In recent years, research on microelectronics has been specifically focused on the proposition of efficient alternative methodologies and materials to fabricate feasible integrated circuits. This book provides a general background of thin film transistors and their simulations and constructions. The contents of the book are broadly classified into two topics: design and simulation of FETs and construction of FETs. All the authors anticipate that the provided chapters will act as a single source of reference for the design, simulation and construction of FETs. This edited book will help microelectronics researchers with their endeavors and would be a great addition to the realm of semiconductor physics.
This book covers the physical principles, modelling, fabrication and applications of Tunnel Field Effect Transistors (TFETs) and Fin Field Effect Transistors (FinFETs). This is intended to act as a reference for undergraduate, postgraduate and research scholars belonging to backgrounds of Applied Physics, Electrical and Electronics Engineering and Material Science. Of paramount importance is the need to understand the simulation aspects of these devices, the validity of mathematical models, basics on fabrication and details of applications of these nanoscale devices. The presentation of the book assumes that the reader has fundamental concepts of semiconductor device physics and electronic circuits. A course such as the one this book is intended to accompany and motivate both students and scholars to get involved in the research on TFETs and FinFETs. Further, this book can act as a reference for device engineers and scientists who need to get updated information on device and technological developments.
This book gives insight into the emerging semiconductor devices from their applications in electronic circuits. It discusses the challenges in the field of engineering and applications of advanced low-power devices. Emerging Low-Power Semiconductor Devices: Applications for Future Technology Nodes offers essential exposure to low-power devices, and applications in wireless, biosensing, and circuit domains. This book provides a detailed discussion on all aspects, including the current and future scenarios related to the low-power device. The book also presents basic knowledge about field-effect transistor (FET) devices and introduces emerging and novel FET devices. The chapters include a review of the usage of FET devices in various domains like biosensing, wireless, and cryogenics applications. The chapters also explore device-circuit co-design issues in the digital and analog domains. The content is presented in an easy-to-follow manner that makes it ideal for individuals new to the subject. This book is intended for scientists, researchers, and postgraduate students looking for an understanding of device physics, circuits, and systems.
This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditional design methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.
This book focusses on recent advances and different research issues in the biosensor technology and also presents theoretical, methodological, well-established and validated empirical work dealing with the technology. The book addresses challenges for the development of a point-of-care test platform. The book also describes printed chip-based assay (Lab-on-a-Chip, Lab-on-a-PCB) for rapid, inexpensive, multiplex detection of disease biomarkers in real samples. It aims to overcome existing barriers for Lab-on-a-Chip commercialization (lack of cost effective mass manufacturing methods, self-contained, fully autonomous operation and user-friendliness). Different advanced techniques including electrochemical, optical, mass, colorimetric and signal amplification strategies describe early stage disease diagnosis. The book gathers scientific and technological novelties and advancements already developed or under development in the academic and research communities. It covers a vast audience from basic science to engineering and technology experts and learners.
In recent years, research on microelectronics has been specifically focused on the proposition of efficient alternative methodologies and materials to fabricate feasible integrated circuits. This book provides a general background of thin film transistors and their simulations and constructions. The contents of the book are broadly classified into two topics: design and simulation of FETs and construction of FETs. All the authors anticipate that the provided chapters will act as a single source of reference for the design, simulation and construction of FETs. This edited book will help microelectronics researchers with their endeavors and would be a great addition to the realm of semiconductor physics.
Metallurgy is a field of material science and engineering that studies the chemical and physical behavior of metallic elements, intermetallic compounds, and their mixtures, which are called alloys. These metals are widely used in this kind of engineering because they have unique combinations of mechanical properties (strength, toughness, and ductility) as well as special physical characteristics (thermal and electrical conductivity), which cannot be achieved with other materials. In addition to thousands of traditional alloys, many exciting new materials are under development for modern engineering applications. Metallurgical engineering is an area concerned extracting minerals from raw materials and developing, producing, and using mineral materials. It is based on the principles of science and engineering, and can be divided into mining processes, which are concerned with the extraction of metals from their ores to make refined alloys, and physical metallurgy, which includes the fabrication, alloying, heat treatment, joining and welding, corrosion protection, and different testing methods of metals. Conventional metal forming/shaping techniques include casting and forging, which remains an important processing route. Electrodeposition is one of the most used methods for metal and metallic alloy film preparation in many technological processes. Alloy metal coatings offer a wider range of properties than those obtained by a single metal film and can be applied to improve the properties of the substrate/coating system. This book covers a wide range of topics related to recent advancements in metallurgical engineering and electrodeposition such as metallurgy forming, structure, microstructure properties, testing and characterizations, and electrodeposition techniques. It also highlights the progress of metallurgical engineering, the ferrous and non-ferrous materials industries, and the electrodeposition of nanomaterials and composites.
The field of organic electronics spans a very wide range of disciplines from physics and chemistry to hardware and software engineering. This makes the field of organic circuit design a daunting prospect full of intimidating complexities, yet to be exploited to its true potential. Small focussed research groups also find it difficult to move beyond their usual boundaries and create systems-on-foil that are comparable with the established silicon world.This book has been written to address these issues, intended for two main audiences; firstly, physics or materials researchers who have thus far designed circuits using only basic drawing software; and secondly, experienced silicon CMOS VLSI design engineers who are already knowledgeable in the design of full custom transistor level circuits but are not familiar with organic devices or thin film transistor (TFT) devices.In guiding the reader through the disparate and broad subject matters, a concise text has been written covering the physics and chemistry of the materials, the derivation of the transistor models, the software construction of the simulation compact models, and the engineering challenges of a right-first-time design flow, with notes and references to the current state-of-the-art advances and publications. Real world examples of simulation models, circuit designs, fabricated samples and measurements have also been given demonstrating how the theory can be used in applications.
This book is a comprehensive exposition of FET modeling, and is a must-have resource for seasoned professionals and new graduates in the RF and microwave power amplifier design and modeling community. In it, you will find descriptions of characterization and measurement techniques, analysis methods, and the simulator implementation, model verification and validation procedures that are needed to produce a transistor model that can be used with confidence by the circuit designer. Written by semiconductor industry professionals with many years' device modeling experience in LDMOS and III-V technologies, this was the first book to address the modeling requirements specific to high-power RF transistors. A technology-independent approach is described, addressing thermal effects, scaling issues, nonlinear modeling, and in-package matching networks. These are illustrated using the current market-leading high-power RF technology, LDMOS, as well as with III-V power devices.
