Driven by the demand for high-data-rate, millimeter wave technologies with broad bandwidth are being explored in high-speed wireless communications. These technologies include gigabit wireless personal area networks (WPAN), high-speed wireless local area networks (WLAN), and high-speed wireless metropolitan area networks (WMAN). As a result of this
Learn the fundamentals of integrated communication microsystems Advanced communication microsystems—the latest technology to emerge in the semiconductor sector after microprocessors—require integration of diverse signal processing blocks in a power-efficient and cost-effective manner. Typically, these systems include data acquisition, data processing, telemetry, and power management. The overall development is a synergy among system, circuit, and component-level designs with a strong emphasis on integration. This book is targeted at students, researchers, and industry practitioners in the semiconductor area who require a thorough understanding of integrated communication microsystems from a developer's perspective. The book thoroughly and carefully explores: Fundamental requirements of communication microsystems System design and considerations for wired and wireless communication microsystems Advanced block-level design techniques for communication microsystems Integration of communication systems in a hybrid environment Packaging considerations Power and form factor trade-offs in building integrated microsystems Advanced Integrated Communication Microsystems is an ideal textbook for advanced undergraduate and graduate courses. It also serves as a valuable reference for researchers and practitioners in circuit design for telecommunications and related fields.
Recent developments in soft-computation techniques have paved the way for handling huge volumes of data, thereby bringing about significant changes and technological advancements. This book presents the proceedings of the 3rd International Conference on Emerging Current Trends in Computing & Expert Technology (COMET 2020), held at Panimalar Engineering College, Chennai, India on 6 and 7 March 2020. The aim of the book is to disseminate cutting-edge developments taking place in the technological fields of intelligent systems and computer technology, thereby assisting researchers and practitioners from both institutions and industry to upgrade their knowledge of the latest developments and emerging areas of study. It focuses on technological innovations and trendsetting initiatives to improve business values, optimize business processes and enable inclusive growth for corporates, industries and education alike. The book is divided into two sections; ‘Next Generation Soft Computing’ is a platform for scientists, researchers, practitioners and academics to present and discuss their most recent innovations, trends and concerns, as well as the practical challenges encountered in the field. The second section, ‘Evolutionary Networking and Communications’ focuses on various aspects of 5G communications systems and networking, including cloud and virtualization solutions, management technologies, and vertical application areas. It brings together the latest technologies from all over the world, and also provides an excellent international forum for the sharing of knowledge and results from theory, methodology and applications in networking and communications. The book will be of interest to all those working in the fields of intelligent systems and computer technology.
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References
For the new millenium, Wai-Kai Chen introduced a monumental reference for the design, analysis, and prediction of VLSI circuits: The VLSI Handbook. Still a valuable tool for dealing with the most dynamic field in engineering, this second edition includes 13 sections comprising nearly 100 chapters focused on the key concepts, models, and equations. Written by a stellar international panel of expert contributors, this handbook is a reliable, comprehensive resource for real answers to practical problems. It emphasizes fundamental theory underlying professional applications and also reflects key areas of industrial and research focus. WHAT'S IN THE SECOND EDITION? Sections on... Low-power electronics and design VLSI signal processing Chapters on... CMOS fabrication Content-addressable memory Compound semiconductor RF circuits High-speed circuit design principles SiGe HBT technology Bipolar junction transistor amplifiers Performance modeling and analysis using SystemC Design languages, expanded from two chapters to twelve Testing of digital systems Structured for convenient navigation and loaded with practical solutions, The VLSI Handbook, Second Edition remains the first choice for answers to the problems and challenges faced daily in engineering practice.
This exciting new book examines the feasibility of using a method of doubling the capacity of cellular networks by simultaneously transmitting and receiving signals at the same frequency, a process known as full duplexing (FD). To realize full duplexing, changes in the hardware of the cell- base stations, relaying equipment, “hot spot” access points and mobile phones are necessary to prevent the hardware’s transmitters from interfering with their own receivers. This requires looking at how to separate the strong transmitted signal from the very weak received signal, a process requiring both hardware (analog) changes and more complex digital signal processing. Different ways of achieving that goal are examined. The books reviews the merits of hardware changes involving new duplexing components that may be different depending on the frequency band and cell hardware being used. Developing full duplex (FD) systems in 5G LTE cellular communications and what can be achieved with ferrite-based circulators in terms of size reduction and performance enhancement, especially at millimetric frequencies, is considered. The relative merits of ferrite and non-ferrite circulators are compared in terms of their fundamental materials and device technologies, such as isolation, insertion loss, bandwidth and non-linearity. FD in the entire 5G cell is also examined and its resulting range of equipment and device communication. This includes front-hauling, more sophisticated back and front-hauling, backhaul beam switching, and cell extenders and relays, all of which could involve FD.
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Mobile and wireless communications applications have a clear impact on improving the humanity wellbeing. From cell phones to wireless internet to home and office devices, most of the applications are converted from wired into wireless communication. Smart and advanced wireless communication environments represent the future technology and evolutionary development step in homes, hospitals, industrial, vehicular and transportation systems. A very appealing research area in these environments has been the wireless ad hoc, sensor and mesh networks. These networks rely on ultra low powered processing nodes that sense surrounding environment temperature, pressure, humidity, motion or chemical hazards, etc. Moreover, the radio frequency (RF) transceiver nodes of such networks require the design of transmitter and receiver equipped with high performance building blocks including antennas, power and low noise amplifiers, mixers and voltage controlled oscillators. Nowadays, the researchers are facing several challenges to design such building blocks while complying with ultra low power consumption, small area and high performance constraints. CMOS technology represents an excellent candidate to facilitate the integration of the whole transceiver on a single chip. However, several challenges have to be tackled while designing and using nanoscale CMOS technologies and require innovative idea from researchers and circuits designers. While major researchers and applications have been focusing on RF wireless communication, optical wireless communication based system has started to draw some attention from researchers for a terrestrial system as well as for aerial and satellite terminals. This renewed interested in optical wireless communications is driven by several advantages such as no licensing requirements policy, no RF radiation hazards, and no need to dig up roads besides its large bandwidth and low power consumption. This second part of the book, Mobile and Wireless Communications: Key Technologies and Future Applications, covers the recent development in ad hoc and sensor networks, the implementation of state of the art of wireless transceivers building blocks and recent development on optical wireless communication systems. We hope that this book will be useful for students, researchers and practitioners in their research studies.
This book presents the proceedings of the 6th International Conference on Electrical, Control and Computer Engineering (InECCE 2021), held in Kuantan, Pahang, Malaysia, on 23 August 2021. The topics covered are sustainable energy, power electronics and drives and power engineering including distributed/renewable generation, power system optimization, artificial/computational intelligence, smart grid, power system protection and machine learning energy management and conservation. The book showcases some of the latest technologies and applications developed to solve local energy and power problems in order to ensure continuity, reliability and security of electricity for future generations. It also links topics covered the sustainable developed goals (SDGs) areas outlined by the United Nation for global sustainability. The book will appeal to professionals, scientists and researchers with experience in industry.
