The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes. The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries. Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.
Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm , and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate “hot spots” completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as “heat spreaders”. The high thermal conductivity of these materials allows the heat to be carried away from the “hot spots” very quickly in all directions thereby “spreading” the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.
It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.
A quick and easy to use source for qualified thermal properties of metals and alloys. The data tables are arranged by material hierarchy, with summary tables sorted by property value. Values are given for a range of high and low temperatures. Short technical discussions at the beginning of each chapter are designed to refresh the reader's understanding of the properties and units covered in that section
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.
This book is intended to provide a deep understanding on the advanced treatments of thermal properties of materials through experimental, theoretical, and computational techniques. This area of interest is being taught in most universities and institutions at the graduate and postgraduate levels. Moreover, the increasing modern technical and social interest in energy has made the study of thermal properties more significant and exciting in the recent years. This book shares with the international community a sense of global motivation and collaboration on the subject of thermal conductivity and its wide spread applications in modern technologies. This book presents new results from leading laboratories and researchers on topics including materials, thermal insulation, modeling, steady and transient measurements, and thermal expansion. The materials of interest range from nanometers to meters, bringing together ideas and results from across the research field.
The first comprehensive book to focus on ultra-high temperature ceramic materials in more than 20 years Ultra-High Temperature Ceramics are a family of compounds that display an unusual combination of properties, including extremely high melting temperatures (>3000°C), high hardness, and good chemical stability and strength at high temperatures. Typical UHTC materials are the carbides, nitrides, and borides of transition metals, but the Group IV compounds (Ti, Zr, Hf) plus TaC are generally considered to be the main focus of research due to the superior melting temperatures and stable high-melting temperature oxide that forms in situ. Rather than focusing on the latest scientific results, Ultra-High Temperature Ceramics: Materials for Extreme Environment Applications broadly and critically combines the historical aspects and the state-of-the-art on the processing, densification, properties, and performance of boride and carbide ceramics. In reviewing the historic studies and recent progress in the field, Ultra-High Temperature Ceramics: Materials for Extreme Environment Applications provides: Original reviews of research conducted in the 1960s and 70s Content on electronic structure, synthesis, powder processing, densification, property measurement, and characterization of boride and carbide ceramics. Emphasis on materials for hypersonic aerospace applications such as wing leading edges and propulsion components for vehicles traveling faster than Mach 5 Information on materials used in the extreme environments associated with high speed cutting tools and nuclear power generation Contributions are based on presentations by leading research groups at the conference "Ultra-High Temperature Ceramics: Materials for Extreme Environment Applications II" held May 13-19, 2012 in Hernstein, Austria. Bringing together disparate researchers from academia, government, and industry in a singular forum, the meeting cultivated didactic discussions and efforts between bench researchers, designers and engineers in assaying results in a broader context and moving the technology forward toward near- and long-term use. This book is useful for furnace manufacturers, aerospace manufacturers that may be pursuing hypersonic technology, researchers studying any aspect of boride and carbide ceramics, and practitioners of high-temperature structural ceramics.
The book focuses on new analytical, experimental, and computational developments in the field of research of heat and mass transfer phenomena. The generation, conversion, use, and exchange of thermal energy between physical systems are considered. Various mechanisms of heat transfer such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes are presented. Theory and fundamental research in heat and mass transfer, numerical simulations and algorithms, experimental techniques, and measurements as they applied to all kinds of applied and emerging problems are covered.
It was seven years ago this month when I had the pleasure of writing the Foreword to the Proceedings of the Eighth Conference on Thermal Conductivity hosted by TPRC/ Purdue University in 1968. Since then this Conference has developed to the point where one can say it has just entered a new phase. At its meeting in June 1975, the Board of Governors of the International Thermal Conductivity Conferences passed a resolution which formalizes two main policies that were felt to be desirable for a number of years, A key item of the resolution was for CINDAS/Purdue University to become the permanent Sponsor of the Conferences and in this capacity assist the Conferences in all matters which will result in the effective implementation of its goals and mission. In short, CINDAS will serve as a home base for the Conferences thus providing continuity and a permanent point of contact. CINDAS/Purdue University is pleased to accept this respons ibility as it is well within its mission to promote the advancement and dissemination of knowledge on thermophysica! properties of matter. A second important aspect of the Conference resolution was the establishment of a policy to publish the Proceedings of future conferences on a continuing and uniform basis effective with this, the Fourteenth Conference.
