Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems.
Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today’s cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
This comprehensive and unique book is intended to cover the vast and fast-growing field of electrical and electronic materials and their engineering in accordance with modern developments. Basic and pre-requisite information has been included for easy transition to more complex topics. Latest developments in various fields of materials and their sciences/engineering, processing and applications have been included. Latest topics like PLZT, vacuum as insulator, fiber-optics, high temperature superconductors, smart materials, ferromagnetic semiconductors etc. are covered. Illustrations and examples encompass different engineering disciplines such as robotics, electrical, mechanical, electronics, instrumentation and control, computer, and their inter-disciplinary branches. A variety of materials ranging from iridium to garnets, microelectronics, micro alloys to memory devices, left-handed materials, advanced and futuristic materials are described in detail.
Mechanical and thermal properties are reviewed and electrical and magnetic properties are emphasized. Basics of symmetry and internal structure of crystals and the main properties of metals, dielectrics, semiconductors, and magnetic materials are discussed. The theory and modern experimental data are presented, as well as the specifications of materials that are necessary for practical application in electronics. The modern state of research in nanophysics of metals, magnetic materials, dielectrics and semiconductors is taken into account, with particular attention to the influence of structure on the physical properties of nano-materials. The book uses simplified mathematical treatment of theories, while emphasis is placed on the basic concepts of physical phenomena in electronic materials. Most chapters are devoted to the advanced scientific and technological problems of electronic materials; in addition, some new insights into theoretical facts relevant to technical devices are presented. Electronic Materials is an essential reference for newcomers to the field of electronics, providing a fundamental understanding of important basic and advanced concepts in electronic materials science. Provides important overview of the fundamentals of electronic materials properties significant for device applications along with advanced and applied concepts essential to those working in the field of electronics Takes a simplified and mathematical approach to theories essential to the understanding of electronic materials and summarizes important takeaways at the end of each chapter Interweaves modern experimental data and research in topics such as nanophysics, nanomaterials and dielectrics
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. - Reviews the properties and production of various flexible organic materials. - Describes the integration technologies of flexible organic electronics and their manufacturing methods. - Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.
The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: • Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. • Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. • Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.
This book is for people involved in working with plastic material and plastic fabricating processes. The information and data in this book are provided as a comparative guide to help in understanding the performance of plastics and in making the decisions that must be made when developing a logical approach to fabricating plastic products to meet performance requirements at the lowest costs. It is formatted to allow for easy reader access and this care has been translated into the individual chapter constructions and index. This book makes very clear the behaviour of the 35,000 different plastics with the different behaviours of the hundreds of processes. Products reviewed range from toys to medical devices, to cars, to boats, to underwater devices, containers, springs, pipes, aircraft and spacecraft. The reader's product to be designed and/or fabricated can be directly or indirectly related to plastic materials, fabricating processes and/or product design reviews in this book.*Essential for people involved in working with plastic material and plastic fabricating processes *Will help readers understand the performance of plastics *Helps readers to make decisions which meet performance requirements and to keep costs low
This reference book makes it easy for anyone involved in materials selection, or in the design and manufacture of metallic structural components to quickly screen materials for a particular application. Information on practically all ferrous and nonferrous metals including powder metals is presented in tabular form for easy review and comparison between different materials. Included are chemical compositions, physical and mechanical properties, manufacturing processes, applications, pertinent specifications and standards, and test methods. Contents Overview: Glossary of metallurgical terms Selection of structural materials (specifications and standards, life cycle and failure modes, materials properties and design, and properties and applications) Physical data on the elements and alloys Testing and inspection Chemical composition and processing characteristics
