Materials for High-Density Electronic Packaging and Interconnection
Author: National Research Council
Publisher: National Academies Press
Published: 1990-02-01
Total Pages: 154
ISBN-13: 030904233X
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Author: National Research Council
Publisher: National Academies Press
Published: 1990-02-01
Total Pages: 154
ISBN-13: 030904233X
DOWNLOAD EBOOKAuthor: Wendker Fassaden-Systembau GmbH
Publisher:
Published: 2001
Total Pages: 87
ISBN-13:
DOWNLOAD EBOOKAuthor: National Aeronautics and Space Administration (NASA)
Publisher: Createspace Independent Publishing Platform
Published: 2018-07-18
Total Pages: 142
ISBN-13: 9781723202131
DOWNLOAD EBOOKElectronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production. Unspecified Center COMPATIBILITY; ELECTRONIC PACKAGING; SEMICONDUCTORS (MATERIALS); INDUSTRIES; LEADERSHIP; MARKETING...
Author: Deborah D.L. Chung
Publisher: Elsevier
Published: 1995-03-31
Total Pages: 383
ISBN-13: 0080511171
DOWNLOAD EBOOKAlthough materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. - Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors - Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science - Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Author: Richard K. Ulrich
Publisher: John Wiley & Sons
Published: 2006-02-24
Total Pages: 852
ISBN-13: 0471466093
DOWNLOAD EBOOKAs in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author: John R. Susko
Publisher:
Published: 1988
Total Pages: 228
ISBN-13:
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Publisher: iSmithers Rapra Publishing
Published:
Total Pages: 266
ISBN-13: 9781859572238
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Publisher: Office of Technology Assessment
Published: 1991
Total Pages: 64
ISBN-13:
DOWNLOAD EBOOKAuthor: Xingcun Colin Tong
Publisher: Springer Science & Business Media
Published: 2011-01-05
Total Pages: 633
ISBN-13: 1441977597
DOWNLOAD EBOOKThe need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author: Sulaiman Khalifeh
Publisher: Elsevier
Published: 2020-04-01
Total Pages: 617
ISBN-13: 192788568X
DOWNLOAD EBOOKPolymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. - Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers - Covers the most common electrical, electronic, and optical properties of electronic polymers - Describes the underlying theories on the mechanics of polymer conductivity - Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures - Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components