pressure Sensors: Fabrication and Process Optimization will greatly benefit undergraduate and postgraduate students of MEMS and NEMS courses. Process engineers and technologists in the microelectronics industry including MEMS-based sensors manufacturers.
This book provides a comprehensive presentation of the most frequently used high resolution manufacturing techniques available, as well as the polymeric materials used for each of the techniques. Divided into two parts covering the technologies and materials used and the impact on different research fields and case studies, High Resolution Manufacturing from 2D to 3D/4D Printing: Applications in Engineering and Medicine addresses issues like throughput improvement by volumetric 3D printing and presenting novel applications and case studies. In addition, this book also covers the latest breakthrough developments and innovations to help readers understand the future applications of this technology across various disciplines, including biomedicine, electronics, energy, and photonics.
Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence of deposition conditions, germanium content and doping concentration on the electrical and piezoresistive properties of boron-doped poly-SiGe. The development of a CMOS-compatible process flow, with special attention to the sealing method, is also described. Piezoresistive pressure sensors with different areas and piezoresistor designs were fabricated and tested. Together with the piezoresistive pressure sensors, also functional capacitive pressure sensors were successfully fabricated on the same wafer, proving the versatility of poly-SiGe for MEMS sensor applications. Finally, a detailed analysis of the MEMS processing impact on the underlying CMOS circuit is also presented.
The increasing demand in home and industry for electronic devices has encouraged designers and researchers to investigate new devices and circuits using new materials that can perform several tasks efficiently with low IC (integrated circuit) area and low power consumption. Furthermore, the increasing demand for portable devices intensifies the search to design sensor elements, an efficient storage cell, and large-capacity memory elements. Electrical and Electronic Devices, Circuits and Materials: Design and Applications will assist the development of basic concepts and fundamentals behind devices, circuits, materials, and systems. This book will allow its readers to develop their understanding of new materials to improve device performance with even smaller dimensions and lower costs. Additionally, this book covers major challenges in MEMS (micro-electromechanical system)-based device and thin-film fabrication and characterization, including their applications in different fields such as sensors, actuators, and biomedical engineering. Key Features: Assists researchers working on devices and circuits to correlate their work with other requirements of advanced electronic systems. Offers guidance for application-oriented electrical and electronic device and circuit design for future energy-efficient systems. Encourages awareness of the international standards for electrical and electronic device and circuit design. Organized into 23 chapters, Electrical and Electronic Devices, Circuits and Materials: Design and Applications will create a foundation to generate new electrical and electronic devices and their applications. It will be of vital significance for students and researchers seeking to establish the key parameters for future work.
This book presents the proceedings of SympoSIMM 2020, the 3rd edition of the Symposium on Intelligent Manufacturing and Mechatronics. Focusing on “Strengthening Innovations Towards Industry 4.0”, the book presents studies on the details of Industry 4.0’s current trends. Divided into five parts covering various areas of manufacturing engineering and mechatronics stream, namely, artificial intelligence, instrumentation and controls, intelligent manufacturing, modelling and simulation, and robotics, the book will be a valuable resource for readers wishing to embrace the new era of Industry 4.0.
This volumes presents the proceedings of ICIBEL 2015, organized by the Centre for Innovation in Medical Engineering (CIME) under Innovative Technology Research Cluster, University of Malaya. It was held in Kuala Lumpur, Malaysia, from 6-8 December 2015. The ICIBEL 2015 conference promotes the latest researches and developments related to the integration of the Engineering technology in medical fields and life sciences. This includes the latest innovations, research trends and concerns, challenges and adopted solution in the field of medical engineering and life sciences.
The fifth volume in Jenny Stanford Series on Intelligent Nanosystems, entitled Outlooking Beyond Nanoelectronics and Nanosystems: Ultra Scaling, Pervasiveness, Sustainable Integration, and Biotic Cross-Inspiration, collects global reviews on (1) the historical cross-inspiration of technologies with nature, their evolution towards nanoelectronic and nanosystem components and their sustainability; (2) new materials, techniques, and pervasive applications out of mainstream; and (3) memristor foundation and new bioengineering developments. The covered topics include ultra scaling with its limits, alternatives and prospects, superior energy efficiency and pervasiveness to non-conventional applications; the evaluation of information technology sustainability, environmental impact and life cycles; prospective fabrication techniques, materials and components, their multifunctional extensions for characterization, fabrication, high-resolution quantum sensing, energy and information storage; life science–inspired memristors and edge of chaos; and bioengineering by nanostructured hybrid smart systems.
Part of the AMN book series, this book covers the principles, modeling and implementation as well as applications of resonant MEMS from a unified viewpoint. It starts out with the fundamental equations and phenomena that govern the behavior of resonant MEMS and then gives a detailed overview of their implementation in capacitive, piezoelectric, thermal and organic devices, complemented by chapters addressing the packaging of the devices and their stability. The last part of the book is devoted to the cutting-edge applications of resonant MEMS such as inertial, chemical and biosensors, fluid properties sensors, timing devices and energy harvesting systems.
Piezoresistor Design and Applications provides an overview of these MEMS devices and related physics. The text demonstrates how MEMS allows miniaturization and integration of sensing as well as efficient packaging and signal conditioning. This text for engineers working in MEMS design describes the piezoresistive phenomenon and optimization in several applications. Includes detailed discussion of such topics as; coupled models of mechanics, materials and electronic behavior in a variety of common geometric implementations including strain gages, beam bending, and membrane loading. The text concludes with an up-to-date discussion of the need for integrated MEMS design and opportunities to leverage new materials, processes and MEMS technology. Piezoresistor Design and Applications is an ideal book for design engineers, process engineers and researchers.
