MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Designed for the complete newcomer to TeX, this book begins with simple exercises on typesetting text and slowly advances into more complex problems such as different types of mathematical constructions and tables. Presents a comprehensive overview of TeX with various tables included for quick references.
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.
This book examines the Internet of Things (IoT) and Data Analytics from a technical, application, and business point of view. Internet of Things and Data Analytics Handbook describes essential technical knowledge, building blocks, processes, design principles, implementation, and marketing for IoT projects. It provides readers with knowledge in planning, designing, and implementing IoT projects. The book is written by experts on the subject matter, including international experts from nine countries in the consumer and enterprise fields of IoT. The text starts with an overview and anatomy of IoT, ecosystem of IoT, communication protocols, networking, and available hardware, both present and future applications and transformations, and business models. The text also addresses big data analytics, machine learning, cloud computing, and consideration of sustainability that are essential to be both socially responsible and successful. Design and implementation processes are illustrated with best practices and case studies in action. In addition, the book: Examines cloud computing, data analytics, and sustainability and how they relate to IoT overs the scope of consumer, government, and enterprise applications Includes best practices, business model, and real-world case studies Hwaiyu Geng, P.E., is a consultant with Amica Research (www.AmicaResearch.org, Palo Alto, California), promoting green planning, design, and construction projects. He has had over 40 years of manufacturing and management experience, working with Westinghouse, Applied Materials, Hewlett Packard, and Intel on multi-million high-tech projects. He has written and presented numerous technical papers at international conferences. Mr. Geng, a patent holder, is also the editor/author of Data Center Handbook (Wiley, 2015).
Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.
For Microelectromechanical Systems (MEMS) and Nanoelectromechanical Systems (NEMS) production, each product requires a unique process technology. This book provides a comprehensive insight into the tools necessary for fabricating MEMS/NEMS and the process technologies applied. Besides, it describes enabling technologies which are necessary for a successful production, i.e., wafer planarization and bonding, as well as contamination control.
This unique and comprehensive resource offers you a detailed treatment of the operations principles, key parameters, and specific characteristics of active and passive RF, microwave, and millimeter-wave components. The book covers both linear and nonlinear components that are used in a wide range of application areas, from communications and information sciences, to avionics, space, and military engineering. This practical book presents descriptions and clear examples and of the best materials and products used in the field, including laminates, prepregs, substrates; microstrip, coaxial and waveguide transmission lines; fixed and rotating connectors; matching and adjusting elements; frequency filters; phase shifters; and ferrite gates and circulators. Moreover, the book offers you in-depth discussions on microwave switches and matrices, including MEMS technology, solid state and vacuum amplifiers, mixers, modulators and demodulators, and oscillation sources. You also find coverage of the stable frequency synthesizer structure and sources of modulated or noisy signals. Greatly adding to the usefulness of this volume is the inclusion of more than 700 Internet addresses of manufacturers from across the globe.
The field of materials science and engineering is rapidly evolving into a science of its own. While traditional literature in this area often concentrates primarily on property and structure, the Materials Processing Handbook provides a much needed examination from the materials processing perspective. This unique focus reflects the changing comple
