Ferroelectric materials have been and still are widely used in many applications, that have moved from sonar towards breakthrough technologies such as memories or optical devices. This book is a part of a four volume collection (covering material aspects, physical effects, characterization and modeling, and applications) and focuses on the application of ferroelectric devices to innovative systems. In particular, the use of these materials as varying capacitors, gyroscope, acoustics sensors and actuators, microgenerators and memory devices will be exposed, providing an up-to-date review of recent scientific findings and recent advances in the field of ferroelectric devices.
Part I: Fundamentals of ultrasound This part will cover the main basic principles of ultrasound generation and propagation and those phenomena related to low and high intensity ultrasound applications. The mechanisms involved in food analysis and process monitoring and in food process intensification will be shown. Part II: Low intensity ultrasound applications Low intensity ultrasound applications have been used for non-destructive food analysis as well as for process monitoring. Ultrasonic techniques, based on velocity, attenuation or frequency spectrum analysis, may be considered as rapid, simple, portable and suitable for on-line measurements. Although industrial applications of low-intensity ultrasound, such as meat carcass evaluation, have been used in the food industry for decades, this section will cover the most novel applications, which could be considered as highly relevant for future application in the food industry. Chapters addressing this issue will be divided into three subsections: (1) food control, (2) process monitoring, (3) new trends. Part III: High intensity ultrasound applications High intensity ultrasound application constitutes a way to intensify many food processes. However, the efficient generation and application of ultrasound is essential to achieving a successful effect. This part of the book will begin with a chapter dealing with the importance of the design of efficient ultrasonic application systems. The medium is essential to achieve efficient transmission, and for that reason the particular challenges of applying ultrasound in different media will be addressed. The next part of this section constitutes an up-to-date vision of the use of high intensity ultrasound in food processes. The chapters will be divided into four sections, according to the medium in which the ultrasound vibration is transmitted from the transducers to the product being treated. Thus, solid, liquid, supercritical and gas media have been used for ultrasound propagation. Previous books addressing ultrasonic applications in food processing have been based on the process itself, so chapters have been divided in mass and heat transport, microbial inactivation, etc. This new book will propose a revolutionary overview of ultrasonic applications based on (in the authors’ opinion) the most relevant factor affecting the efficiency of ultrasound applications: the medium in which ultrasound is propagated. Depending on the medium, ultrasonic phenomena can be completely different, but it also affects the complexity of the ultrasonic generation, propagation and application. In addition, the effect of high intensity ultrasound on major components of food, such as proteins, carbohydrates and lipids will be also covered, since this type of information has not been deeply studied in previous books. Other aspects related to the challenges of food industry to incorporate ultrasound devices will be also considered. This point is also very important since, in the last few years, researchers have made huge efforts to integrate fully automated and efficient ultrasound systems to the food production lines but, in some cases, it was not satisfactory. In this sense, it is necessary to identify and review the main related problems to efficiently produce and transmit ultrasound, scale-up, reduce cost, save energy and guarantee the production of safe, healthy and high added value foods.
This book includes original, peer-reviewed research papers from the 11th International Conference on Modelling, Identification and Control (ICMIC2019), held in Tianjin, China on July 13-15, 2019. The topics covered include but are not limited to: System Identification, Linear/Nonlinear Control Systems, Data-driven Modelling and Control, Process Modelling and Process Control, Fault Diagnosis and Reliable Control, Intelligent Systems, and Machine Learning and Artificial Intelligence.The papers showcased here share the latest findings on methodologies, algorithms and applications in modelling, identification, and control, integrated with Artificial Intelligence (AI), making the book a valuable asset for researchers, engineers, and university students alike.
This book includes research papers from the 11th National Technical Symposium on Unmanned System Technology. Covering a number of topics, including intelligent robotics, novel sensor technology, control algorithms, acoustics signal processing, imaging techniques, biomimetic robots, green energy sources, and underwater communication backbones and protocols, it will appeal to researchers developing marine technology solutions and policy-makers interested in technologies to facilitate the exploration of coastal and oceanic regions.
Written at an intermediate level in a way that is easy to understand, Fundamentals and Applications of Ultrasonic Waves, Second Edition provides an up-to-date exposition of ultrasonics and some of its main applications. Designed specifically for newcomers to the field, this fully updated second edition emphasizes underlying physical concepts over mathematics. The first half covers the fundamentals of ultrasonic waves for isotropic media. Starting with bulk liquid and solid media, discussion extends to surface and plate effects, at which point the author introduces new modes such as Rayleigh and Lamb waves. This focus on only isotropic media simplifies the usually complex mathematics involved, enabling a clearer understanding of the underlying physics to avoid the complicated tensorial description characteristic of crystalline media. The second part of the book addresses a broad spectrum of industrial and research applications, including quartz crystal resonators, surface acoustic wave devices, MEMS and microacoustics, and acoustic sensors. It also provides a broad discussion on the use of ultrasonics for non-destructive evaluation. The author concentrates on the developing area of microacoustics, including exciting new work on the use of probe microscopy techniques in nanotechnology. Focusing on the physics of acoustic waves, as well as their propagation, technology, and applications, this book addresses viscoelasticity, as well as new concepts in acoustic microscopy. It updates coverage of ultrasonics in nature and developments in sonoluminescence, and it also compares new technologies, including use of atomic force acoustic microscopy and lasers. Highlighting both direct and indirect applications for readers working in neighboring disciplines, the author presents particularly important sections on the use of microacoustics and acoustic nanoprobes in next-generation devices and instruments.
