Substrate Noise Coupling in Mixed-Signal ASICs
Substrate Noise Coupling in Mixed-Signal ASICs

Author: Stéphane Donnay

Publisher: Springer Science & Business Media

Published: 2006-05-31

Total Pages: 311

ISBN-13: 0306481707

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This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits

Author: Nishath K. Verghese

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 297

ISBN-13: 1461522390

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The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.

Substrate Noise Coupling in RFICs
Substrate Noise Coupling in RFICs

Author: Ahmed Helmy

Publisher: Springer Science & Business Media

Published: 2008-03-23

Total Pages: 129

ISBN-13: 1402081669

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The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.

VLSI-SOC: From Systems to Chips
VLSI-SOC: From Systems to Chips

Author: Manfred Glesner

Publisher: Springer Science & Business Media

Published: 2006-05-17

Total Pages: 315

ISBN-13: 0387334025

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This monograph, divided into four parts, presents a comprehensive treatment and systematic examination of cycle spaces of flag domains. Assuming only a basic familiarity with the concepts of Lie theory and geometry, this work presents a complete structure theory for these cycle spaces, as well as their applications to harmonic analysis and algebraic geometry. Key features include: accessible to readers from a wide range of fields, with all the necessary background material provided for the nonspecialist; many new results presented for the first time; driven by numerous examples; the exposition is presented from the complex geometric viewpoint, but the methods, applications and much of the motivation also come from real and complex algebraic groups and their representations, as well as other areas of geometry; comparisons with classical Barlet cycle spaces are given; and good bibliography and index. Researchers and graduate students in differential geometry, complex analysis, harmonic analysis, representation theory, transformation groups, algebraic geometry, and areas of global geometric analysis will benefit from this work.

Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology

Author: Luciano Lavagno

Publisher: CRC Press

Published: 2017-02-03

Total Pages: 893

ISBN-13: 1351831003

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The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Noise Coupling in System-on-Chip
Noise Coupling in System-on-Chip

Author: Thomas Noulis

Publisher: CRC Press

Published: 2018-01-09

Total Pages: 555

ISBN-13: 1351642782

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Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.

Computer-Aided Design of Analog Integrated Circuits and Systems
Computer-Aided Design of Analog Integrated Circuits and Systems

Author: Rob A. Rutenbar

Publisher: John Wiley & Sons

Published: 2002-05-06

Total Pages: 773

ISBN-13: 047122782X

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The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.

Signal Integrity Effects in Custom IC and ASIC Designs
Signal Integrity Effects in Custom IC and ASIC Designs

Author: Raminderpal Singh

Publisher: John Wiley & Sons

Published: 2001-12-12

Total Pages: 484

ISBN-13: 0471150428

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"...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication

Analog Circuit Design
Analog Circuit Design

Author: Johan Huijsing

Publisher: Springer Science & Business Media

Published: 2013-03-09

Total Pages: 410

ISBN-13: 1475729839

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This volume of Analog Circuit Design concentrates on three topics: Volt Electronics; Design and Implementation of Mixed-Mode Systems; Low-Noise and RF Power Amplifiers for Telecommunication. The book comprises six papers on each topic written by internationally recognised experts. These papers are tutorial in nature and together make a substantial contribution to improving the design of analog circuits. The book is divided into three parts: Part I, Volt Electronics, presents some of the circuit design challenges which are having to be met as the need for more electronics on a chip forces smaller transistor dimensions, and thus lower breakdown voltages. The papers cover techniques for 1-Volt electronics. Part II, Design and Implementation of Mixed-Mode Systems, deals with the various problems that are encountered in mixed analog-digital design. In the future, all integrated circuits are bound to contain both digital and analog sub-blocks. Problems such as substrate bounce and other substrate coupling effects cause deterioration in signal integrity. Both aspects of mixed-signal design have been addressed in this section and it illustrates that careful layout techniques embedded in a hierarchical design methodology can allow us to cope with most of the challenges presented by mixed analog-digital design. Part III, Low-noise and RF Power Amplifiers for Telecommunication, focuses on telecommunications systems. In these systems low-noise amplifiers are front-ends of receiver designs. At the transmitter part a high-performance, high-efficiency power amplifier is a critical design. Examples of both system parts are described in this section. Analog Circuit Design is an essential reference source for analog design engineers and researchers wishing to keep abreast with the latest developments in the field. The tutorial nature of the contributions also makes it suitable for use in an advanced course.