Global Roadmap for Ceramic and Glass Technology
Global Roadmap for Ceramic and Glass Technology

Author: Stephen W. Freiman

Publisher: John Wiley & Sons

Published: 2007-06-29

Total Pages: 964

ISBN-13: 0470104910

DOWNLOAD EBOOK

This is the only global roadmap that identifies the technical and manufacturing challenges associated with the development and expansion of commercial markets for ceramics and glass. Featuring presentations by industry leaders at the 1st International Congress on Ceramics (ICC) held in 2006, it suggests positive, proactive ways to address these challenges. The ICC Global Roadmap contains the following content: 1) Summary papers prepared by the invited speakers before the meeting 2) A detailed account of the presentation of each invited speaker written by an editor who attends the presentation 3) A summary account and future recommendations for the industry on each topic covered written by the board and the president of this meeting, Dr. Stephen Freiman (National Institutes of Standards and Technology) 4) The CDRom accompanying the book contains all of the above as well as pdfs of the presentations for non-invited speakers, including posters presented and discussed.

Engineered Ceramics
Engineered Ceramics

Author: Tatsuki Ohji

Publisher: John Wiley & Sons

Published: 2016-02-01

Total Pages: 538

ISBN-13: 1119100402

DOWNLOAD EBOOK

In this book project, all the American Ceramic Society's Engineering Ceramics Division Mueller and Bridge Building Award Winners, the ICACC Plenary Speakers and the past Engineering Ceramics Division Chairs have been invited to write book chapters on a topic that is compatible with their technical interests and consistent with the scope of the book, which is to focus on the current status and future prospects of various technical topics related to engineering ceramics, advanced ceramics and composite materials. Topics include: Mechanical Behavior and Performance of Ceramics & Composites Non-Destructive Evaluation and Mechanical Testing of Engineering Ceramics Brittle and Composite Material Design Modern Fracture Mechanics of Ceramics Thermal/Environmental Barrier Coatings Advanced Ceramic Coatings for Functional Applications Advanced Ceramic Joining Technologies Ceramics for Machining, Friction, Wear, and Other Tribological Applications Ceramic Composites for High-Temperature Aerospace Structures and Propulsion Systems Thermal Protection Materials: From Retrospect to Foresight Carbon/Carbon Composites Ceramic-Matrix Composites for Lightweight Construction Ultra High-Temperature Ceramics (UHTC) Nanolaminated Ternary Carbides and Nitrides (MAX Phases) Ceramics for Heat Engine and Other Energy Related Applications Solid Oxide Fuel Cells (SOFC) Armor Ceramics Next Generation Bioceramics Ceramics for Innovative Energy and Storage Systems Designing Ceramics for Electrochemical Energy Storage Devices Nanostructured Materials and Nanotechnology Advanced Ceramic Processing and Manufacturing Technologies Engineering Porous Ceramics Thermal Management Materials and Technologies Geopolymers Advanced Ceramic Sensor Technology Advanced Ceramics and Composites for Nuclear and Fusion Applications Advanced Ceramic Technologies for Rechargeable Batteries

Ceramic Armor Materials by Design
Ceramic Armor Materials by Design

Author: James W. McCauley

Publisher: John Wiley & Sons

Published: 2012-03-28

Total Pages: 667

ISBN-13: 1118381106

DOWNLOAD EBOOK

This proceedings book brings together 55 papers on ceramic armor presented by authorities from around the world covering topics such as ceramic armor development, processing, manufacturing, and insertion. This book will be of great interest to armor researchers in university, industry and government laboratories as well as those industries involved in ceramic armor and high performance structural ceramics. Papers were presented at PacRim IV, An International Conference on Advanced Ceramics and Glasses, Wailea, Maui, Hawaii, USA (2001). 650 pages.

Proceedings of the 1st International Congress on Ceramics
Proceedings of the 1st International Congress on Ceramics

Author: Stephen Freiman

Publisher: Wiley-American Ceramic Society

Published: 2006-11-20

Total Pages: 4

ISBN-13: 9780470116562

DOWNLOAD EBOOK

This is the only global roadmap that identifies the technical and manufacturing challenges associated with the development and expansion of commercial markets for ceramics and glass. Featuring presentations by industry leaders at the 1st International Congress on Ceramics (ICC) held in 2006, it suggests positive, proactive ways to address these challenges. The ICC Global Roadmap contains the following content: 1) Summary papers prepared by the invited speakers before the meeting 2) A detailed account of the presentation of each invited speaker written by an editor who attends the presentation 3) A summary account and future recommendations for the industry on each topic covered written by the board and the president of this meeting, Dr. Stephen Freiman (National Institutes of Standards and Technology) 4) The CDRom accompanying the book contains all of the above as well as pdfs of the presentations for non-invited speakers, including posters presented and discussed.

Classic and Advanced Ceramics
Classic and Advanced Ceramics

Author: Robert B. Heimann

Publisher: John Wiley & Sons

Published: 2010-04-16

Total Pages: 573

ISBN-13: 352763018X

DOWNLOAD EBOOK

Based on the author's lectures to graduate students of geosciences, physics, chemistry and materials science, this didactic handbook covers basic aspects of ceramics such as composition and structure as well as such advanced topics as achieving specific functionalities by choosing the right materials. The focus lies on the thermal transformation processes of natural raw materials to arrive at traditional structural ceramics and on the general physical principles of advanced functional ceramics. The book thus provides practice-oriented information to readers in research, development and engineering on how to understand, make and improve ceramics and derived products, while also serving as a rapid reference for the practitioner. The choice of topics and style of presentation make it equally useful for chemists, materials scientists, engineers and mineralogists.

A Basic Guide to Exporting
A Basic Guide to Exporting

Author: Jason Katzman

Publisher: Skyhorse Publishing Inc.

Published: 2011-03-23

Total Pages: 397

ISBN-13: 1616081112

DOWNLOAD EBOOK

Here is practical advice for anyone who wants to build their business by selling overseas. The International Trade Administration covers key topics such as marketing, legal issues, customs, and more. With real-life examples and a full index, A Basic Guide to Exporting provides expert advice and practical solutions to meet all of your exporting needs.

Energy and Sustainable Futures
Energy and Sustainable Futures

Author: Iosif Mporas

Publisher: Springer Nature

Published: 2021-04-29

Total Pages: 274

ISBN-13: 3030639169

DOWNLOAD EBOOK

This open access book presents papers displayed in the 2nd International Conference on Energy and Sustainable Futures (ICESF 2020), co-organised by the University of Hertfordshire and the University Alliance DTA in Energy. The research included in this book covers a wide range of topics in the areas of energy and sustainability including: • ICT and control of energy;• conventional energy sources;• energy governance;• materials in energy research;• renewable energy; and• energy storage. The book offers a holistic view of topics related to energy and sustainability, making it of interest to experts in the field, from industry and academia.

Semiconductor Packaging
Semiconductor Packaging

Author: Andrea Chen

Publisher: CRC Press

Published: 2016-04-19

Total Pages: 216

ISBN-13: 1439862079

DOWNLOAD EBOOK

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.