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Updated, revised, and restructured to reflect the latest advances in science and applications, the fourth edition of this best-selling industry and research reference covers the fundamental physical acoustics of ultrasonics and transducers, with a focus on piezoelectric and magnetostrictive modalities. It then discusses the full breadth of ultrasonics applications involving low power (sensing) and high power (processing) for research, industrial, and medical use. This book includes new content covering computer modeling used for acoustic and elastic wave phenomena, including scattering, mode conversion, transmission through layered media, Rayleigh and Lamb waves and flexural plates, modern horn design tools, Langevin transducers, and material characterization. There is more attention on process monitoring and advanced nondestructive testing and evaluation (NDT/NDE), including phased array ultrasound (PAUT), long-range inspection, using guided ultrasonic waves (GUW), internally rotary inspection systems (IRIS), time-of-flight diffraction (TOFD), and acoustic emission (AE). These methods are discussed and applied to both metals and nonmetals using illustrations in various industries, including now additionally for food and beverage products. The topics of defect sizing, capabilities, and limitations, including the probability of detection (POD), are introduced. Three chapters provide a new treatment of high-power ultrasonics, for both fluids and solids, and again, with examples of industrial engineering, food and beverage, pharmaceuticals, petrochemicals, and other process applications. Expanded coverage is given to medical and biological applications, covering diagnostics, therapy, and, at the highest powers, surgery. Key Features Provides an overview of fundamental analysis and transducer technologies needed to design and develop both measurement and processing systems Considers applications in material characterization and metrology Covers ultrasonic nondestructive testing and evaluation and high-power ultrasonics, which involves interactions that change the state of material Highlights medical and biomedical applications of ultrasound, focusing on the physical acoustics and the technology employed for diagnosis, therapy, surgery, and research This book is intended for both the undergraduate and graduate scientists and engineers, as well as the working professional, who seeks to understand the fundamentals together with a holistic treatment of the field of ultrasonics and its diversity of applications.
A must-read for anyone working in electronics in the healthcare sector This one-of-a-kind book addresses state-of-the-art integrated circuit design in the context of medical imaging of the human body. It explores new opportunities in ultrasound, computed tomography (CT), magnetic resonance imaging (MRI), nuclear medicine (PET, SPECT), emerging detector technologies, circuit design techniques, new materials, and innovative system approaches. Divided into four clear parts and with contributions from a panel of international experts, Medical Imaging systematically covers: X-ray imaging and computed tomography–X-ray and CT imaging principles; Active Matrix Flat Panel Imagers (AMFPI) for diagnostic medical imaging applications; photon counting and integrating readout circuits; noise coupling in digital X-ray imaging Nuclear medicine–SPECT and PET imaging principles; low-noise electronics for radiation sensors Ultrasound imaging–Electronics for diagnostic ultrasonic imaging Magnetic resonance imaging–Magnetic resonance imaging principles; MRI technology
The Biomed 2011 brought together academicians and practitioners in engineering and medicine in this ever progressing field. This volume presents the proceedings of this international conference which was hold in conjunction with the 8th Asian Pacific Conference on Medical and Biological Engineering (APCMBE 2011) on the 20th to the 23rd of June 2011 at Berjaya Times Square Hotel, Kuala Lumpur. The topics covered in the conference proceedings include: Artificial organs, bioengineering education, bionanotechnology, biosignal processing, bioinformatics, biomaterials, biomechanics, biomedical imaging, biomedical instrumentation, BioMEMS, clinical engineering, prosthetics.
Ultrasound medical imaging stands out among the other diagnostic imaging modalities for its patient-friendliness, high temporal resolution, low cost, and absence of ionizing radiation. On the other hand, it may still suffer from limited detail level, low signal-to-noise ratio, and narrow field-of-view. In the last decade, new beamforming and image reconstruction techniques have emerged which aim at improving resolution, contrast, and clutter suppression, especially in difficult-to-image patients. Nevertheless, achieving a higher image quality is of the utmost importance in diagnostic ultrasound medical imaging, and further developments are still indispensable. From this point of view, a crucial role can be played by novel beamforming techniques as well as by non-conventional image formation techniques (e.g., advanced transmission strategies, and compounding, coded, and harmonic imaging). This Special Issue includes novel contributions on both ultrasound beamforming and image formation techniques, particularly addressed at improving B-mode image quality and related diagnostic content. This indeed represents a hot topic in the ultrasound imaging community, and further active research in this field is expected, where many challenges still persist.
