“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Both solid knowledge of the basics as well as expert knowledge is needed to create rigid, long-lasting and material-specific adhesions in the industrial or trade sectors. Information that is extremely difficult and time-consuming to find in the current literature. Written by specialists in various disciplines from both academia and industry, this handbook is the very first to provide such comprehensive knowledge in a compact and well-structured form. Alongside such traditional fields as the properties, chemistry and characteristic behavior of adhesives and adhesive joints, it also treats in detail current practical questions and the manifold applications for adhesives.
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
This book discusses applications of adhesives and adhesive joints in different branches of industry. The properties of adhesives and adhesive joints, and also the requirements of mechanical properties and chemical and environmental resistance of adhesives and adhesive joints, are very important because proper strength, durability, and time of use are all factors that are dependent on the type of industry. The aim of this book is to present information on the type of adhesives and adhesive joints, in addition to their characteristics, used in different branches of industry. This information should enable scientists, engineers, and designers to acquire knowledge of adhesives and adhesive joints, which could be helpful in selecting the right type of adhesive and adhesive joint to make applications for a particular industry.
This volume contains selected and reviewed manuscripts from the 2nd Regional Conference on Mechanical and Marine Engineering (ReMME 2018), ‘Sustainable Through Engineering,’ which was held from November 7 to 9, 2018, at the Ipoh, Perak, Malaysia. This conference was organized by the Center of Refrigeration and Air Conditioning (CARe) and Center of Marine Engineering (CTME) Politeknik Ungku Omar, Jalan Raja Musa Mahadi, 31400 Ipoh, Perak. It discusses the expertise, skills, and techniques needed for the development of energy and renewable energy system, new materials and biomaterials, and marine technology. It focuses on finite element analysis, computational fluids dynamics, programming and mathematical methods that are used for engineering simulations, and present many state-of-the-art applications. For example, modern joining technologies can be used to fabricate new compound or composite materials, even those formed from dissimilar component materials. These composite materials are often exposed to harsh environments, must deliver specific characteristics, and are primarily used in automotive and marine technologies, i.e., ships, amphibious vehicles, docks, offshore structures, and even robots. An energy efficient methods such cogeneration, thermal energy storage and solar desalination also being highlighted as sustainable engineering in this book chapter. The committee members can be listed as follows: Patron:Dr. Hj. Zairon Mustapha (Director). Advisor: Muhmmad Zubir Mohd Hanifah (Deputy Director Academic), Dr. Azhar Abdullah (Head of Innovation, Research & Commercialization). Chairman 1: Dr. Adzuieen Nordin. Chairman 2: Hairi Haizri Che Amat. Secretariat 1: Dr. Woo Tze Keong. Secretariat 2: Dr. Saw Chun Lin. Secretary: Mahani Mohd Zamberi, Maslinda Rahmad. Floor Manager: Dr. Adzuieen Nordin, Marzuki Mohammad Treasurer: Shahrul Nahar Omar Kamal. Webmaster: Mohamad Asyraf Othoman, Mohd Assidiq Che Ahmad, Mohd Hashim Abd. Razak. Proceeding & Editorial: Didi Asmara Salim, Khairil Ashraf Ahmad Maliki, Khirwizam Md Hkhir. Publicity: Nur Azrina Zainal Ariff, Norsheila Buyamin, Rawaida Muhammad, Noor Khairunnisa Kamaruddin. Reviewer: Zakiman Zali, Shahril Jalil. Technical Manager: Mohd Faisol Saad. Springer Publication Editorial: Dr. Saw Chun Lin, Dr. Woo Tze Keong, Didi Asmara Salim, Dr. Salvinder Singh Karam Singh. Protocol & Opening Ceremony: Mohd Rizan Abdul, Yeoh Poh See. Souvenir: Sharifah Zainhuda Syed Tajul Ariffin. Registration: Muhammad Zaki Zainal, Adi Firdaus Hat, Nor Ashimy Mohd Noor, Mohd Naim Awang. Proofread: Shamsul Banu Mohamed Siddik, Fairuz Liza Shuhaimi. Logistics: Mohd Zulhairi Zulkipli, Ahmad Fithri Hasyimie Hashim. Multimedia: Muhammad Redzuan Che Noordin, Mohd Redzuwan Danuri, Ahmad Syawal Yeop Aziz. Liason: Roseazah Ramli, Amrul Zani Mahadi. Sponsorship: Zuraini Gani, Hazril Hisham Hussin.
