Handbook of Semiconductor Manufacturing Technology
Handbook of Semiconductor Manufacturing Technology

Author: Yoshio Nishi

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 1720

ISBN-13: 1420017667

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Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Electrochemistry in Mineral and Metal Processing VI
Electrochemistry in Mineral and Metal Processing VI

Author: Fiona M. Doyle

Publisher: The Electrochemical Society

Published: 2003

Total Pages: 458

ISBN-13: 9781566774017

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"The sixth International Symposium on Electrochemistry in Mineral and Metal Processing was held during the 2003rd Meeting of the Electrochemical Society, Inc., in Paris, France, May 14-18, 2003."--p. iii.

Electrochemical Technology Applications in Electronics
Electrochemical Technology Applications in Electronics

Author: Lubomyr Taras Romankiw

Publisher: The Electrochemical Society

Published: 2000

Total Pages: 452

ISBN-13: 9781566772570

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The symposium was jointly held by the US and Japanese societies, but drew participants from companies, universities, and research institutes in 12 countries. The 47 papers cover high density packaging and related technologies, electronic devices and related materials and processes, micro-electromechanical systems and microfabrication, magnetic materials and devices, and fundamental studies on the materials for electrochemical technology applications. Nearly half of them, 23, were invited. Annotation copyrighted by Book News Inc., Portland, OR.

Introduction to Microfabrication
Introduction to Microfabrication

Author: Sami Franssila

Publisher: John Wiley & Sons

Published: 2005-01-28

Total Pages: 424

ISBN-13: 0470020563

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Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.

Reliability Wearout Mechanisms in Advanced CMOS Technologies
Reliability Wearout Mechanisms in Advanced CMOS Technologies

Author: Alvin W. Strong

Publisher: John Wiley & Sons

Published: 2009-10-13

Total Pages: 642

ISBN-13: 047045525X

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This invaluable resource tells the complete story of failure mechanisms—from basic concepts to the tools necessary to conduct reliability tests and analyze the results. Both a text and a reference work for this important area of semiconductor technology, it assumes no reliability education or experience. It also offers the first reference book with all relevant physics, equations, and step-by-step procedures for CMOS technology reliability in one place. Practical appendices provide basic experimental procedures that include experiment design, performing stressing in the laboratory, data analysis, reliability projections, and interpreting projections.

Handbook of 3D Integration, Volume 1
Handbook of 3D Integration, Volume 1

Author: Philip Garrou

Publisher: John Wiley & Sons

Published: 2011-09-22

Total Pages: 798

ISBN-13: 352762306X

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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.