Energy Dispersive X-ray Analysis in the Electron Microscope
Energy Dispersive X-ray Analysis in the Electron Microscope

Author: DC Bell

Publisher: Garland Science

Published: 2003-07-10

Total Pages: 270

ISBN-13: 1135331391

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This book provides an in-depth description of x-ray microanalysis in the electron microscope. It is sufficiently detailed to ensure that novices will understand the nuances of high-quality EDX analysis. Includes information about hardware design as well as the physics of x-ray generation, absorption and detection, and most post-detection data processing. Details on electron optics and electron probe formation allow the novice to make sensible adjustments to the electron microscope in order to set up a system which optimises analysis. It also helps the reader determine which microanalytical method is more suitable for their planned application.

Scanning Electron Microscopy and X-Ray Microanalysis
Scanning Electron Microscopy and X-Ray Microanalysis

Author: Joseph Goldstein

Publisher: Springer Science & Business Media

Published: 2013-11-11

Total Pages: 679

ISBN-13: 1461332737

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This book has evolved by processes of selection and expansion from its predecessor, Practical Scanning Electron Microscopy (PSEM), published by Plenum Press in 1975. The interaction of the authors with students at the Short Course on Scanning Electron Microscopy and X-Ray Microanalysis held annually at Lehigh University has helped greatly in developing this textbook. The material has been chosen to provide a student with a general introduction to the techniques of scanning electron microscopy and x-ray microanalysis suitable for application in such fields as biology, geology, solid state physics, and materials science. Following the format of PSEM, this book gives the student a basic knowledge of (1) the user-controlled functions of the electron optics of the scanning electron microscope and electron microprobe, (2) the characteristics of electron-beam-sample inter actions, (3) image formation and interpretation, (4) x-ray spectrometry, and (5) quantitative x-ray microanalysis. Each of these topics has been updated and in most cases expanded over the material presented in PSEM in order to give the reader sufficient coverage to understand these topics and apply the information in the laboratory. Throughout the text, we have attempted to emphasize practical aspects of the techniques, describing those instru ment parameters which the microscopist can and must manipulate to obtain optimum information from the specimen. Certain areas in particular have been expanded in response to their increasing importance in the SEM field. Thus energy-dispersive x-ray spectrometry, which has undergone a tremendous surge in growth, is treated in substantial detail.

Analytical Electron Microscopy for Materials Science
Analytical Electron Microscopy for Materials Science

Author: DAISUKE Shindo

Publisher: Springer Science & Business Media

Published: 2013-04-17

Total Pages: 162

ISBN-13: 4431669884

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Analytical electron microscopy is one of the most powerful tools today for characterization of the advanced materials that support the nanotechnology of the twenty-first century. In this book the authors clearly explain both the basic principles and the latest developments in the field. In addition to a fundamental description of the inelastic scattering process, an explanation of the constituent hardware is provided. Standard quantitative analytical techniques employing electron energy-loss spectroscopy and energy-dispersive X-ray spectroscopy are also explained, along with elemental mapping techniques. Included are sections on convergent beam electron diffraction and electron holography utilizing the field emission gun. With generous use of illustrations and experimental data, this book is a valuable resource for anyone concerned with materials characterization, electron microscopy, materials science, crystallography, and instrumentation.

Failure Analysis of Integrated Circuits
Failure Analysis of Integrated Circuits

Author: Lawrence C. Wagner

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 256

ISBN-13: 1461549191

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This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

Energy Dispersive Spectrometry of Common Rock Forming Minerals
Energy Dispersive Spectrometry of Common Rock Forming Minerals

Author: Kenneth P. Severin

Publisher: Springer Science & Business Media

Published: 2008-01-18

Total Pages: 228

ISBN-13: 1402028415

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This book provides a very basic introduction to electron microscopy and energy dispersive spectrometry (EDS). It has the largest compiled collection of EDS spectra ever published and covers most common rock forming minerals. In addition, it provides a key to help the novice wade through the large number of spectra.

