Handbook of Package Engineering, Third Edition
Handbook of Package Engineering, Third Edition

Author: Joseph F. Hanlon

Publisher: CRC Press

Published: 1998-04-23

Total Pages: 730

ISBN-13: 9781566763066

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Now in its third edition, the Handbook of Package Engineering is still considered the standard industry reference on packaging materials and engineering. This text is a useful source of information for anyone involved in packaging. Designed as a refresher on packaging fundamentals, this complete guide also provides information on recent changes in the materials and structures of packaging. It reviews the essentials of production - packaging operations, line layout, and the machines that are required in order to perform basic packaging functions. It introduces the increasing web of laws and regulations controlling virtually all packaged products.

Engineering Design Handbook. Packaging and Pack Engineering
Engineering Design Handbook. Packaging and Pack Engineering

Author: ARMY MATERIEL COMMAND ALEXANDRIA VA.

Publisher:

Published: 1972

Total Pages: 380

ISBN-13:

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This handbook covers engineering principles and fundamental data needed in the development of Army materiel, which (as a group) constitutes the Engineering Design Handbook Series of the Army Materiel Command. The handbook is a revision of the one published in 1964. Included in this handbook are the fundamental principles, policies, and limitations of military packaging and pack engineering. Also included is information concerning basic causes of deterioration, methods of preservation, types of preservatives and packaging materials available, natural and transportation environment encountered, cost and human engineering factors, distribution system limitations, and other special military packaging considerations. All chapters of the handbook have been revised and updated to include the latest packaging engineering developments. Three new chapters have been added in the areas of exterior protection, marking, and testing and inspection. Design parameters for military packaging differ importantly from those required for commercial efforts. The primary intention of this handbook is to serve as an introduction to military packaging and pack engineering. A major portion of the text is devoted to a broad treatment of the subject, emphasizing the why of military packaging and directing the user to other authoritative publications for information on how to perform specific engineering tasks. (P.S.-PL).

Handbook Of Electronics Packaging Design and Engineering
Handbook Of Electronics Packaging Design and Engineering

Author: Bernard S. Matisoff

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 480

ISBN-13: 9401169799

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The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: • Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. • Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. • Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.

The Electronic Packaging Handbook
The Electronic Packaging Handbook

Author: Glenn R. Blackwell

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 638

ISBN-13: 1420049844

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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Handbook of Electronic Package Design
Handbook of Electronic Package Design

Author: Michael Pecht

Publisher: CRC Press

Published: 2018-10-24

Total Pages: 904

ISBN-13: 1351838415

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Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development