ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

Author: ASM International

Publisher: ASM International

Published: 2019-12-01

Total Pages: 540

ISBN-13: 1627082735

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The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.


Physical Assurance

Physical Assurance

Author: Navid Asadizanjani

Publisher: Springer Nature

Published: 2021-02-15

Total Pages: 193

ISBN-13: 3030626091

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This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.


Materials for Electronics Security and Assurance

Materials for Electronics Security and Assurance

Author: Navid Asadizanjani

Publisher: Elsevier

Published: 2024-01-15

Total Pages: 224

ISBN-13: 0443185433

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Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities. - Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting - Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions - Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing


ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis

ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis

Author: ASM International

Publisher: ASM International

Published: 2018-12-01

Total Pages: 593

ISBN-13: 1627080996

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The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.


Materials for Advanced Packaging

Materials for Advanced Packaging

Author: Daniel Lu

Publisher: Springer

Published: 2016-11-18

Total Pages: 974

ISBN-13: 3319450980

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.


ISTFA 2007

ISTFA 2007

Author: ASM International

Publisher: ASM International(OH)

Published: 2007

Total Pages: 356

ISBN-13: 9780871708632

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Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session


ISTFA 2013

ISTFA 2013

Author: A. S. M. International

Publisher: ASM International

Published: 2013-01-01

Total Pages: 634

ISBN-13: 1627080228

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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.


ISTFA 2014

ISTFA 2014

Author: A. S. M. International

Publisher: ASM International

Published: 2014-11-01

Total Pages: 561

ISBN-13: 1627080740

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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.