Handbook of Sample Preparation for Scanning Electron Microscopy and X-Ray Microanalysis
Handbook of Sample Preparation for Scanning Electron Microscopy and X-Ray Microanalysis

Author: Patrick Echlin

Publisher: Springer Science & Business Media

Published: 2011-04-14

Total Pages: 329

ISBN-13: 0387857311

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Scanning electr on microscopy (SEM) and x-ray microanalysis can produce magnified images and in situ chemical information from virtually any type of specimen. The two instruments generally operate in a high vacuum and a very dry environment in order to produce the high energy beam of electrons needed for imaging and analysis. With a few notable exceptions, most specimens destined for study in the SEM are poor conductors and composed of beam sensitive light elements containing variable amounts of water. In the SEM, the imaging system depends on the specimen being sufficiently electrically conductive to ensure that the bulk of the incoming electrons go to ground. The formation of the image depends on collecting the different signals that are scattered as a consequence of the high energy beam interacting with the sample. Backscattered electrons and secondary electrons are generated within the primary beam-sample interactive volume and are the two principal signals used to form images. The backscattered electron coefficient ( ? ) increases with increasing atomic number of the specimen, whereas the secondary electron coefficient ( ? ) is relatively insensitive to atomic number. This fundamental diff- ence in the two signals can have an important effect on the way samples may need to be prepared. The analytical system depends on collecting the x-ray photons that are generated within the sample as a consequence of interaction with the same high energy beam of primary electrons used to produce images.

Advanced Scanning Electron Microscopy and X-Ray Microanalysis
Advanced Scanning Electron Microscopy and X-Ray Microanalysis

Author: Patrick Echlin

Publisher: Springer Science & Business Media

Published: 2013-06-29

Total Pages: 463

ISBN-13: 1475790279

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This book has its origins in the intensive short courses on scanning elec tron microscopy and x-ray microanalysis which have been taught annually at Lehigh University since 1972. In order to provide a textbook containing the materials presented in the original course, the lecturers collaborated to write the book Practical Scanning Electron Microscopy (PSEM), which was published by Plenum Press in 1975. The course con tinued to evolve and expand in the ensuing years, until the volume of material to be covered necessitated the development of separate intro ductory and advanced courses. In 1981 the lecturers undertook the project of rewriting the original textbook, producing the volume Scan ning Electron Microscopy and X-Ray Microanalysis (SEMXM). This vol ume contained substantial expansions of the treatment of such basic material as electron optics, image formation, energy-dispersive x-ray spectrometry, and qualitative and quantitative analysis. At the same time, a number of chapters, which had been included in the PSEM vol ume, including those on magnetic contrast and electron channeling con trast, had to be dropped for reasons of space. Moreover, these topics had naturally evolved into the basis of the advanced course. In addition, the evolution of the SEM and microanalysis fields had resulted in the devel opment of new topics, such as digital image processing, which by their nature became topics in the advanced course.

Electron Microprobe Analysis and Scanning Electron Microscopy in Geology
Electron Microprobe Analysis and Scanning Electron Microscopy in Geology

Author: S. J. B. Reed

Publisher: Cambridge University Press

Published: 2005-08-25

Total Pages: 232

ISBN-13: 113944638X

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Originally published in 2005, this book covers the closely related techniques of electron microprobe analysis (EMPA) and scanning electron microscopy (SEM) specifically from a geological viewpoint. Topics discussed include: principles of electron-target interactions, electron beam instrumentation, X-ray spectrometry, general principles of SEM image formation, production of X-ray 'maps' showing elemental distributions, procedures for qualitative and quantitative X-ray analysis (both energy-dispersive and wavelength-dispersive), the use of both 'true' electron microprobes and SEMs fitted with X-ray spectrometers, and practical matters such as sample preparation and treatment of results. Throughout, there is an emphasis on geological aspects not mentioned in similar books aimed at a more general readership. The book avoids unnecessary technical detail in order to be easily accessible, and forms a comprehensive text on EMPA and SEM for geological postgraduate and postdoctoral researchers, as well as those working in industrial laboratories.

Compendium of Surface and Interface Analysis
Compendium of Surface and Interface Analysis

Author: The Surface Science Society of Japan

Publisher: Springer

Published: 2018-02-19

Total Pages: 807

ISBN-13: 9811061564

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This book concisely illustrates the techniques of major surface analysis and their applications to a few key examples. Surfaces play crucial roles in various interfacial processes, and their electronic/geometric structures rule the physical/chemical properties. In the last several decades, various techniques for surface analysis have been developed in conjunction with advances in optics, electronics, and quantum beams. This book provides a useful resource for a wide range of scientists and engineers from students to professionals in understanding the main points of each technique, such as principles, capabilities and requirements, at a glance. It is a contemporary encyclopedia for selecting the appropriate method depending on the reader's purpose.

Solder Joint Reliability
Solder Joint Reliability

Author: John H. Lau

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 649

ISBN-13: 1461539102

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Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.